Xilinx Inc. 產品

XCZU17EG-3FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

XC7Z035-L2FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

XCZU3CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

XCZU3CG-2SFVC784E

Xilinx Inc.

XCZU3CG-2SFVC784E

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

XCZU3CG-1SFVA625E

Xilinx Inc.

XCZU3CG-1SFVA625E

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

封裝: 625-BFBGA, FCBGA

XC7K325T-1FFG676CES9937

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XC2V2000-5FGG676C

Xilinx Inc.

IC FPGA 456 I/O 676FBGA

• Number of LABs/CLBs: 2688
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1032192
• Number of I/O: 456
• Number of Gates: 2000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

XC5VLX30-1FFG324CES

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 30720
• Total RAM Bits: 1179648
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

封裝: 324-BBGA, FCBGA

XC4010XL-2TQ176C

Xilinx Inc.

IC FPGA 145 I/O 176TQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 145
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 176-LQFP
• Supplier Device Package: 176-TQFP (24x24)

封裝: 176-LQFP

XC4010XL-09PQ100C

Xilinx Inc.

IC FPGA 77 I/O 100QFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 77
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

XCVU125-2FLVB2104E

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

• Number of LABs/CLBs: 89520
• Number of Logic Elements/Cells: 1566600
• Total RAM Bits: 90726400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

XC7VX415T-3FFG1157E

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

• Number of LABs/CLBs: 32200
• Number of Logic Elements/Cells: 412160
• Total RAM Bits: 32440320
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC6VLX240T-2FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC6VHX255T-1FFG1155C

Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

• Number of LABs/CLBs: 19800
• Number of Logic Elements/Cells: 253440
• Total RAM Bits: 19021824
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC5VLX85-3FFG1153C

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

• Number of LABs/CLBs: 6480
• Number of Logic Elements/Cells: 82944
• Total RAM Bits: 3538944
• Number of I/O: 560
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

XQ4VFX100-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-4FX DIE

• Number of LABs/CLBs: 10544
• Number of Logic Elements/Cells: 94896
• Total RAM Bits: 6930432
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: Die
• Supplier Device Package: Die

封裝: Die

XC6SLX150T-3FG676I

Xilinx Inc.

IC FPGA 396 I/O 676FCBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XC6SLX150-3FG900I

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

XC7A50T-1CSG324C

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

XA3S500E-4CPG132Q

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 92
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

封裝: 132-TFBGA, CSPBGA

XC3S200A-4VQ100C

Xilinx Inc.

IC FPGA 68 I/O 100VQFP

• Number of LABs/CLBs: 448
• Number of Logic Elements/Cells: 4032
• Total RAM Bits: 294912
• Number of I/O: 68
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

XC6SLX45-2CSG484C

Xilinx Inc.

IC FPGA 320 I/O 484CSBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 320
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

XC3S1000-4FTG256C

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 173
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XC95108-15PQ100I

Xilinx Inc.

IC CPLD 108MC 15NS 100QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 6
• Number of Macrocells: 108
• Number of Gates: 2400
• Number of I/O: 81
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

XC95288XL-10CSG280C

Xilinx Inc.

IC CPLD 288MC 10NS 280CSBGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 192
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 280-TFBGA, CSPBGA
• Supplier Device Package: 280-CSBGA (16x16)

封裝: 280-TFBGA, CSPBGA

XC9572XL-7VQ64C

Xilinx Inc.

IC CPLD 72MC 7.5NS 64VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 52
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-VQFP (10x10)

封裝: 64-TQFP

XC7S50-2FTGB196I

Xilinx Inc.

XC7S50-2FTGB196I

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 196-LBGA, CSPBGA
• Supplier Device Package: 196-CSBGA (15x15)

封裝: 196-LBGA, CSPBGA

XCKU3P-L1FFVB676I

Xilinx Inc.

XCKU3P-L1FFVB676I

• Number of LABs/CLBs: 20340
• Number of Logic Elements/Cells: 355950
• Total RAM Bits: 31641600
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA