ISM330IS and ISN330ISN iNEMO inertial modules from STMicroelectronics. These modules combine a three-axis digital accelerometer with a three-axis digital gyroscope and are integrated system-level packaging solutions. The always-on, low-power nature enables these inertial modules to deliver outstanding performance in industrial and Internet of Things (IoT) applications, including industrial robotics, asset tracking, condition monitoring, and complex motion detection.
Nano Micro announced the launch of CMOS-MEMS based relative humidity (RH) and temperature sensor NSHT30. The NSHT30 integrates a complete sensor system on a single chip, including capacitive relative humidity sensor, COMS temperature sensor and signal processor and I2C digital communication interface, in the DFN and LGA packages 2.5mm x 2.5mm x 0.9mm. Its I2C interface communication mode, minimal packaging and low power characteristics allow NSHT30 to be more widely integrated into a variety of applications
Diodes announced new additions to its portfolio of synchronous step-down converters. The AP62500 and AP62800 have continuous output current ratings of 5A and 8A, respectively, giving engineers more flexibility when developing point-of load (POL) solutions optimized for efficiency or size.
EPC9186, a three-phase BLDC motor driven inverter based on EPC2302 eGaN® FeTs, has been introduced by EPC9186. EPC9186 supports a wide input DC voltage ranging from 14 V to 80 V. High-power EPC9186 supports applications such as electric scooters, small electric vehicles, agricultural machinery, forklifts and high-power drones.
Southco, a leading global provider of engineering hardware solutions, has added a new product to the compression door lock. The new E3 VISE ACTION compression door lock with locking indication provides visual confirmation status with a reflective bright red clear indication to open or close.
Onsemi introduces the Hyperlux line of automotive image sensors with a 2.1µm pixel size, industry-leading 150dB ultra-high dynamic range (HDR) and LED flicker reduction (LFM) capabilities to deliver high performance, high speed and advanced features across the temperature range of automotive applications. Advancing the development of the next generation of Advanced Driver assistance systems (ADAS). HyperLux also supports a smooth transition to L2+ level autopilot, which only requires the driver to take over the wheel when alerted by the technology.
Infineon's OPTIGA™ Trust M iot security development suite. OPTIGA™ Trust M iot Security Development Suite is used to develop and evaluate end-to-end security use cases for smart homes, industrial automation, and enterprise devices, among others.
Nexperia has significantly raised the standard of design support for semiconductor engineers by announcing a new generation of interactive data manuals for use with power mosFeTs. By manipulating the interactive slider in the data manual, users can manually adjust the voltage, current, temperature and other conditions of their circuit application and observe how the operating point of the device dynamically responds to these changes.
The InnoSwitch3-EP IC's 750V PowiGaN switch achieves lower on-off and on-off losses, eliminates the need for metal fins and reduces the associated vibration effects. Powigan-based devices are also extremely reliable and durable, protecting the system from voltage spikes even during longer-lasting input surges and quickly recovering after the surge is over.
Nexperia has announced the availability of its first E-mode (enhanced) power GaN FeTs for low voltage (100/150 V) and high voltage (650 V) applications. Nexperia has added seven new E-mode devices to its cascading GaN nitride product portfolio, providing designers with the best options from gan FeTs to other silicon-based power devices.
Onsemi has launched the latest generation of 1200V EliteSiC Silicon Carbide (SiC) M3S devices to help power electronics engineers achieve greater energy efficiency and lower system costs. The new product line includes EliteSiC MosFeTs and modules that help increase switching speeds for a growing number of 800-V electric vehicle (EV) on-board chargers (OBCs) and energy infrastructure applications such as EV DC fast charging, solar solutions, and energy storage.
Microchip Technology announced the launch of Silicon Carbide (SiC) electronic Fuse (E-Fuse) demo boards. The device is available in six models for 400-800V battery systems with current ratings up to 30 amps. SiC power solutions offer the industry's broadest and most flexible portfolio of MosFETs, diodes and grid drivers, including bare chip, discrete devices, modules and customizable power modules.
Infineon Technologies AG, a global leader in automotive semiconductors, and FoxconnTechnology Group, the world's largest technology manufacturer and service provider, announced that they have signed a memorandum of understanding to establish a long-term partnership in the field of electric vehicles. The two sides will work together to develop electric vehicles with high energy efficiency and advanced intelligent features.
ScioSense, the industry leader in environmental and high-precision flow and time measurement sensor chips, announced the introduction of ENS161, a low-power, multi-gas sensor that enables continuous air quality monitoring in wearable and portable devices powered only by small capacity batteries.
Power Integrations offers new single-channel plug and play gate drivers for IHM and IHV IGBT modules up to 190mmx140mm. The 1SP0635V2A0D combines Power Integrations proven and reliable SCALE-2™ switching performance and protection with a configurable isolated serial output interface to enhance driver setup flexibility and provide comprehensive telemeting reporting for accurate lifetime estimates
Infineon Technologies extends the technology process of the SECORA™ Pay solution portfolio to 28nm. Innovative product design enables Infineon to further break the limits of payment card technology. In doing so, the product also provides the latest technology in a reliable sourcing option for payment ecosystems in major regional markets. The new product family is the first of its kind in the market to apply the leading 28 nm chip technology to embedded nonvolatile memory.
Rohm, the world's leading semiconductor manufacturer, will participate in 2023PCIM Europe, which will be held in Nuremberg, Germany, from May 9 to 11. PCIM Europe is the world's top exhibition and seminar for the power electronics industry. At that time, ROM will showcase its new power semiconductors that advance sustainable technologies, including high-performance solutions for the electric vehicle sector and beyond
Transphorm has announced the release of its 1200 volt FET simulation model and preliminary data sheet. TP120H070WS Field effect transistor is the only 1200 volt GaN-on-Sapphire power semiconductor launched to date, which is the first of its kind. Its launch demonstrates Transphorm's ability to support future automotive power systems, as well as three-phase power systems already commonly used in the industrial, data communications and renewable energy markets.
