頁 2 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
84-653000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 84DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,380	DIP, 0.6" (15.24mm) Row Spacing	84	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
48-6645-18	Aries Electronics	SOCKET ADAPTER TQFP TO 48DIP 0.6 Convert From (Adapter End): TQFP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 48 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,830	DIP, 0.6" (15.24mm) Row Spacing	48	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-56001	Aries Electronics	SOCKET ADAPTER QFP TO 169PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 169 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,158	PGA	169	0.025" (0.64mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
232-1285-39-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存2,196	-	-	-	-	-	-	-	-	-	-
240-3639-19-0602J	3M	RECEPTACLE DIP SOCKET 40POS 1.0" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,914	-	-	-	-	-	-	-	-	-	-
264-1300-29-0602J	3M	RECEPTACLE DIP SOCKET 64POS .8" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,140	-	-	-	-	-	-	-	-	-	-
16-651000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 16DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,982	DIP, 0.6" (15.24mm) Row Spacing	16	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1107254-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,762	DIP, 0.3" (7.62mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
224-5248-09-0602J	3M	RECEPTACLE DIP SOCKET 24POS .3" Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存6,012	DIP, 0.3" (7.62mm) Row Spacing	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
20-350001-11-RC	Aries Electronics	SOCKET ADAPTER SOJ TO 20DIP 0.3 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,412	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
68-505-110-P	Aries Electronics	SOCKET ADAPTER PLCC TO 68PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,470	PGA	68	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
18-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 18DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,902	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
44-505-111	Aries Electronics	SOCKET ADAPTER PLCC TO 44PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,982	PGA	44	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
32-354000-10	Aries Electronics	SOCKET ADAPTER DIP TO 32SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 32 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存7,524	SOIC	32	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 28PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,546	PGA	28	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.65-52	Aries Electronics	SOCKET ADAPTER MULT PKG TO 52QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 52 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存2,124	QFP	52	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
22-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 22DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存5,958	DIP, 0.3" (7.62mm) Row Spacing	22	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
LCQT-TSOP40-1	Aries Electronics	SOCKET ADAPTER TSOP TO 40DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存2,682	DIP, 0.6" (15.24mm) Row Spacing	40	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
228-4817-19-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存4,536	DIP, 0.4" (10.16mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
LCQT-QFP0.65-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存6,132	QFP	64	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
240-1280-09-0602J	3M	SOCKET ADAPTER 40DIP TO 40DIP Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存4,770	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
32-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,418	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 20DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,084	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
LCQT-QFP0.5-32	Aries Electronics	SOCKET ADAPTER MULT PKG TO 32QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存6,696	QFP	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
LCQT-TSOP32-1	Aries Electronics	SOCKET ADAPTER TSOP TO 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存5,328	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
LCQT-TSOP32	Aries Electronics	SOCKET ADAPTER TSOP 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存6,768	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
24-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存6,876	DIP, 0.3" (7.62mm) Row Spacing	24	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
24-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存16,356	DIP, 0.3" (7.62mm) Row Spacing	24	-	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)

84-653000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 84
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,380

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

48-6645-18

Aries Electronics

SOCKET ADAPTER TQFP TO 48DIP 0.6

Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 48
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,830

DIP, 0.6" (15.24mm) Row Spacing

48

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

97-56001

Aries Electronics

SOCKET ADAPTER QFP TO 169PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 169
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,158

PGA

169

0.025" (0.64mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

232-1285-39-0602J

3M

RECEPTACLE DIP SOCKET 32POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存2,196

-

240-3639-19-0602J

3M

RECEPTACLE DIP SOCKET 40POS 1.0"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,914

-

264-1300-29-0602J

3M

RECEPTACLE DIP SOCKET 64POS .8"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,140

-

16-651000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.6

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,982

DIP, 0.6" (15.24mm) Row Spacing

16

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1107254-40

Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,762

DIP, 0.3" (7.62mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

224-5248-09-0602J

3M

RECEPTACLE DIP SOCKET 24POS .3"

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存6,012

DIP, 0.3" (7.62mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

20-350001-11-RC

Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,412

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

68-505-110-P

Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,470

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

18-35W000-10

Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,902

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

44-505-111

Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,982

PGA

44

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

32-354000-10

Aries Electronics

SOCKET ADAPTER DIP TO 32SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 32
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存7,524

SOIC

32

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

28-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,546

PGA

28

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

LCQT-QFP0.65-52

Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 52
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,124

QFP

52

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

22-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存5,958

DIP, 0.3" (7.62mm) Row Spacing

22

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

LCQT-TSOP40-1

Aries Electronics

SOCKET ADAPTER TSOP TO 40DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,682

DIP, 0.6" (15.24mm) Row Spacing

40

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

228-4817-19-0602J

3M

RECEPTACLE DIP SOCKET 28POS .4"

Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存4,536

DIP, 0.4" (10.16mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

LCQT-QFP0.65-64

Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,132

QFP

64

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

240-1280-09-0602J

3M

SOCKET ADAPTER 40DIP TO 40DIP

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存4,770

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

32-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,418

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

20-35W000-11-RC

Aries Electronics

SOCKET ADAPT SOIC-W TO 20DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,084

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

LCQT-QFP0.5-32

Aries Electronics

SOCKET ADAPTER MULT PKG TO 32QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 32
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,696

QFP

32

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

LCQT-TSOP32-1

Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,328

DIP, 0.6" (15.24mm) Row Spacing

32

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

LCQT-TSOP32

Aries Electronics

SOCKET ADAPTER TSOP 32DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,768

DIP, 0.6" (15.24mm) Row Spacing

32

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

24-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存6,876

DIP, 0.3" (7.62mm) Row Spacing

24

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

24-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存16,356

DIP, 0.3" (7.62mm) Row Spacing

24

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)