頁 34 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0745-01-45-2I	Trenz Electronic GmbH	SOM SOC Z7 XC7Z045-2FBG676I 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,792	ARM? Cortex?-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
SOMAM3703-31-1780AKIR	Logic	SYSTEM ON MODULE WIRELESS TORP Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,760	ARM? Cortex?-A8, AM3703	-	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	-	-40°C ~ 85°C
20-101-1184	Digi International	MPU MODULE RABBIT 2000 TWO PACK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,872	-	-	-	-	-	-	-	-
SS1-IC	Parallax Inc.	MODULE SPIN STAMP MCU 24-DIP Module/Board Type: MPU Core Core Processor: Propeller, P8X32A-M44 Co-Processor: - Speed: 10MHz Flash Size: 32KB ROM RAM Size: 32KB Connector Type: 24-DIP Size / Dimension: 1.2" x 0.63" (31mm x 16mm) Operating Temperature: -	封裝: -	庫存3,152	Propeller, P8X32A-M44	-	10MHz	32KB ROM	32KB	24-DIP	1.2" x 0.63" (31mm x 16mm)	-
CC-9P-V524-LX-B	Digi International	MOD 9P 32MB SDRAM 16MB FLSH 25PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,816	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
DC-ME-01T-MF	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,680	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
1810-DG-225-RC	Critical Link LLC	MITYDSP-1810F SOM OMAP-L138 Module/Board Type: MPU, FPGA Core Core Processor: ARM926EJ-S, AM1810 Co-Processor: Spartan-6, XC6SLX16 Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,296	ARM926EJ-S, AM1810	Spartan-6, XC6SLX16	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
3359-GX-226-RC	Critical Link LLC	MITYSOM-3359 PROCESSOR CARD Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3359 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 64KB (Internal), 256MB (External) Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,976	ARM? Cortex?-A8, AM3359	NEON SIMD	720MHz	256MB (NAND), 8MB (NOR)	64KB (Internal), 256MB (External)	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
TE0745-02-30-1I	Trenz Electronic GmbH	SOM DDR3 1GB ZYNQ XC7Z030-1I Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,936	ARM? Cortex?-A9	Zynq-7000 (Z-7030)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
DC-ME-01T-VCY	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,304	-	-	-	-	-	-	-	-
XPP1002000-02R	Lantronix, Inc.	XPORT PRO EXTENDED SRAM, EXTENDE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存8,124	-	-	-	-	-	-	-	-
TE0841-02-41C21-A	Trenz Electronic GmbH	IC MODULE USCALE 2GB Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,560	Kintex UltraScale KU40	-	-	64MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
ME-XU5-2EG-1I-D11E-R1-2	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 512MB, 2GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存117	ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	600MHz, 1.5GHz	16GB	512MB, 2GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
ME-XU8-4CG-1I-D11E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU4CG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
5728-PX-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5728 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0820-05-S002C1	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
M100PF-3AC	ARIES Embedded	SOM POLARFIRE FPGA MPF300T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	-	-	-	-	1GB	Board-to-Board (BTB) Socket	-	0°C ~ 70°C
TE0820-05-2BI21ML	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784I	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0818-02-6BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0820-05-4AE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU1-9EG-1E-D11E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0813-01-5DE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0630-03-52I12-A	Trenz Electronic GmbH	FPGA MODULE WITH AMD SPARTAN 6 L Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX45-2CSG484I Co-Processor: - Speed: - Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 80 Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX45-2CSG484I	-	-	8MB	128MB	Board-to-Board (BTB) Socket - 80	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0807-03-4AI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU4CG-1FBVB900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0725-03-100-2CF	Trenz Electronic GmbH	FPGA MODULE XILINX ARTIX-7 100T, Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A100T-2CSG324C Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 8MB Connector Type: 2 x 50 Pin, RJ-45 Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Artix™ 7 XC7A100T-2CSG324C	-	100MHz	32MB	8MB	2 x 50 Pin, RJ-45	-	0°C ~ 70°C
TE0821-01-2AE31PA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0710-03-42I21-A	Trenz Electronic GmbH	DUAL FAST ETHERNET FPGA MODULE W Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A35T-2CSG324I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Artix™ 7 XC7A35T-2CSG324I	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-15EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C

TE0745-01-45-2I

Trenz Electronic GmbH

SOM SOC Z7 XC7Z045-2FBG676I 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,792

ARM? Cortex?-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

SOMAM3703-31-1780AKIR

Logic

SYSTEM ON MODULE WIRELESS TORP

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,760

ARM? Cortex?-A8, AM3703

-

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

-

-40°C ~ 85°C

20-101-1184

Digi International

MPU MODULE RABBIT 2000 TWO PACK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,872

-

SS1-IC

Parallax Inc.

MODULE SPIN STAMP MCU 24-DIP

Module/Board Type: MPU Core
Core Processor: Propeller, P8X32A-M44
Co-Processor: -
Speed: 10MHz
Flash Size: 32KB ROM
RAM Size: 32KB
Connector Type: 24-DIP
Size / Dimension: 1.2" x 0.63" (31mm x 16mm)
Operating Temperature: -

封裝: -

庫存3,152

Propeller, P8X32A-M44

-

10MHz

32KB ROM

32KB

24-DIP

1.2" x 0.63" (31mm x 16mm)

-

CC-9P-V524-LX-B

Digi International

MOD 9P 32MB SDRAM 16MB FLSH 25PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,816

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

DC-ME-01T-MF

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,680

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

1810-DG-225-RC

Critical Link LLC

MITYDSP-1810F SOM OMAP-L138

Module/Board Type: MPU, FPGA Core
Core Processor: ARM926EJ-S, AM1810
Co-Processor: Spartan-6, XC6SLX16
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,296

ARM926EJ-S, AM1810

Spartan-6, XC6SLX16

375MHz

256MB (NAND), 8MB (NOR)

8KB (Internal), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

3359-GX-226-RC

Critical Link LLC

MITYSOM-3359 PROCESSOR CARD

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3359
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 64KB (Internal), 256MB (External)
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,976

ARM? Cortex?-A8, AM3359

NEON SIMD

720MHz

256MB (NAND), 8MB (NOR)

64KB (Internal), 256MB (External)

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

TE0745-02-30-1I

Trenz Electronic GmbH

SOM DDR3 1GB ZYNQ XC7Z030-1I

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,936

ARM? Cortex?-A9

Zynq-7000 (Z-7030)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

DC-ME-01T-VCY

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,304

-

XPP1002000-02R

Lantronix, Inc.

XPORT PRO EXTENDED SRAM, EXTENDE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存8,124

-

TE0841-02-41C21-A

Trenz Electronic GmbH

IC MODULE USCALE 2GB

Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,560

Kintex UltraScale KU40

-

64MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

ME-XU5-2EG-1I-D11E-R1-2

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 512MB, 2GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存117

ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

600MHz, 1.5GHz

16GB

512MB, 2GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

ME-XU8-4CG-1I-D11E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU4CG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

5728-PX-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5728 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0820-05-S002C1

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

M100PF-3AC

ARIES Embedded

SOM POLARFIRE FPGA MPF300T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

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-

1GB

Board-to-Board (BTB) Socket

-

0°C ~ 70°C

TE0820-05-2BI21ML

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU2EG-1SFVC784I

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0818-02-6BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0820-05-4AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

ME-XU1-9EG-1E-D11E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0813-01-5DE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0630-03-52I12-A

Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX45-2CSG484I
Co-Processor: -
Speed: -
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 80
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Spartan™ 6 XC6SLX45-2CSG484I

-

8MB

128MB

Board-to-Board (BTB) Socket - 80

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0807-03-4AI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU4CG-1FBVB900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0725-03-100-2CF

Trenz Electronic GmbH

FPGA MODULE XILINX ARTIX-7 100T,

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A100T-2CSG324C
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 8MB
Connector Type: 2 x 50 Pin, RJ-45
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

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Artix™ 7 XC7A100T-2CSG324C

-

100MHz

32MB

8MB

2 x 50 Pin, RJ-45

-

0°C ~ 70°C

TE0821-01-2AE31PA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU2CG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

4GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0710-03-42I21-A

Trenz Electronic GmbH

DUAL FAST ETHERNET FPGA MODULE W

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A35T-2CSG324I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Artix™ 7 XC7A35T-2CSG324I

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-15EG-2I-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C