頁 13 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件 | 黑森爾電子
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IC、電晶體用插槽 - 配接器

記錄 353
頁  13/13
圖片
零件編號
製造商
描述
封裝
庫存
數量
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
96-128M80
Aries Electronics

QFP TO PGA 128 PIN

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 128
  • Pitch - Mating: 0.031" (0.80mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存6,624
PGA
128
0.031" (0.80mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-652000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存8,802
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
32-650000-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.6

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存3,204
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
32-450001-10-P
Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.4

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存7,488
DIP, 0.4" (10.16mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
FR4 Epoxy Glass
28-653000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存3,060
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
32-655000-10
Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP 0.6

  • Convert From (Adapter End): TSOP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: Silver
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存4,932
DIP, 0.6" (15.24mm) Row Spacing
32
0.020" (0.50mm)
Silver
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 18
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封裝: -
庫存5,562
SOIC
18
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
44-305263-20
Aries Electronics

SOCKET ADAPTER QFP TO 44PLCC

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PLCC
  • Number of Pins: 44
  • Pitch - Mating: 0.024" (0.60mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存4,914
PLCC
44
0.024" (0.60mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
218-3341-09-0602J
3M

SOCKET ADAPTER 18DIP TO 18DIP

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
封裝: -
庫存3,690
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
08-305479-10
Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): JEDEC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存4,032
JEDEC
8
0.050" (1.27mm)
-
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
08-350000-11-RC-P
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
封裝: -
庫存4,050
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
PA-SOD6SM18-32
Logical Systems Inc.

ADAPTER 32SOIC TO 32DIP

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
封裝: -
庫存7,776
-
-
-
-
-
-
-
-
-
-
16-351000-11-RC
Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存4,086
DIP, 0.3" (7.62mm) Row Spacing
16
0.026" (0.65mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
14-351000-11-RC
Aries Electronics

SOCKET ADAPTER SSOP TO 14DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存6,012
DIP, 0.3" (7.62mm) Row Spacing
14
0.026" (0.65mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
20-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
封裝: -
庫存8,802
DIP, 0.3" (7.62mm) Row Spacing
20
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
16-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 16SOWIC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封裝: -
庫存7,488
SOWIC
16
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
PA-SSD3SM18-20
Logical Systems Inc.

SOCKET ADAPTER SSOP TO 20DIP

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
封裝: -
庫存8,568
DIP
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-