Power Integrations introduces SCALE-iFlex™ LT NTC Series IGBT/SiC module gate drivers. The new gate drivers are compatible with popular 100mmx140mm IGBT half-bridge modules such as Mitsubishi LV100 and Infineon XHP 2, as well as silicon carbide (SiC) derived modules with voltages up to 2300V.
With the advent of the 5G era, the network is evolving in the direction of openness. Mobile network operators (Mnos) and communications service providers (CSPS) are looking for solutions that will reduce costs and speed up deployment to meet demanding network coverage and capacity targets in the coming years. This makes it a challenge for cellular providers to balance cost and performance in providing 4G, 5G, dual-mode, acer stations, and small indoor and outdoor base stations
While auto theft remains a legitimate concern, the security threat associated with internal electronic control units (ECUs) and their communications inside and outside the vehicle is significantly greater. About 50 percent of all new cars sold this year will be connected, and many estimate that number will be around 95 percent by 2030.
Following the EiceDRIVER™ 6ED223xS12T series of Silicon on Insulator (SOI) three-phase gate drivers, Infineon now further expands its product portfolio with the EiceDRIVER 2ED132xS12x series. The half-bridge configuration of the drive IC family complements the existing 1200V SOI family, providing customers with more choice as well as design flexibility.
As an authorized distributor of TE Connectivity, Heilind provides market services and support for related products. In addition, Heilind supplies products from many of the world's top manufacturers across 25 different component categories, focusing on all market segments and all customers, and continuously seeking a wide range of product offerings to cover all markets.
Infineon Technologies introduces a new automotive power module, HybridPACK™ Drive G2. The module inherits the mature HybridPACK Drive G1 integrated B6 package concept, offering scalability at the same size and scaling to higher power and ease of use. The HybridPACK Drive G2 family comes in different current and voltage ratings (750 V and 1200 V) and uses Infineon's next generation chip technologies, EDT3 (Silicon IGBT) and CoolSiC™ G2 MOSFET.
Infineon's NGC1081 will further expand its portfolio of NFC tag side controllers. This new single-chip IC solution enables Internet of Things industry customers to develop lower cost and smaller smart edge computing/sensing devices, ultimately maximizing benefits for end users and manufacturers.
Memsic, the world's leading supplier of inertial MEMS sensors, has released a new AMR geomagnetic sensor MMC5616WA, which is a new upgrade of the ultra-small AMR geomagnetic sensor MMC56x3 series produced by Meisin in large scale to meet the rich application scenarios including smart phones, wearable devices, drones, AR/VR, etc.
Toshiba Electronics Components and Storage announced the introduction of the new high-speed four-channel digital isolator "DCL54xx01" series featuring high common mode transient suppression (CMTI) of 100kV/μs (minimum) and high-speed data rates of 150Mbps.
Microchip Technology ATECC608B Encryption authentication device. The device provides ultra-secure encryption elements that allow for more secure connected systems and is ideal for a variety of iot applications such as home automation, iot node security and ID, industrial networking, messaging security and authentication, medical devices, ecosystem control and anti-cloning.
Alpha and Omega Semiconductor Ltd. has released the 600V aMOS7 Super Junction mosfet series. The device is the company's next generation high voltage MosFeTs designed to meet high efficiency and high density requirements for telecommunication rectifiers, solar inverters, servers, workstations, electric vehicle charging, motor drives and industrial power applications.
Semtech Corporation, a provider of high-performance semiconductors, Internet of Things systems and cloud connectivity services, announced the launch of LoRa Connect LR1121, a new transceiver for Internet of Things endpoints that offers lower power consumption, global connectivity and long-distance communication, extending its market-leading LoRa portfolio.
The Power Communication Committee of the Chinese Society of Electrical Engineering held the "Seminar on Key Technologies of Risk Control of Power Backbone Transmission Network" in Wuhan, Hubei Province, gathering nearly 100 experts and scholars in the power communication industry from all over the country. As a member unit of the Society of Electrical Engineering, Optoelectronic Technology made a special report at the conference, and developed the industry's first highly integrated optoelectronic integrated distributed optical fiber sensing OSM module.
To meet the growing demand for energy efficiency and sustainability in buildings, weather, environmental and industrial measurement equipment manufacturer Vaisala has expanded its heating, ventilation and air conditioning (HVAC) portfolio with the introduction of the new Vaisala GMD110 CO2 transmitter.
The DS4 Intelligent Oxygen sensor from EC Sense is an industrial-grade intelligent gas sensor using reliable printed solid polymer electrochemical sensor technology. Small volume and compact structure design, using high-performance microprocessor, equipped with high precision ADC, as well as intelligent algorithm design, can be easily integrated into the Internet of Things and other monitoring systems, widely used in industrial, commercial, civil and medical fields.
Abracon's supercapacitors use the industry's latest two-layer technology to achieve high energy and high power density. With different combinations of these two characteristics, these ultracapacitors can be used in applications requiring fast charge/discharge or long lasting power output. Abracon supercapacitors can operate in the temperature range as low as -40C where conventional batteries cannot be used.
Infineon Technologies has announced that QDPAK and DDPAK Top Cooled (TSC) packages for its high-voltage MOSFET devices have been successfully registered as JEDEC standard. This move not only further strengthens Infineon's goal to extend the standard package design and shape of the TSC package to a wide range of new designs, but also gives Oems more flexibility and advantage to create differentiated products in the market and raise power density to even higher levels to support a variety of applications.
Infineon Technologies has released a new power module for the car :HybridPACK Drive G2. It builds on its established HybridPACK Drive G1 concept in the integrated B6 package, offering scalability in the same footprint and extending it to higher power and ease of use.
