頁 29 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-KD47-VM	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,360	-	-	-	-	-	-	-	-
20-101-0085	Digi International	CORE MODULE CM7220 Module/Board Type: MPU Core Core Processor: Z180 Co-Processor: - Speed: 9.216MHz Flash Size: 128KB RAM Size: 32KB Connector Type: 40 Pin Header Size / Dimension: 1.8" x 2.05" (46mm x 52mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存5,280	Z180	-	9.216MHz	128KB	32KB	40 Pin Header	1.8" x 2.05" (46mm x 52mm)	-40°C ~ 70°C
FS-385	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,808	-	-	-	-	-	-	-	-
DC-EM-02T-JT	Digi International	MODULE EM CUSTOMIZABLE JTAG Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Pin Header Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,040	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	Pin Header	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
101-0520	Digi International	MODULE RABBITCORE RCM3200 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,760	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0782-02-045-2I	Trenz Electronic GmbH	SOM SOC Z7045 2XUSB 2XGB ETH 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec QTH Size / Dimension: 3.35" x 3.35" (85mm x 85mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存2,096	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec QTH	3.35" x 3.35" (85mm x 85mm)	-40°C ~ 85°C
DC-ME4-01T-JT	Digi International	MODULE ME CUSTOMIZABLE JTAG Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,472	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMDM3730-32-2780AKCR	Logic	SOM TORPEDO WIRELESS 1GHZ COM Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存8,844	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	0°C ~ 70°C
TE0726-03M	Trenz Electronic GmbH	SBC ZYNQBERRY Z7010 HDMI USB ETH Module/Board Type: FPGA Core Processor: - Co-Processor: Zynq-7000 (Z-7010) Speed: 667MHz Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,420	-	Zynq-7000 (Z-7010)	667MHz	16MB	512MB	CSI, DSI	1.57" x 1.18" (40mm x 30mm)	0°C ~ 70°C
TE0745-02-71I11-A	Trenz Electronic GmbH	SOM DDR3 1GB ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,504	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Samtec ST5	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
G120B-SM-373	GHI Electronics, LLC	IC MOD CORTEX-M3 120MHZ 96KB Module/Board Type: MCU Core Core Processor: ARM® Cortex®-M3 Co-Processor: - Speed: 120MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 96KB (Internal), 16MB (External) Connector Type: - Size / Dimension: 1.50" x 1.05" (38.1mm x 26.7mm) Operating Temperature: -40°C ~ 85°C (TA)	封裝: -	庫存5,040	ARM® Cortex®-M3	-	120MHz	512KB (Internal), 4MB (External)	96KB (Internal), 16MB (External)	-	1.50" x 1.05" (38.1mm x 26.7mm)	-40°C ~ 85°C (TA)
TE0726-03-41C74-R	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 16MB RAM Size: 128MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	16MB	128MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
A20-SOM-E16GS16M	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1GHz Flash Size: 8GB RAM Size: 1GB Connector Type: 40 Pin Size / Dimension: 3.200" L x 2.200" W (81.28mm x 55.88mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM® Cortex®-A7	-	1GHz	8GB	1GB	40 Pin	3.200" L x 2.200" W (81.28mm x 55.88mm)	0°C ~ 70°C
TE0741-03-B3E-1-AF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
FORLINX-FET3588-C-248GSE64GCD11	Forlinx Embedded	Rockchip RK3588 SOM,8GBLPDDR4x,6 Module/Board Type: MPU Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76 Co-Processor: - Speed: 2.4GHz Flash Size: 64GB eMMC RAM Size: 8GB Connector Type: 4 x 100 Pin Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-A76	-	2.4GHz	64GB eMMC	8GB	4 x 100 Pin	1.970" L x 2.677" W (50.00mm x 68.00mm)	0°C ~ 70°C
TE0808-04-BBE21-AK	Trenz Electronic GmbH	IC MOD SOM MPSOC 4GB ZU15G Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
5749-PX-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5749 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
ME-AA1-270-2I2-D11E-R2	Enclustra FPGA Solutions	SOM Module/Board Type: FPGA Core Processor: ARM Cortex-A9 Co-Processor: 10AS027E2F29I2SG Speed: 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: USB Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	10AS027E2F29I2SG	1.5GHz	16GB	2GB	USB	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TEC0117-01	Trenz Electronic GmbH	FPGA MODULE WITH GOWIN LITTLEBEE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0722-04-41I-4-A	Trenz Electronic GmbH	DIPFORTY1 "SOFT PROPELLER" WITH Module/Board Type: FPGA Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7: XC7Z010-1CLG225I Speed: - Flash Size: 16MB RAM Size: - Connector Type: 2 x 20 Pin Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7: XC7Z010-1CLG225I	-	16MB	-	2 x 20 Pin	2.008" L x 0.709" W (51.00mm x 18.00mm)	-40°C ~ 85°C
TE0741-04-B2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-ZX1-45-2I-D10-P-R3	Enclustra FPGA Solutions	SOM ZYNQ 7Z045 1GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Kintex-7 Speed: 800MHz Flash Size: 512MB RAM Size: 256MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存33	ARM® Dual-Core Cortex-A9	Kintex-7	800MHz	512MB	256MB, 1GB	168 Pin	2.520" L x 2.130" W (64.00mm x 54.00mm)	-40°C ~ 85°C
TE0813-02-5DE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
A10S-P9-A5E-RI-SB	Critical Link LLC	ARRIA 10 SOC MODULE, 480KLE, 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9 Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 4GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存27	ARM® Cortex®-A9	NEON™ SIMD	1.2GHz	-	4GB	Board-to-Board (BTB)	4.000" L x 4.000" W (101.50mm x 101.50mm)	-40°C ~ 85°C
TE0745-02-71I31-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB HEAT SPREADER Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.990" L x 2.130" W (76.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.990" L x 2.130" W (76.00mm x 54.00mm)	-40°C ~ 85°C
FORLINX-FET3588-C-244GSE32GCC11	Forlinx Embedded	Rockchip RK3588 SOM,4GBLPDDR4x,3 Module/Board Type: MPU Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76 Co-Processor: - Speed: 2.4GHz Flash Size: 32GB eMMC RAM Size: 4GB Connector Type: 4 x 100 Pin Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-A76	-	2.4GHz	32GB eMMC	4GB	4 x 100 Pin	1.970" L x 2.677" W (50.00mm x 68.00mm)	0°C ~ 70°C
TE0803-03-4BI21-A	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
OSD32MP153A-512M-BAA	Octavo Systems LLC	SIP: 153A, 512MB, BAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	0°C ~ 85°C

CC-WMX-KD47-VM

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,360

-

20-101-0085

Digi International

CORE MODULE CM7220

Module/Board Type: MPU Core
Core Processor: Z180
Co-Processor: -
Speed: 9.216MHz
Flash Size: 128KB
RAM Size: 32KB
Connector Type: 40 Pin Header
Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存5,280

Z180

-

9.216MHz

128KB

32KB

40 Pin Header

1.8" x 2.05" (46mm x 52mm)

-40°C ~ 70°C

FS-385

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,808

-

DC-EM-02T-JT

Digi International

MODULE EM CUSTOMIZABLE JTAG

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin Header
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,040

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

Pin Header

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

101-0520

Digi International

MODULE RABBITCORE RCM3200

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,760

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0782-02-045-2I

Trenz Electronic GmbH

SOM SOC Z7045 2XUSB 2XGB ETH 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec QTH
Size / Dimension: 3.35" x 3.35" (85mm x 85mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存2,096

ARM Cortex-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec QTH

3.35" x 3.35" (85mm x 85mm)

-40°C ~ 85°C

DC-ME4-01T-JT

Digi International

MODULE ME CUSTOMIZABLE JTAG

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,472

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMDM3730-32-2780AKCR

Logic

SOM TORPEDO WIRELESS 1GHZ COM

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存8,844

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

0°C ~ 70°C

TE0726-03M

Trenz Electronic GmbH

SBC ZYNQBERRY Z7010 HDMI USB ETH

Module/Board Type: FPGA
Core Processor: -
Co-Processor: Zynq-7000 (Z-7010)
Speed: 667MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: CSI, DSI
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,420

-

Zynq-7000 (Z-7010)

667MHz

16MB

512MB

CSI, DSI

1.57" x 1.18" (40mm x 30mm)

0°C ~ 70°C

TE0745-02-71I11-A

Trenz Electronic GmbH

SOM DDR3 1GB ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,504

ARM® Cortex®-A9

Zynq-7000 (Z-7030)

-

64MB

1GB

Samtec ST5

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

G120B-SM-373

GHI Electronics, LLC

IC MOD CORTEX-M3 120MHZ 96KB

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-M3
Co-Processor: -
Speed: 120MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 96KB (Internal), 16MB (External)
Connector Type: -
Size / Dimension: 1.50" x 1.05" (38.1mm x 26.7mm)
Operating Temperature: -40°C ~ 85°C (TA)

封裝: -

庫存5,040

ARM® Cortex®-M3

-

120MHz

512KB (Internal), 4MB (External)

96KB (Internal), 16MB (External)

-

1.50" x 1.05" (38.1mm x 26.7mm)

-40°C ~ 85°C (TA)

TE0726-03-41C74-R

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: -
Flash Size: 16MB
RAM Size: 128MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7010)

-

16MB

128MB

CSI, DSI

1.180" L x 1.570" W (30.00mm x 40.00mm)

0°C ~ 70°C

A20-SOM-E16GS16M

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1GHz
Flash Size: 8GB
RAM Size: 1GB
Connector Type: 40 Pin
Size / Dimension: 3.200" L x 2.200" W (81.28mm x 55.88mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

Request a Quote

ARM® Cortex®-A7

-

1GHz

8GB

1GB

40 Pin

3.200" L x 2.200" W (81.28mm x 55.88mm)

0°C ~ 70°C

TE0741-03-B3E-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

FORLINX-FET3588-C-248GSE64GCD11

Forlinx Embedded

Rockchip RK3588 SOM,8GBLPDDR4x,6

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76
Co-Processor: -
Speed: 2.4GHz
Flash Size: 64GB eMMC
RAM Size: 8GB
Connector Type: 4 x 100 Pin
Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

Request a Quote

ARM® Cortex®-A55, ARM® Cortex®-A76

-

2.4GHz

64GB eMMC

8GB

4 x 100 Pin

1.970" L x 2.677" W (50.00mm x 68.00mm)

0°C ~ 70°C

TE0808-04-BBE21-AK

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB ZU15G

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

5749-PX-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5749 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

ME-AA1-270-2I2-D11E-R2

Enclustra FPGA Solutions

SOM

Module/Board Type: FPGA
Core Processor: ARM Cortex-A9
Co-Processor: 10AS027E2F29I2SG
Speed: 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: USB
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

10AS027E2F29I2SG

1.5GHz

16GB

2GB

USB

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TEC0117-01

Trenz Electronic GmbH

FPGA MODULE WITH GOWIN LITTLEBEE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0722-04-41I-4-A

Trenz Electronic GmbH

DIPFORTY1 "SOFT PROPELLER" WITH

Module/Board Type: FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7: XC7Z010-1CLG225I
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: 2 x 20 Pin
Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Xilinx Zynq 7: XC7Z010-1CLG225I

-

16MB

-

2 x 20 Pin

2.008" L x 0.709" W (51.00mm x 18.00mm)

-40°C ~ 85°C

TE0741-04-B2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Kintex-7 FPGA XC7K160T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-ZX1-45-2I-D10-P-R3

Enclustra FPGA Solutions

SOM ZYNQ 7Z045 1GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Kintex-7
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存33

ARM® Dual-Core Cortex-A9

Kintex-7

800MHz

512MB

256MB, 1GB

168 Pin

2.520" L x 2.130" W (64.00mm x 54.00mm)

-40°C ~ 85°C

TE0813-02-5DE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

A10S-P9-A5E-RI-SB

Critical Link LLC

ARRIA 10 SOC MODULE, 480KLE, 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 4GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存27

ARM® Cortex®-A9

NEON™ SIMD

1.2GHz

-

4GB

Board-to-Board (BTB)

4.000" L x 4.000" W (101.50mm x 101.50mm)

-40°C ~ 85°C

TE0745-02-71I31-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB HEAT SPREADER

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.990" L x 2.130" W (76.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.990" L x 2.130" W (76.00mm x 54.00mm)

-40°C ~ 85°C

FORLINX-FET3588-C-244GSE32GCC11

Forlinx Embedded

Rockchip RK3588 SOM,4GBLPDDR4x,3

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76
Co-Processor: -
Speed: 2.4GHz
Flash Size: 32GB eMMC
RAM Size: 4GB
Connector Type: 4 x 100 Pin
Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM® Cortex®-A55, ARM® Cortex®-A76

-

2.4GHz

32GB eMMC

4GB

4 x 100 Pin

1.970" L x 2.677" W (50.00mm x 68.00mm)

0°C ~ 70°C

TE0803-03-4BI21-A

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

OSD32MP153A-512M-BAA

Octavo Systems LLC

SIP: 153A, 512MB, BAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

0°C ~ 85°C