頁 38 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  38/351
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5ASXMB5E6F31C6N
Intel

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封裝: 896-BBGA, FCBGA
庫存3,296
ES1020QI
Intel

IC CONTROLLER SEQUENCING 24QFN

  • Applications: Power Supply Sequencer
  • Voltage - Input: -
  • Voltage - Supply: 1.5 V ~ 5 V
  • Current - Supply: 200µA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-QFN (4x4)
封裝: 24-VFQFN Exposed Pad
庫存6,784
MPF10K50QC240AB
Intel

IC FPGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存5,648
hot EPF10K50VQC240-3
Intel

IC FPGA 189 I/O 240QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 20480
  • Number of I/O: 189
  • Number of Gates: 116000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存4,336
hot EP20K100EFI324-2X
Intel

IC FPGA 246 I/O 324FBGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 246
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
封裝: 324-BGA
庫存4,576
10M08DCF484C8G
Intel

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存5,456
5SGSED8N3F45C2L
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存7,040
5SGXEA7N2F45C1N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存4,880
EP2S180F1508C4N
Intel

IC FPGA 1170 I/O 1508FBGA

  • Number of LABs/CLBs: 8970
  • Number of Logic Elements/Cells: 179400
  • Total RAM Bits: 9383040
  • Number of I/O: 1170
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1508-BBGA, FCBGA
  • Supplier Device Package: 1508-FBGA (30x30)
封裝: 1508-BBGA, FCBGA
庫存7,744
EP4SGX290HF35C2
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存4,688
EP4SE360F35C2N
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 14144
  • Number of Logic Elements/Cells: 353600
  • Total RAM Bits: 23105536
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存7,744
5SGSMD8K3F40C3N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,584
EP3SL200H780C3N
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 200000
  • Total RAM Bits: 10901504
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封裝: 780-BBGA, FCBGA
庫存3,520
5AGZME5H2F35I3LN
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 18870
  • Number of Logic Elements/Cells: 400000
  • Total RAM Bits: 34322432
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存7,088
5SGXEB5R3F40C2LN
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 48927744
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,424
5SGXEABK2H40I2N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封裝: 1517-BBGA, FCBGA
庫存3,264
10AX066K4F40E3SG
Intel

IC FPGA 696 I/O 1517FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存3,280
hot EP2AGX125EF35C5N
Intel

IC FPGA 452 I/O 1152FBGA

  • Number of LABs/CLBs: 4964
  • Number of Logic Elements/Cells: 118143
  • Total RAM Bits: 8315904
  • Number of I/O: 452
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,696
EP3SE50F484C3
Intel

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 5760000
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA, FCBGA
庫存5,584
hot EP2C50F672C8N
Intel

IC FPGA 450 I/O 672FBGA

  • Number of LABs/CLBs: 3158
  • Number of Logic Elements/Cells: 50528
  • Total RAM Bits: 594432
  • Number of I/O: 450
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BGA
庫存10,200
5CEBA2U15I7N
Intel

IC FPGA 176 I/O 324UBGA

  • Number of LABs/CLBs: 9434
  • Number of Logic Elements/Cells: 25000
  • Total RAM Bits: 2002944
  • Number of I/O: 176
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA
  • Supplier Device Package: 324-UBGA (15x15)
封裝: 324-LFBGA
庫存6,800
hot EPM570T144I5N
Intel

IC CPLD 440MC 5.4NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存14,808
RJ80530VY650256
Intel

IC MPU INTEL CEL 650MHZ 479BGA

  • Core Processor: Mobile Intel® Celeron®
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 650MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.1V
  • Operating Temperature: 100°C (TJ)
  • Security Features: -
  • Package / Case: 479-BBGA, FCBGA
  • Supplier Device Package: 479-FCBGA (35x35)
封裝: -
Request a Quote
5SGSMD8K3F40C3G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
AGFA019R24C2I1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
AGID023R18A2E2VR0
Intel

IC FPGA AGILEX-I 1805FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
MR27C6435
Intel

IC EPROM 64KBIT PARALLEL 32PLCC

  • Memory Type: Non-Volatile
  • Memory Format: EPROM
  • Technology: EPROM - UV
  • Memory Size: 64Kbit
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: -
  • Access Time: 350 ns
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-LCC
  • Supplier Device Package: 32-PLCC
封裝: -
Request a Quote
1ST085ES3F50I3XG
Intel

IC FPGA STRATIX10TX 2397FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 841000
  • Total RAM Bits: 71303168
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封裝: -
Request a Quote