頁 10 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
84-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 84DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,714	DIP, 0.6" (15.24mm) Row Spacing	84	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
44-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存8,766	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
242-1293-29-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,500	-	-	-	-	-	-	-	-	-	-
32-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,006	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
28-650000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,526	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 24SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存8,478	SOIC	24	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
18-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,798	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
18-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存7,002	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
08-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 8SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存4,644	SOIC	8	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 16SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存6,336	SOIC	16	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,830	DIP, 0.3" (7.62mm) Row Spacing	24	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
1111903	Aries Electronics	SOCKET ADAPT SOWIC TO 24DIP 0.4 Convert From (Adapter End): SOWIC Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,920	DIP, 0.4" (10.16mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1106396-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存4,374	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存2,538	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
20-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 20SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,474	SOWIC	20	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.8-80	Aries Electronics	SOCKET ADAPTER MULT PKG TO 80QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 80 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存6,786	QFP	80	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
28-350002-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,490	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
222-3343-19-0602J	3M	RECEPTACLE DIP SOCKET 22POS .4" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,200	-	-	-	-	-	-	-	-	-	-
18-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存7,056	DIP, 0.3" (7.62mm) Row Spacing	18	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
PA-QSD3SM18-16	Logical Systems Inc.	ADAPTER 16QSOP TO 16DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,254	-	-	-	-	-	-	-	-	-	-
264-4493-19-0602J	3M	RECEPTACLE DIP SOCKET 64POS .9" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存7,002	-	-	-	Gold	-	-	-	Gold	Polysulfone (PSU), Glass Filled	-
228-1277-19-0602J	3M	RECEPTACLE DIP SOCKET 28POS .6" Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存6,174	DIP, 0.6" (15.24mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
248-1282-29-0602J	3M	RECEPTACLE DIP SOCKET 48POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,218	-	-	-	-	-	-	-	-	-	-
224-1275-09-0602J	3M	SOCKET ADAPTER 24DIP TO 24DIP Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存5,832	DIP, 0.6" (15.24mm) Row Spacing	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
16-665000-00	Aries Electronics	SCK ADAPT 16P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,914	SOIC	16	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
218-3341-19-0602J	3M	RECEPTACLE DIP SOCKET 18POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存5,580	-	-	-	-	-	-	-	-	-	-
216-3340-09-0602J	3M	SOCKET ADAPTER 16DIP TO 16DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封裝: -	庫存7,614	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
LCQT-TSSOP28	Aries Electronics	SOCKET ADAPTER TSSOP TO 28DIP Convert From (Adapter End): TSSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存7,092	DIP, 0.6" (15.24mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass

84-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 84
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,714

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

44-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存8,766

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

242-1293-29-0602J

3M

RECEPTACLE DIP SOCKET 42POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,500

-

32-652000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,006

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

28-650000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,526

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

24-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 24SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存8,478

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

18-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 18
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,798

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

18-354000-11-RC

Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 18
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存7,002

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

08-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 8SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 8
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存4,644

SOIC

8

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

16-354000-11-RC

Aries Electronics

SOCKET ADAPTER DIP TO 16SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存6,336

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-351000-11-RC

Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,830

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

1111903

Aries Electronics

SOCKET ADAPT SOWIC TO 24DIP 0.4

Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,920

DIP, 0.4" (10.16mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1106396-40

Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存4,374

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

16-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存2,538

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

20-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 20SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,474

SOWIC

20

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

LCQT-QFP0.8-80

Aries Electronics

SOCKET ADAPTER MULT PKG TO 80QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 80
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,786

QFP

80

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

28-350002-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,490

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

222-3343-19-0602J

3M

RECEPTACLE DIP SOCKET 22POS .4"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,200

-

18-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存7,056

DIP, 0.3" (7.62mm) Row Spacing

18

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

PA-QSD3SM18-16

Logical Systems Inc.

ADAPTER 16QSOP TO 16DIP

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,254

-

264-4493-19-0602J

3M

RECEPTACLE DIP SOCKET 64POS .9"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存7,002

-

Gold

-

Gold

Polysulfone (PSU), Glass Filled

-

228-1277-19-0602J

3M

RECEPTACLE DIP SOCKET 28POS .6"

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存6,174

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

248-1282-29-0602J

3M

RECEPTACLE DIP SOCKET 48POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,218

-

224-1275-09-0602J

3M

SOCKET ADAPTER 24DIP TO 24DIP

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存5,832

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

16-665000-00

Aries Electronics

SCK ADAPT 16P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,914

SOIC

16

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

218-3341-19-0602J

3M

RECEPTACLE DIP SOCKET 18POS .3"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存5,580

-

216-3340-09-0602J

3M

SOCKET ADAPTER 16DIP TO 16DIP

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封裝: -

庫存7,614

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

LCQT-TSSOP28

Aries Electronics

SOCKET ADAPTER TSSOP TO 28DIP

Convert From (Adapter End): TSSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,092

DIP, 0.6" (15.24mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass