頁 19 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17256EPDG8C	Xilinx Inc.	IC PROM SERIAL 256K 8-DIP Programmable Type: OTP Memory Size: 256Kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存2,880
XC17S30ASO20C	Xilinx Inc.	IC PROM SER 30000 C-TEMP 20-SOIC Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存7,136
XC17S20PD8I	Xilinx Inc.	IC PROM PROG I-TEMP 5V 8-DIP Programmable Type: OTP Memory Size: 200kb Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存4,624
XQR17V16CK44V	Xilinx Inc.	IC MEM PROM 16MB 3.3V 44PIN Programmable Type: OTP Memory Size: 16Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -55°C ~ 125°C (TC) Package / Case: 44-CCC (J-Lead) Supplier Device Package: 44-CCCP (16.51x16.51)	封裝: 44-CCC (J-Lead)	庫存7,120
XCZU6EG-L2FFVB1156E	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,040
XCZU7CG-2FFVC1156I	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存2,080
XCZU9CG-L1FFVC900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,040
XCZU4EG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存2,784
XC7Z015-3CLG485E	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 485BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 866MHz Primary Attributes: Artix?-7 FPGA, 74K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19)	封裝: 484-LFBGA, CSPBGA	庫存3,856
XC6SLX150-N3FG900C	Xilinx Inc.	IC FPGA 576 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存7,712
XC2V6000-6FFG1152C	Xilinx Inc.	IC FPGA 824 I/O 1152FCBGA Number of LABs/CLBs: 8448 Number of Logic Elements/Cells: - Total RAM Bits: 2654208 Number of I/O: 824 Number of Gates: 6000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,952
XCV150-5PQ240I	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 166 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存12,756
XC4085XL-09BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 3136 Number of Logic Elements/Cells: 7448 Total RAM Bits: 100352 Number of I/O: 352 Number of Gates: 85000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存4,976
XC4028XL-2HQ160C	Xilinx Inc.	IC FPGA 129 I/O 160HQFP Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 129 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Exposed Pad Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP Exposed Pad	庫存3,840
XC4020XL-1PQ240I	Xilinx Inc.	IC FPGA 192 I/O 240QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 192 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存6,576
XC4020XL-09PQ208C	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 160 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,440
XC7VX1140T-1FL1928C	Xilinx Inc.	IC FPGA 480 I/O 1928FCBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 1139200 Total RAM Bits: 69304320 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1928-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存7,568
XC7VX690T-L2FFG1930E	Xilinx Inc.	IC FPGA 1000 I/O 1930FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 1000 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1930-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存4,336
XC6VSX475T-1FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 37200 Number of Logic Elements/Cells: 476160 Total RAM Bits: 39223296 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,424
XQ7VX330T-1RF1157M	Xilinx Inc.	IC FPGA VIRTEX-7 330K 1157BGA Number of LABs/CLBs: 25500 Number of Logic Elements/Cells: 326400 Total RAM Bits: 27648000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,184
XC5VLX155-1FFG1760C	Xilinx Inc.	IC FPGA 800 I/O 1760FBGA Number of LABs/CLBs: 12160 Number of Logic Elements/Cells: 155648 Total RAM Bits: 7077888 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存5,248
XCKU3P-2FFVD900E	Xilinx Inc.	XCKU3P-2FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 26828800 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,392
XC5VLX50-2FFG1153C	Xilinx Inc.	IC FPGA 560 I/O 1153FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 1769472 Number of I/O: 560 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	封裝: 1153-BBGA, FCBGA	庫存2,240
XC2VP7-6FFG896C	Xilinx Inc.	IC FPGA 396 I/O 896FCBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存6,288
XC7A15T-L1CSG324I	Xilinx Inc.	IC FPGA ARTIX7 210 I/O 324CSBGA Number of LABs/CLBs: 1300 Number of Logic Elements/Cells: 16640 Total RAM Bits: 921600 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存5,184
XC7K325T-2FBG676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,552
XC95288XL-10CS280C	Xilinx Inc.	IC CPLD 288MC 10NS 280CSBGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	封裝: 280-TFBGA, CSPBGA	庫存4,944
XA7S25-2CSGA225I	Xilinx Inc.	XA7S25-2CSGA225I Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存6,048

XC17256EPDG8C

Xilinx Inc.

IC PROM SERIAL 256K 8-DIP

Programmable Type: OTP
Memory Size: 256Kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存2,880

XC17S30ASO20C

Xilinx Inc.

IC PROM SER 30000 C-TEMP 20-SOIC

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存7,136

XC17S20PD8I

Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

Programmable Type: OTP
Memory Size: 200kb
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存4,624

XQR17V16CK44V

Xilinx Inc.

IC MEM PROM 16MB 3.3V 44PIN

Programmable Type: OTP
Memory Size: 16Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -55°C ~ 125°C (TC)
Package / Case: 44-CCC (J-Lead)
Supplier Device Package: 44-CCCP (16.51x16.51)

封裝: 44-CCC (J-Lead)

庫存7,120

XCZU6EG-L2FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,040

XCZU7CG-2FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存2,080

XCZU9CG-L1FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,040

XCZU4EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存2,784

XC7Z015-3CLG485E

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 485BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 866MHz
Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 485-CSBGA (19x19)

封裝: 484-LFBGA, CSPBGA

庫存3,856

XC6SLX150-N3FG900C

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存7,712

XC2V6000-6FFG1152C

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

Number of LABs/CLBs: 8448
Number of Logic Elements/Cells: -
Total RAM Bits: 2654208
Number of I/O: 824
Number of Gates: 6000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,952

XCV150-5PQ240I

Xilinx Inc.

IC FPGA 166 I/O 240QFP

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 166
Number of Gates: 164674
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存12,756

XC4085XL-09BG432C

Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Number of LABs/CLBs: 3136
Number of Logic Elements/Cells: 7448
Total RAM Bits: 100352
Number of I/O: 352
Number of Gates: 85000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存4,976

XC4028XL-2HQ160C

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

Number of LABs/CLBs: 1024
Number of Logic Elements/Cells: 2432
Total RAM Bits: 32768
Number of I/O: 129
Number of Gates: 28000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 160-BQFP Exposed Pad
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP Exposed Pad

庫存3,840

XC4020XL-1PQ240I

Xilinx Inc.

IC FPGA 192 I/O 240QFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 192
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存6,576

XC4020XL-09PQ208C

Xilinx Inc.

IC FPGA 160 I/O 208QFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 160
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,440

XC7VX1140T-1FL1928C

Xilinx Inc.

IC FPGA 480 I/O 1928FCBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 1139200
Total RAM Bits: 69304320
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1928-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存7,568

XC7VX690T-L2FFG1930E

Xilinx Inc.

IC FPGA 1000 I/O 1930FCBGA

Number of LABs/CLBs: 54150
Number of Logic Elements/Cells: 693120
Total RAM Bits: 54190080
Number of I/O: 1000
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1930-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存4,336

XC6VSX475T-1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 37200
Number of Logic Elements/Cells: 476160
Total RAM Bits: 39223296
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,424

XQ7VX330T-1RF1157M

Xilinx Inc.

IC FPGA VIRTEX-7 330K 1157BGA

Number of LABs/CLBs: 25500
Number of Logic Elements/Cells: 326400
Total RAM Bits: 27648000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,184

XC5VLX155-1FFG1760C

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

Number of LABs/CLBs: 12160
Number of Logic Elements/Cells: 155648
Total RAM Bits: 7077888
Number of I/O: 800
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存5,248

XCKU3P-2FFVD900E

Xilinx Inc.

XCKU3P-2FFVD900E

Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM Bits: 26828800
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,392

XC5VLX50-2FFG1153C

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 1769472
Number of I/O: 560
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1153-BBGA, FCBGA
Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

庫存2,240

XC2VP7-6FFG896C

Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

Number of LABs/CLBs: 1232
Number of Logic Elements/Cells: 11088
Total RAM Bits: 811008
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存6,288

XC7A15T-L1CSG324I

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

Number of LABs/CLBs: 1300
Number of Logic Elements/Cells: 16640
Total RAM Bits: 921600
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存5,184

XC7K325T-2FBG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,552

XC95288XL-10CS280C

Xilinx Inc.

IC CPLD 288MC 10NS 280CSBGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 280-TFBGA, CSPBGA
Supplier Device Package: 280-CSBGA (16x16)

封裝: 280-TFBGA, CSPBGA

庫存4,944

XA7S25-2CSGA225I

Xilinx Inc.

XA7S25-2CSGA225I

Number of LABs/CLBs: 1825
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存6,048