頁 21 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FF668	Xilinx Inc.	FF668 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,080
XC17128ELVO8I	Xilinx Inc.	IC 3V SER CFG PROM 128K 8-SOIC Programmable Type: OTP Memory Size: 128kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存6,736
XC17256EPC20C	Xilinx Inc.	IC SERIAL CFG PROM 256K 20-PLCC Programmable Type: OTP Memory Size: 256Kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存6,480
XCZU9CG-L1FFVB1156I	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存3,984
XCZU2EG-3SFVA625E	Xilinx Inc.	IC FPGA 180 I/O 625FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	封裝: 625-BFBGA, FCBGA	庫存2,768
XC7Z030-2FFG676E	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,440
XC5VSX50T-1FFG665CES	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存2,752
XCV1000E-7FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 512 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存6,276
XCS20XL-5VQ100C	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 77 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存6,240
XC4008E-3PG191C	Xilinx Inc.	IC FPGA 144 I/O 191CPGA Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 144 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 191-BCPGA Supplier Device Package: 191-CPGA (47.25x47.25)	封裝: 191-BCPGA	庫存7,552
XC4003E-4VQ100C	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 77 Number of Gates: 3000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存7,776
XCVU080-3FFVD1517E	Xilinx Inc.	IC FPGA 338 I/O 1517FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.970 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,720
XCKU095-1FFVB2104I	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 60518400 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存7,744
XC7VX485T-2FFG1761C	Xilinx Inc.	IC FPGA 700 I/O 1761FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,128
XC5VLX155T-1FF1136I	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 12160 Number of Logic Elements/Cells: 155648 Total RAM Bits: 7815168 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存4,224
XC6VLX240T-L1FFG784I	Xilinx Inc.	IC FPGA 400 I/O 784FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (29x29)	封裝: 784-BBGA, FCBGA	庫存6,352
XC5VLX85-3FF676C	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存4,096
XC2VP30-6FFG896C	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存4,896
XQ6SLX150T-3CSG484I	Xilinx Inc.	IC FPGA SPARTAN-6Q 484-CSBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-FBGA, CSPBGA	庫存7,776
XC2VP4-5FGG456C	Xilinx Inc.	IC FPGA 248 I/O 456FBGA Number of LABs/CLBs: 752 Number of Logic Elements/Cells: 6768 Total RAM Bits: 516096 Number of I/O: 248 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存5,456
XC2S100-6PQ208C	Xilinx Inc.	IC FPGA 140 I/O 208QFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 140 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存5,504
XC3S400-4PQ208C	Xilinx Inc.	IC FPGA 141 I/O 208QFP Number of LABs/CLBs: 896 Number of Logic Elements/Cells: 8064 Total RAM Bits: 294912 Number of I/O: 141 Number of Gates: 400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存4,224
XC3S50-4PQ208C	Xilinx Inc.	IC FPGA 124 I/O 208QFP Number of LABs/CLBs: 192 Number of Logic Elements/Cells: 1728 Total RAM Bits: 73728 Number of I/O: 124 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,048
XC7A200T-1FBG484C	Xilinx Inc.	IC FPGA ARTIX7 285 I/O 484FCBGA Number of LABs/CLBs: 16825 Number of Logic Elements/Cells: 215360 Total RAM Bits: 13455360 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存8,028
XC3S50A-4TQG144I	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 176 Number of Logic Elements/Cells: 1584 Total RAM Bits: 55296 Number of I/O: 108 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存9,672
XC95216-15HQ208C	Xilinx Inc.	IC CPLD 216MC 15NS 208HQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 166 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存6,112
XC7Z030-2FF676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: - Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,360
XCVU9P-3FSGD2104E	Xilinx Inc.	XCVU9P-3FSGD2104E Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Total RAM Bits: 391168000 Number of I/O: 676 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存5,200

XCMECH-FF668

Xilinx Inc.

FF668 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,080

XC17128ELVO8I

Xilinx Inc.

IC 3V SER CFG PROM 128K 8-SOIC

Programmable Type: OTP
Memory Size: 128kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存6,736

XC17256EPC20C

Xilinx Inc.

IC SERIAL CFG PROM 256K 20-PLCC

Programmable Type: OTP
Memory Size: 256Kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存6,480

XCZU9CG-L1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存3,984

XCZU2EG-3SFVA625E

Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)

封裝: 625-BFBGA, FCBGA

庫存2,768

XC7Z030-2FFG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,440

XC5VSX50T-1FFG665CES

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 4080
Number of Logic Elements/Cells: 52224
Total RAM Bits: 4866048
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存2,752

XCV1000E-7FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 6144
Number of Logic Elements/Cells: 27648
Total RAM Bits: 393216
Number of I/O: 512
Number of Gates: 1569178
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存6,276

XCS20XL-5VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 77
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存6,240

XC4008E-3PG191C

Xilinx Inc.

IC FPGA 144 I/O 191CPGA

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 144
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 191-BCPGA
Supplier Device Package: 191-CPGA (47.25x47.25)

封裝: 191-BCPGA

庫存7,552

XC4003E-4VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: 238
Total RAM Bits: 3200
Number of I/O: 77
Number of Gates: 3000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存7,776

XCVU080-3FFVD1517E

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,720

XCKU095-1FFVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 60518400
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存7,744

XC7VX485T-2FFG1761C

Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,128

XC5VLX155T-1FF1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Number of LABs/CLBs: 12160
Number of Logic Elements/Cells: 155648
Total RAM Bits: 7815168
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存4,224

XC6VLX240T-L1FFG784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (29x29)

封裝: 784-BBGA, FCBGA

庫存6,352

XC5VLX85-3FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3538944
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存4,096

XC2VP30-6FFG896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

Number of LABs/CLBs: 3424
Number of Logic Elements/Cells: 30816
Total RAM Bits: 2506752
Number of I/O: 556
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存4,896

XQ6SLX150T-3CSG484I

Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

庫存7,776

XC2VP4-5FGG456C

Xilinx Inc.

IC FPGA 248 I/O 456FBGA

Number of LABs/CLBs: 752
Number of Logic Elements/Cells: 6768
Total RAM Bits: 516096
Number of I/O: 248
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存5,456

XC2S100-6PQ208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 140
Number of Gates: 100000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存5,504

XC3S400-4PQ208C

Xilinx Inc.

IC FPGA 141 I/O 208QFP

Number of LABs/CLBs: 896
Number of Logic Elements/Cells: 8064
Total RAM Bits: 294912
Number of I/O: 141
Number of Gates: 400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存4,224

XC3S50-4PQ208C

Xilinx Inc.

IC FPGA 124 I/O 208QFP

Number of LABs/CLBs: 192
Number of Logic Elements/Cells: 1728
Total RAM Bits: 73728
Number of I/O: 124
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,048

XC7A200T-1FBG484C

Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

Number of LABs/CLBs: 16825
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存8,028

XC3S50A-4TQG144I

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

Number of LABs/CLBs: 176
Number of Logic Elements/Cells: 1584
Total RAM Bits: 55296
Number of I/O: 108
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存9,672

XC95216-15HQ208C

Xilinx Inc.

IC CPLD 216MC 15NS 208HQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 216
Number of Gates: 4800
Number of I/O: 166
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存6,112

XC7Z030-2FF676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,360

XCVU9P-3FSGD2104E

Xilinx Inc.

XCVU9P-3FSGD2104E

Number of LABs/CLBs: 147780
Number of Logic Elements/Cells: 2586150
Total RAM Bits: 391168000
Number of I/O: 676
Number of Gates: -
Voltage - Supply: 0.873 V ~ 0.927 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存5,200