頁 31 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
M5475JFEE-B	Logic	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,224	ColdFire V4e, MCF5475	-	266MHz	16MB	64MB	-	-	0°C ~ 70°C
CENGLH7A404-11-503HC	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,136	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0517	Digi International	MODULE RABBITCORE RCM3100 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 1.65" (47mm x 42mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,608	Rabbit 3000	-	29.4MHz	512KB	512KB	2 IDC Headers 2x17	1.85" x 1.65" (47mm x 42mm)	-40°C ~ 85°C
CC-MX-LD6A-ZM-B	Digi International	MOD I.MX53 1GB FLASH 512MB 25PK Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 800MHz Flash Size: 1GB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	封裝: -	庫存3,488	ARM? Cortex?-A8, i.MX53	-	800MHz	1GB	512MB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
CC-MX-MB69-ZM	Digi International	MODULE I.MX51 512MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,224	-	-	-	-	-	-	-	-
CC-MX-KD69-ZM	Digi International	MOD I.MX53 1GHZ 512MB FLASH Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 1GHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	封裝: -	庫存4,256	ARM? Cortex?-A8, i.MX53	-	1GHz	512MB	512MB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
6711-AA-1X1-RC	Critical Link LLC	MITYDSP SOM TMS320C6711 200MHZ Module/Board Type: DSP, FPGA Core Core Processor: TMS320C6711 Co-Processor: Spartan-3, XC3S400 Speed: 200MHz Flash Size: 2MB RAM Size: 64KB (Internal), 8MB (External) Connector Type: SO-DIMM-144 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,920	TMS320C6711	Spartan-3, XC3S400	200MHz	2MB	64KB (Internal), 8MB (External)	SO-DIMM-144	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-MX-PF47-ZM	Digi International	MOD IMX287 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,632	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
L138-DI-225-RI	Critical Link LLC	MITYDSP-L138F SOM OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,456	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	-40°C ~ 85°C
CC-MX-PF47-AE	Digi International	MODULE CONNECTCORE Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,280	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
TE0841-02-040-1I	Trenz Electronic GmbH	SOM USCALE XCKU040-1S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,368	-	-	-	-	-	-	-	-
TE0820-03-04EV-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存4,528	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
IW-G24M-CU2F-4E002G-S008G-LEI	iWave Systems	Arria 10 SX480 (-2 speed)SoC SOM Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: - Speed: 1.5GHz Flash Size: 8GB RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.740" L x 2.950" W (95.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A9, Arria 10 SX	-	1.5GHz	8GB	4GB	2 x 240 Pin	3.740" L x 2.950" W (95.00mm x 75.00mm)	-40°C ~ 85°C
TE0729-02-62I65MM	Trenz Electronic GmbH	IC SOC MODULE ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-02-200-1IC1	Trenz Electronic GmbH	IC MOD ARTIX7 A200T 200MHZ 1GB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-9EG-1E-D11E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E	600MHz, 1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0630-03-52I22-A	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-3AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
EC-VA-H265-10B-60-1080-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H265 ENC 60FPS 1080 SODIMM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
OSD3358-1G-ISM	Octavo Systems LLC	IC MODULE CORTEX-A8 1GHZ 1GB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 1GB Connector Type: 256-BGA Size / Dimension: 0.830" L x 0.830" W (21.00mm x 21.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存471	ARM® Cortex®-A8, AM3358	-	1GHz	-	1GB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
ARRIA-10-GT	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
OSD32MP153C-512M-BAA	Octavo Systems LLC	SIP: 153C, 512MB, BAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	0°C ~ 85°C
MCXL-H055BBB-I	ARIES Embedded	SoM Cyclone10LP FPGA Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: 256MB Connector Type: 221 Pin Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	256MB	221 Pin	-	-
4EC-VA-H265-10B-60-1080-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H265 ENC 60FPS 1080 SODIMM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
MA-ZX3-20-1C-D9-R7-1	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 512MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存516	-	-	-	-	-	-	-	-
5748-PJ-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5748 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存15	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0808-04-9BE21-L	Trenz Electronic GmbH	IC MOD SOM MPSOC 4GB XCZU9EG Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	128MB	4GB	B2B	-	-
TE0865-02-DGE23MA	Trenz Electronic GmbH	MPSOC MODULE WITH ZYNQ ULTRASCAL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E	-	-	256MB	4GB	Board-to-Board (BTB) Socket	3.937" L x 2.953" W (100.00mm x 75.00mm)	0°C ~ 85°C

M5475JFEE-B

Logic

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,224

ColdFire V4e, MCF5475

-

266MHz

16MB

64MB

-

0°C ~ 70°C

CENGLH7A404-11-503HC

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,136

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0517

Digi International

MODULE RABBITCORE RCM3100

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 1.65" (47mm x 42mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,608

Rabbit 3000

-

29.4MHz

512KB

2 IDC Headers 2x17

1.85" x 1.65" (47mm x 42mm)

-40°C ~ 85°C

CC-MX-LD6A-ZM-B

Digi International

MOD I.MX53 1GB FLASH 512MB 25PK

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 800MHz
Flash Size: 1GB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存3,488

ARM? Cortex?-A8, i.MX53

-

800MHz

1GB

512MB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

CC-MX-MB69-ZM

Digi International

MODULE I.MX51 512MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,224

-

CC-MX-KD69-ZM

Digi International

MOD I.MX53 1GHZ 512MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存4,256

ARM? Cortex?-A8, i.MX53

-

1GHz

512MB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

6711-AA-1X1-RC

Critical Link LLC

MITYDSP SOM TMS320C6711 200MHZ

Module/Board Type: DSP, FPGA Core
Core Processor: TMS320C6711
Co-Processor: Spartan-3, XC3S400
Speed: 200MHz
Flash Size: 2MB
RAM Size: 64KB (Internal), 8MB (External)
Connector Type: SO-DIMM-144
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,920

TMS320C6711

Spartan-3, XC3S400

200MHz

2MB

64KB (Internal), 8MB (External)

SO-DIMM-144

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CC-MX-PF47-ZM

Digi International

MOD IMX287 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,632

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

L138-DI-225-RI

Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,456

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

375MHz

256MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

-40°C ~ 85°C

CC-MX-PF47-AE

Digi International

MODULE CONNECTCORE

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,280

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

TE0841-02-040-1I

Trenz Electronic GmbH

SOM USCALE XCKU040-1S 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,368

-

TE0820-03-04EV-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存4,528

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

IW-G24M-CU2F-4E002G-S008G-LEI

iWave Systems

Arria 10 SX480 (-2 speed)SoC SOM

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: -
Speed: 1.5GHz
Flash Size: 8GB
RAM Size: 4GB
Connector Type: 2 x 240 Pin
Size / Dimension: 3.740" L x 2.950" W (95.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

Request a Quote

ARM® Cortex®-A9, Arria 10 SX

-

1.5GHz

8GB

4GB

2 x 240 Pin

3.740" L x 2.950" W (95.00mm x 75.00mm)

-40°C ~ 85°C

TE0729-02-62I65MM

Trenz Electronic GmbH

IC SOC MODULE ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

TE0712-02-200-1IC1

Trenz Electronic GmbH

IC MOD ARTIX7 A200T 200MHZ 1GB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

Request a Quote

Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-9EG-1E-D11E-G1-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E

600MHz, 1.5GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0630-03-52I22-A

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0803-04-3AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU3CG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

EC-VA-H265-10B-60-1080-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H265 ENC 60FPS 1080 SODIMM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

OSD3358-1G-ISM

Octavo Systems LLC

IC MODULE CORTEX-A8 1GHZ 1GB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: -
Speed: 1GHz
Flash Size: -
RAM Size: 1GB
Connector Type: 256-BGA
Size / Dimension: 0.830" L x 0.830" W (21.00mm x 21.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存471

ARM® Cortex®-A8, AM3358

-

1GHz

-

1GB

256-BGA

0.830" L x 0.830" W (21.00mm x 21.00mm)

-40°C ~ 85°C

ARRIA-10-GT

Intel

PROTOTYPE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

OSD32MP153C-512M-BAA

Octavo Systems LLC

SIP: 153C, 512MB, BAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

0°C ~ 85°C

MCXL-H055BBB-I

ARIES Embedded

SoM Cyclone10LP FPGA

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 256MB
Connector Type: 221 Pin
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

256MB

221 Pin

-

4EC-VA-H265-10B-60-1080-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H265 ENC 60FPS 1080 SODIMM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

MA-ZX3-20-1C-D9-R7-1

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 512MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存516

-

5748-PJ-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5748 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存15

ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0808-04-9BE21-L

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB XCZU9EG

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

128MB

4GB

B2B

-

TE0865-02-DGE23MA

Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
Co-Processor: -
Speed: -
Flash Size: 256MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E

-

256MB

4GB

Board-to-Board (BTB) Socket

3.937" L x 2.953" W (100.00mm x 75.00mm)

0°C ~ 85°C