頁 3 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
97-68340	Aries Electronics	SOCKET ADAPTER QFP TO 144PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 144 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,902	PGA	144	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
68-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,280	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
290-1294-29-0602J	3M	RECEPTACLE DIP SOCKET 90POS .9" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存2,340	-	-	-	-	-	-	-	-	-	-
1109252	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,706	DIP, 0.6" (15.24mm) Row Spacing	28	-	-	Through Hole	Solder	0.070" (1.78mm)	Tin-Lead	-	FR4 Epoxy Glass
28-353000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,300	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 28SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存6,372	SOIC	28	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
PA-SOD6SM18-40	Logical Systems Inc.	ADAPTER 40SOIC TO 40DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存8,640	-	-	-	-	-	-	-	-	-	-
248-1282-09-0602J	3M	RECEPTACLE DIP SOCKET 48POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,760	-	-	-	-	-	-	-	-	-	-
222-3343-09-0602J	3M	SOCKET ADAPTER 22DIP TO 22DIP Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存3,312	DIP, 0.4" (10.16mm) Row Spacing	22	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
28-350002-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,518	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,258	DIP, 0.3" (7.62mm) Row Spacing	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 28DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,708	DIP, 0.3" (7.62mm) Row Spacing	28	-	-	Through Hole	Solder	0.050" (1.27mm)	Gold	-	FR4 Epoxy Glass
12-665000-00	Aries Electronics	SCK ADAPT 12P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,016	SOIC	12	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
20-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 20DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,784	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
08-301296-10	Aries Electronics	SOCKET ADAPTER SOIC TO TO-8 Convert From (Adapter End): SOIC Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,922	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
16-307349-11-RC-P (170 UP)	Aries Electronics	SOCKET ADAPTER PLCC TO 16DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,598	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
LCQT-QFP0.5-60	Aries Electronics	SOCKET ADAPTER MULT PKG TO 60QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 60 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存2,934	QFP	60	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
1107254-16	Aries Electronics	SOCKET ADAPTER DIP TO 16DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存7,218	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-350000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存3,834	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
32-450001-10	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.4 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,662	DIP, 0.4" (10.16mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	FR4 Epoxy Glass
214-3339-19-0602J	3M	RECEPTACLE DIP SOCKET 14POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,382	-	-	-	-	-	-	-	-	-	-
14-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 14DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,534	DIP, 0.3" (7.62mm) Row Spacing	14	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
240-1280-19-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,472	-	-	-	-	-	-	-	-	-	-
28-350002-10	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存9,156	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1109523	Aries Electronics	SOCKET ADAPTER DIP TO TO-8 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: FR4 Epoxy Glass	封裝: -	庫存6,132	JEDEC	8	0.100" (2.54mm)	Gold	Through Hole	Solder	-	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass
28-650000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,396	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
68-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 68PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,716	PGA	68	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD3SM18-16	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 16DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存15,780	DIP	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-

97-68340

Aries Electronics

SOCKET ADAPTER QFP TO 144PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 144
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,902

PGA

144

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

68-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,280

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

290-1294-29-0602J

3M

RECEPTACLE DIP SOCKET 90POS .9"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存2,340

-

1109252

Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,706

DIP, 0.6" (15.24mm) Row Spacing

28

-

Through Hole

Solder

0.070" (1.78mm)

Tin-Lead

-

FR4 Epoxy Glass

28-353000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,300

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

Tin-Lead

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

28-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 28
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存6,372

SOIC

28

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

PA-SOD6SM18-40

Logical Systems Inc.

ADAPTER 40SOIC TO 40DIP

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存8,640

-

248-1282-09-0602J

3M

RECEPTACLE DIP SOCKET 48POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,760

-

222-3343-09-0602J

3M

SOCKET ADAPTER 22DIP TO 22DIP

Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 22
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存3,312

DIP, 0.4" (10.16mm) Row Spacing

22

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

28-350002-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,518

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

24-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,258

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

28-35W000-11-RC

Aries Electronics

SOCKET ADAPT SOIC-W TO 28DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,708

DIP, 0.3" (7.62mm) Row Spacing

28

-

Through Hole

Solder

0.050" (1.27mm)

Gold

-

FR4 Epoxy Glass

12-665000-00

Aries Electronics

SCK ADAPT 12P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 12
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,016

SOIC

12

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

20-35W000-10

Aries Electronics

SOCKET ADAPT SOIC-W TO 20DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,784

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

08-301296-10

Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

Convert From (Adapter End): SOIC
Convert To (Adapter End): JEDEC
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,922

JEDEC

8

0.050" (1.27mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

16-307349-11-RC-P (170 UP)

Aries Electronics

SOCKET ADAPTER PLCC TO 16DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,598

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

LCQT-QFP0.5-60

Aries Electronics

SOCKET ADAPTER MULT PKG TO 60QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 60
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,934

QFP

60

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

1107254-16

Aries Electronics

SOCKET ADAPTER DIP TO 16DIP 0.3

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存7,218

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

14-350000-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存3,834

DIP, 0.3" (7.62mm) Row Spacing

14

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

32-450001-10

Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.4

Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,662

DIP, 0.4" (10.16mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

FR4 Epoxy Glass

214-3339-19-0602J

3M

RECEPTACLE DIP SOCKET 14POS .3"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,382

-

14-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 14DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,534

DIP, 0.3" (7.62mm) Row Spacing

14

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

240-1280-19-0602J

3M

RECEPTACLE DIP SOCKET 40POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,472

-

28-350002-10

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存9,156

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1109523

Aries Electronics

SOCKET ADAPTER DIP TO TO-8

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): JEDEC
Number of Pins: 8
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,132

JEDEC

8

0.100" (2.54mm)

Gold

Through Hole

Solder

-

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

28-650000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,396

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

68-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,716

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

PA-SOD3SM18-16

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 16DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存15,780

DIP

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-