頁 6 - IC、電晶體用插槽 - 配接器 | 連接器、互連元件

零件編號	製造商	描述	封裝	庫存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
64-304121-00	Aries Electronics	SOCKET ADAPTER TQFP TO 64QFP Convert From (Adapter End): TQFP Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.031" (0.80mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,736	QFP	64	0.031" (0.80mm)	-	Through Hole	Solder	0.031" (0.80mm)	Tin-Lead	-	FR4 Epoxy Glass
DS9075-40V/NO-BRAND	Maxim Integrated	SOCKET ADAPTER SIP TO 40DIP Convert From (Adapter End): SIP Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存6,840	DIP	40	-	-	-	-	-	-	-	-
44-652000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,434	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
68-653000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,196	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
95-132I25-P	Aries Electronics	SOCKET ADAPTER QFP TO 132PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存2,898	PGA	132	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
68-505-110-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 68PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存5,940	PGA	68	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD6SM18-44	Logical Systems Inc.	ADAPTER 44SOIC TO 44DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存2,934	DIP	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
28-650000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,956	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
14-354000-10	Aries Electronics	SOCKET ADAPTER DIP TO 14SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封裝: -	庫存3,366	SOIC	14	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
08-665000-00	Aries Electronics	SCK ADAPT 8P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,758	SOIC	8	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
20-301550-20	Aries Electronics	SOCKET ADAPTER SOIC TO 20PLCC Convert From (Adapter End): SOIC Convert To (Adapter End): PLCC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,446	PLCC	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
10-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 10DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 10 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存7,128	DIP, 0.3" (7.62mm) Row Spacing	10	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
22-304504-18	Aries Electronics	SOCKET ADAPTER SOIC TO 22DIP 0.4 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,822	DIP, 0.4" (10.16mm) Row Spacing	22	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 20DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存4,554	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
08-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存7,848	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
1111841-8	Aries Electronics	SOCKET ADAPTER MSOP TO 8DIP 0.3 Convert From (Adapter End): MSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存3,924	DIP, 0.3" (7.62mm) Row Spacing	8	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
14-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存8,694	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
20-350000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 20DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存2,412	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
PA-TS1D6SM18-32	Logical Systems Inc.	ADAPTER 32TSOP TO 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存8,532	DIP	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-SSD6SM18-40	Logical Systems Inc.	ADAPTER 40TSSOP TO 40DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存8,820	DIP	40	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
220-3342-19-0602J	3M	RECEPTACLE DIP SOCKET 20POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存4,950	-	-	-	-	-	-	-	-	-	-
224-1275-19-0602J	3M	RECEPTACLE DIP SOCKET 24POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,596	-	-	-	-	-	-	-	-	-	-
16-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 16DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,264	DIP, 0.3" (7.62mm) Row Spacing	16	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD3SM18-18	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 18DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存6,048	DIP	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-QFP0.5-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封裝: -	庫存7,434	QFP	64	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
PA-SOTD3SM18-06	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 6DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,254	DIP	6	0.037" (0.95mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-SSD3SM18-08	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 8DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封裝: -	庫存7,326	DIP	8	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
1109814	Aries Electronics	SOCKET ADAPTER SOIC TO TO-8 Convert From (Adapter End): SOIC Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存14,616	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass

64-304121-00

Aries Electronics

SOCKET ADAPTER TQFP TO 64QFP

Convert From (Adapter End): TQFP
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.031" (0.80mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,736

QFP

64

0.031" (0.80mm)

-

Through Hole

Solder

0.031" (0.80mm)

Tin-Lead

-

FR4 Epoxy Glass

DS9075-40V/NO-BRAND

Maxim Integrated

SOCKET ADAPTER SIP TO 40DIP

Convert From (Adapter End): SIP
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存6,840

DIP

40

-

44-652000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,434

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

68-653000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,196

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

95-132I25-P

Aries Electronics

SOCKET ADAPTER QFP TO 132PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 132
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存2,898

PGA

132

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

68-505-110-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 68
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存5,940

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

PA-SOD6SM18-44

Logical Systems Inc.

ADAPTER 44SOIC TO 44DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存2,934

DIP

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

28-650000-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,956

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

14-354000-10

Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 14
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封裝: -

庫存3,366

SOIC

14

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

08-665000-00

Aries Electronics

SCK ADAPT 8P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,758

SOIC

8

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

20-301550-20

Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,446

PLCC

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

10-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 10DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 10
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存7,128

DIP, 0.3" (7.62mm) Row Spacing

10

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

22-304504-18

Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.4

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,822

DIP, 0.4" (10.16mm) Row Spacing

22

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

20-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存4,554

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

08-350000-10-HT

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存7,848

DIP, 0.3" (7.62mm) Row Spacing

8

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

1111841-8

Aries Electronics

SOCKET ADAPTER MSOP TO 8DIP 0.3

Convert From (Adapter End): MSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存3,924

DIP, 0.3" (7.62mm) Row Spacing

8

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

14-350000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存8,694

DIP, 0.3" (7.62mm) Row Spacing

14

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

20-350000-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存2,412

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

PA-TS1D6SM18-32

Logical Systems Inc.

ADAPTER 32TSOP TO 32DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP
Number of Pins: 32
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存8,532

DIP

32

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

PA-SSD6SM18-40

Logical Systems Inc.

ADAPTER 40TSSOP TO 40DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存8,820

DIP

40

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

220-3342-19-0602J

3M

RECEPTACLE DIP SOCKET 20POS .3"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存4,950

-

224-1275-19-0602J

3M

RECEPTACLE DIP SOCKET 24POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,596

-

16-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,264

DIP, 0.3" (7.62mm) Row Spacing

16

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

PA-SOD3SM18-18

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 18DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存6,048

DIP

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-QFP0.5-64

Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,434

QFP

64

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

PA-SOTD3SM18-06

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 6DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,254

DIP

6

0.037" (0.95mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

PA-SSD3SM18-08

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 8DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封裝: -

庫存7,326

DIP

8

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

1109814

Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

Convert From (Adapter End): SOIC
Convert To (Adapter End): JEDEC
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存14,616

JEDEC

8

0.050" (1.27mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass