頁 32 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-LD79-QTC	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,624	-	-	-	-	-	-	-	-
CC-MX-PE47-ZM	Digi International	MOD WI-I.MX280128M FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,616	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
FS-3030	Digi International	MODULE 7U 16MB SDRAM 8MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,712	-	-	-	-	-	-	-	-
20-101-1309	Digi International	MODULE WI-FI RCM5650W Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 73.73MHz Flash Size: 4MB RAM Size: 1MB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -30°C ~ 55°C	封裝: -	庫存5,936	Rabbit 5000	-	73.73MHz	4MB	1MB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-30°C ~ 55°C
20-101-1007	Digi International	MODULE POWERCORE 3810 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 25.8MHz Flash Size: 512KB RAM Size: 256KB Connector Type: IDC Header 2x25, 2x5, 1x3mm Size / Dimension: 2.35" x 4" (60mm x 102mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存4,064	Rabbit 3000	-	25.8MHz	512KB	256KB	IDC Header 2x25, 2x5, 1x3mm	2.35" x 4" (60mm x 102mm)	-40°C ~ 70°C
DC-ME4-01T-S-50	Digi International	MOD ME 8MB SDRAM 4MB FLSH 50 PCK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,416	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0741-03-325-2CF	Trenz Electronic GmbH	SOM KINTEX-7 325T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 325T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,944	Kintex-7 325T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-7U-Z113-Z1	Digi International	MODULE 7U 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 8MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,424	ARM7TDMI, NS7520	-	55MHz	8MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
DLP-HS-FPGA2	DLP Design Inc.	MODULE USB ADAPTER FOR FT2232H Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A, XC3S400A Co-Processor: FT2232H Speed: 66MHz Flash Size: - RAM Size: 32MB Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: -	封裝: -	庫存5,376	Spartan-3A, XC3S400A	FT2232H	66MHz	-	32MB	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	-
DC-ME-01T-S-10	Digi International	ME 8MB SDRAM 2MB FLASH 10 PACK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,336	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMOMAPL138-10-1602AHCR	Logic	SYSTEM ON MODULE LV OMAPL138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C6748 Speed: 375MHz Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,600	ARM926EJ-S, OMAP-L138	TMS320C6748	375MHz	8MB	128MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
TE0820-03-02EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2EG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,920	-	-	-	-	-	-	-	-
TE0841-02-035-2I	Trenz Electronic GmbH	SOM USCALE XCKU035-2S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,584	-	-	-	-	-	-	-	-
TE0820-03-02CG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存7,440	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0803-02-03EG-1EB	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存4,112	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0803-03-2BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存2,100	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0808-04-09EG-1EL	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0823-01-S001	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	-	-	-	-	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-05-2BI81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
CC-MX-FS7D-ZN	Digi	CONNECTCORE 8M NANO, QUAD CORE, Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A53 Co-Processor: ARM® Cortex®-M7 Speed: 600MHz, 1.4GHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53	ARM® Cortex®-M7	600MHz, 1.4GHz	-	1GB	USB	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU7-6EG-1I-D11E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU6EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0803-04-4GE21-L	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-2SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq™ UltraScale+™ XCZU4EG-2SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
MA-ZX3-20-1C-D9-R7	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 512MB Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 50MHz Flash Size: 1GB (NAND) RAM Size: 512MB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3	ARM Cortex-A9	Zynq-7000 (Z-7020)	50MHz	1GB (NAND)	512MB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	0°C ~ 70°C
ME-XU8-5EV-1I-D12E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU5EV Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
FORLINX-FETMX6ULL-C-08512SE8GIA11	Forlinx Embedded	NXP i.MX6ULLSOM,512MB DDR3,8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 800MHz Flash Size: 8GB eMMC RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.570" L x 1.142" W (40.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A7	-	800MHz	8GB eMMC	512MB	Board-to-Board (BTB) Socket - 160	1.570" L x 1.142" W (40.00mm x 29.00mm)	-40°C ~ 85°C
TE0745-02-92I11-F	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
MYC-Y7Z010-V2-4E512D-667-I	MYIR Tech Limited	System-On-Module, Zynq-7010 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 667MHz Flash Size: 4GB RAM Size: 512MB Connector Type: Pin(s) Size / Dimension: 2.950" L x 1.970" W (75.00mm x 50.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7010)	667MHz	4GB	512MB	Pin(s)	2.950" L x 1.970" W (75.00mm x 50.00mm)	-40°C ~ 85°C
TE0820-04-4B121PL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-

CC-MX-LD79-QTC

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,624

-

CC-MX-PE47-ZM

Digi International

MOD WI-I.MX280128M FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,616

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

FS-3030

Digi International

MODULE 7U 16MB SDRAM 8MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,712

-

20-101-1309

Digi International

MODULE WI-FI RCM5650W

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 73.73MHz
Flash Size: 4MB
RAM Size: 1MB
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -30°C ~ 55°C

封裝: -

庫存5,936

Rabbit 5000

-

73.73MHz

4MB

1MB

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-30°C ~ 55°C

20-101-1007

Digi International

MODULE POWERCORE 3810

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 25.8MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: IDC Header 2x25, 2x5, 1x3mm
Size / Dimension: 2.35" x 4" (60mm x 102mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存4,064

Rabbit 3000

-

25.8MHz

512KB

256KB

IDC Header 2x25, 2x5, 1x3mm

2.35" x 4" (60mm x 102mm)

-40°C ~ 70°C

DC-ME4-01T-S-50

Digi International

MOD ME 8MB SDRAM 4MB FLSH 50 PCK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,416

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0741-03-325-2CF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 325T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,944

Kintex-7 325T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-7U-Z113-Z1

Digi International

MODULE 7U 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: 48-DIP
Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,424

ARM7TDMI, NS7520

-

55MHz

8MB

16MB

48-DIP

2.48" x 0.73" (62.9mm x 18.5mm)

0°C ~ 70°C

DLP-HS-FPGA2

DLP Design Inc.

MODULE USB ADAPTER FOR FT2232H

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A, XC3S400A
Co-Processor: FT2232H
Speed: 66MHz
Flash Size: -
RAM Size: 32MB
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: -

封裝: -

庫存5,376

Spartan-3A, XC3S400A

FT2232H

66MHz

-

32MB

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

-

DC-ME-01T-S-10

Digi International

ME 8MB SDRAM 2MB FLASH 10 PACK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,336

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMOMAPL138-10-1602AHCR

Logic

SYSTEM ON MODULE LV OMAPL138

Module/Board Type: MPU, DSP Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C6748
Speed: 375MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,600

ARM926EJ-S, OMAP-L138

TMS320C6748

375MHz

8MB

128MB

Board-to-Board (BTB) Socket - 300

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

TE0820-03-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,920

-

TE0841-02-035-2I

Trenz Electronic GmbH

SOM USCALE XCKU035-2S 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,584

-

TE0820-03-02CG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存7,440

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0803-02-03EG-1EB

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存4,112

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0803-03-2BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存2,100

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0808-04-09EG-1EL

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

Request a Quote

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0823-01-S001

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A53, ARM® Cortex®-R5

-

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-05-2BI81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

CC-MX-FS7D-ZN

Digi

CONNECTCORE 8M NANO, QUAD CORE,

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: ARM® Cortex®-M7
Speed: 600MHz, 1.4GHz
Flash Size: -
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53

ARM® Cortex®-M7

600MHz, 1.4GHz

-

1GB

USB

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU7-6EG-1I-D11E-R4-1

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU6EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0803-04-4GE21-L

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-2SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq™ UltraScale+™ XCZU4EG-2SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

MA-ZX3-20-1C-D9-R7

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 512MB

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 50MHz
Flash Size: 1GB (NAND)
RAM Size: 512MB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3

ARM Cortex-A9

Zynq-7000 (Z-7020)

50MHz

1GB (NAND)

512MB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

0°C ~ 70°C

ME-XU8-5EV-1I-D12E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU5EV

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

FORLINX-FETMX6ULL-C-08512SE8GIA11

Forlinx Embedded

NXP i.MX6ULLSOM,512MB DDR3,8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 800MHz
Flash Size: 8GB eMMC
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.570" L x 1.142" W (40.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A7

-

800MHz

8GB eMMC

512MB

Board-to-Board (BTB) Socket - 160

1.570" L x 1.142" W (40.00mm x 29.00mm)

-40°C ~ 85°C

TE0745-02-92I11-F

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

MYC-Y7Z010-V2-4E512D-667-I

MYIR Tech Limited

System-On-Module, Zynq-7010

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 667MHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: Pin(s)
Size / Dimension: 2.950" L x 1.970" W (75.00mm x 50.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A9

Zynq-7000 (Z-7010)

667MHz

4GB

512MB

Pin(s)

2.950" L x 1.970" W (75.00mm x 50.00mm)

-40°C ~ 85°C

TE0820-04-4B121PL

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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