Intel 產品

U87C196MCSF81

Intel

IC MCU 16BIT 16KB OTP 64SDIP

• Core Processor: MCS 96
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: PWM, WDT
• Number of I/O: 53
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 64-SDIP
• Supplier Device Package: -

封裝: 64-SDIP

10AS048H2F34I1SG

Intel

IC SOC FPGA 492 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 480K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

ED8106N00QI

Intel

IC REG CTRLR BUCK 24QFN

• Output Type: PWM Signal
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.25 V
• Frequency - Switching: 500kHz ~ 1MHz
• Duty Cycle (Max): 100%
• Synchronous Rectifier: -
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Power Good
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN (4x4)

封裝: 24-VFQFN Exposed Pad

HC1S60F1020NBZ

Intel

IC FPGA APEX 1020FBGA

• Number of LABs/CLBs: 5712
• Number of Logic Elements/Cells: 57120
• Total RAM Bits: 5215104
• Number of I/O: 782
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

EP10K50SBC356-1XDM

Intel

IC FPGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

EPF10K20RI208-4N

Intel

IC FPGA 147 I/O 208RQFP

• Number of LABs/CLBs: 144
• Number of Logic Elements/Cells: 1152
• Total RAM Bits: 12288
• Number of I/O: 147
• Number of Gates: 63000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BFQFP Exposed Pad

EP2AGX125EF29I3

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: 4964
• Number of Logic Elements/Cells: 118143
• Total RAM Bits: 8315904
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

5SGXMA7N3F45C2N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

10AX090R4F40E3LG

Intel

IC FPGA 342 I/O 1517FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 342
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

5SGXMA7N3F40C2LN

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

EP1AGX60CF484C6N

Intel

IC FPGA 229 I/O 484FBGA

• Number of LABs/CLBs: 3005
• Number of Logic Elements/Cells: 60100
• Total RAM Bits: 2528640
• Number of I/O: 229
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

5CGXFC7C6U19C6N

Intel

IC FPGA 240 I/O 484UBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

10CX220YF672I6G

Intel

672-PIN FBGA

• Number of LABs/CLBs: 80330
• Number of Logic Elements/Cells: 220000
• Total RAM Bits: 13752320
• Number of I/O: 236
• Number of Gates: -
• Voltage - Supply: 0.9V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

EP4CE55F29C8L

Intel

IC FPGA 374 I/O 780FBGA

• Number of LABs/CLBs: 3491
• Number of Logic Elements/Cells: 55856
• Total RAM Bits: 2396160
• Number of I/O: 374
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

EPM7032BTC44-7

Intel

IC CPLD 32MC 7.5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 600
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

EPM7128STC100-10N

Intel

IC CPLD 128MC 10NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

EPM7128SLC84-6

Intel

IC CPLD 128MC 6NS 84PLCC

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 68
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

5SGXMA7N3F40I4G

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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FC80960HD80

Intel

IC MPU 80MHZ 208QFP

• Core Processor: i960
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 85°C (TC)
• Security Features: -
• Package / Case: 208-QFP
• Supplier Device Package: 208-PQFP

封裝: -

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5SGXMA7H2F35C1G

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXEF40I2LNAD

Intel

IC FPGA STRATIX V GX FLIP CHIP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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MT28F010-90

Intel

IC FLASH 1MBIT PARALLEL 32PLCC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mbit
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 90ns
• Access Time: 90 ns
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-LCC (J-Lead)
• Supplier Device Package: 32-PLCC

封裝: -

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AGFA019R25A3E3E

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

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AGIB023R18A1I1V

Intel

IC FPGA AGILEX-I 1805FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1805-BBGA Exposed Pad
• Supplier Device Package: 1805-BGA (42.5x42.5)

封裝: -

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5SGSMD4H3F35I4WN

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXEA4K1F35I2G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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EP2C15AF484C6NES

Intel

IC FPGA 315 I/O 484FBGA

• Number of LABs/CLBs: 903
• Number of Logic Elements/Cells: 14448
• Total RAM Bits: 239616
• Number of I/O: 315
• Number of Gates: -
• Voltage - Supply: 1.15V ~ 1.25V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: -

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RJ80530NZ001256

Intel

IC MPU 1 1GHZ 479FCBGA

• Core Processor: Mobile Intel® Celeron® Processor
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1GHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.4V
• Operating Temperature: 100°C (TJ)
• Security Features: -
• Package / Case: 479-BBGA, FCBGA
• Supplier Device Package: 479-FCBGA (35x35)

封裝: -

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