頁 4 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
MIKROE-231	MikroElektronika	SOCKET ADAPTER AT90PWM2 TO 40DIP Convert From (Adapter End): AT90PWM2 Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存8,082	DIP	40	-	-	-	-	-	-	-	-
95-100I25	Aries Electronics	SOCKET ADAPTER QFP TO 100PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 100 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,376	PGA	100	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
MIKROE-230	MikroElektronika	SOCKET ADAPTER AT90PWM1 TO 40DIP Convert From (Adapter End): AT90PWM1 Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存2,106	DIP	40	-	-	-	-	-	-	-	-
1111163	Aries Electronics	SOCKET ADAPTER SOCKET TO 40PLCC Convert From (Adapter End): Socket, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): PLCC Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: FR4 Epoxy Glass	封裝: -	庫存3,078	PLCC	40	-	Gold	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass
68-652000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,398	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
160-306045-10	Aries Electronics	SOCKET ADAPTER QFP THRU HOLE Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存2,196	-	-	-	-	-	-	-	-	-	-
44-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,258	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
PA-TS1D6SM18-56	Logical Systems Inc.	ADAPTER 56TSOP TO 56DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP Number of Pins: 56 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,434	DIP	56	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
20-353000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 20DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,694	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-650000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,322	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
240-1280-39-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,950	-	-	-	-	-	-	-	-	-	-
228-1290-09-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存3,562	DIP, 0.4" (10.16mm) Row Spacing	28	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
08-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 8SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,348	SOIC	8	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-354W00-10	Aries Electronics	CONN ADAPTER 14PIN DIP TO SOWIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存5,940	SOWIC	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
12-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 12DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存8,802	DIP, 0.3" (7.62mm) Row Spacing	12	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
28-665000-00	Aries Electronics	SCK ADAPT 28P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,012	SOIC	28	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
22-665000-00	Aries Electronics	SCK ADAPT 22P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,562	SOIC	22	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
18-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存6,156	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
1106396-14	Aries Electronics	SOCKET ADAPTER DIP TO 14DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存8,820	DIP, 0.6" (15.24mm) Row Spacing	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
1107254-08	Aries Electronics	SOCKET ADAPTER DIP TO 8DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,544	DIP, 0.3" (7.62mm) Row Spacing	8	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
PA-SSD3SM18-18	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 18DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,218	DIP	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-SSD3SM18-28	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 28DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,896	DIP	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
240-1280-29-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,704	-	-	-	-	-	-	-	-	-	-
28-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,496	DIP, 0.3" (7.62mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SSD6SM18-24	Logical Systems Inc.	ADAPTER 24TSSOP TO 24DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,472	DIP	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-SOIC32	Aries Electronics	SOCKET ADAPTER SOIC TO 32DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存4,734	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
32-650000-10	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.6 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存10,404	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存34,182	DIP, 0.3" (7.62mm) Row Spacing	16	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)

MIKROE-231

MikroElektronika

SOCKET ADAPTER AT90PWM2 TO 40DIP

Convert From (Adapter End): AT90PWM2
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存8,082

DIP

40

-

95-100I25

Aries Electronics

SOCKET ADAPTER QFP TO 100PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 100
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,376

PGA

100

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

MIKROE-230

MikroElektronika

SOCKET ADAPTER AT90PWM1 TO 40DIP

Convert From (Adapter End): AT90PWM1
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存2,106

DIP

40

-

1111163

Aries Electronics

SOCKET ADAPTER SOCKET TO 40PLCC

Convert From (Adapter End): Socket, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): PLCC
Number of Pins: 40
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,078

PLCC

40

-

Gold

-

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

68-652000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,398

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

160-306045-10

Aries Electronics

SOCKET ADAPTER QFP THRU HOLE

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存2,196

-

44-652000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,258

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

PA-TS1D6SM18-56

Logical Systems Inc.

ADAPTER 56TSOP TO 56DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP
Number of Pins: 56
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,434

DIP

56

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

20-353000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 20DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,694

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin-Lead

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

24-650000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,322

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

240-1280-39-0602J

3M

RECEPTACLE DIP SOCKET 40POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,950

-

228-1290-09-0602J

3M

RECEPTACLE DIP SOCKET 28POS .4"

Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存3,562

DIP, 0.4" (10.16mm) Row Spacing

28

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

08-354000-11-RC

Aries Electronics

SOCKET ADAPTER DIP TO 8SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 8
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,348

SOIC

8

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

14-354W00-10

Aries Electronics

CONN ADAPTER 14PIN DIP TO SOWIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Number of Pins: 14
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存5,940

SOWIC

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

12-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 12DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 12
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存8,802

DIP, 0.3" (7.62mm) Row Spacing

12

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

28-665000-00

Aries Electronics

SCK ADAPT 28P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,012

SOIC

28

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

22-665000-00

Aries Electronics

SCK ADAPT 22P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,562

SOIC

22

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

18-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存6,156

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

1106396-14

Aries Electronics

SOCKET ADAPTER DIP TO 14DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存8,820

DIP, 0.6" (15.24mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

1107254-08

Aries Electronics

SOCKET ADAPTER DIP TO 8DIP 0.3

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,544

DIP, 0.3" (7.62mm) Row Spacing

8

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

PA-SSD3SM18-18

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 18DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,218

DIP

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

PA-SSD3SM18-28

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 28DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,896

DIP

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

240-1280-29-0602J

3M

RECEPTACLE DIP SOCKET 40POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,704

-

28-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 28DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,496

DIP, 0.3" (7.62mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

PA-SSD6SM18-24

Logical Systems Inc.

ADAPTER 24TSSOP TO 24DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 24
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,472

DIP

24

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-SOIC32

Aries Electronics

SOCKET ADAPTER SOIC TO 32DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,734

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

32-650000-10

Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.6

Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存10,404

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

16-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存34,182

DIP, 0.3" (7.62mm) Row Spacing

16

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)