頁 37 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
1SX280LN2F43E2VG	Intel	1760-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存7,760
10AS027E2F29I2LG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,032
EP1SGX10CF672C6NGA	Intel	IC FPGA STRATIX GX 672FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 362 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存4,592
10AX032H2F35I1SG	Intel	IC FPGA 384 I/O 1152FCBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 384 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,040
XC40200XV-07BG560C	Intel	IC FPGA APEX 560BGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,824
10M08SCE144C7G	Intel	IC FPGA/CPLD NV 144EQFP Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 101 Number of Gates: - Voltage - Supply: 2.85 V ~ 3.465 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存3,424
EP20K300EQC240-3N	Intel	IC FPGA 152 I/O 240QFP Number of LABs/CLBs: 1152 Number of Logic Elements/Cells: 11520 Total RAM Bits: 147456 Number of I/O: 152 Number of Gates: 728000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BQFP	庫存6,624
EP20K200RC208-1V	Intel	IC FPGA 144 I/O 208RQFP Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 144 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BQFP Supplier Device Package: 208-RQFP (28x28)	封裝: 208-BQFP	庫存4,672
EP1S10F484C6	Intel	IC FPGA 335 I/O 484FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 335 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存2,272
5SGXEA7N2F45I2N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存5,216
5SGSMD4E2H29C2N	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 23946240 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: 780-BBGA, FCBGA	庫存7,200
10AX057K3F40E2LG	Intel	IC FPGA 696 I/O 1517FCBGA Number of LABs/CLBs: 217080 Number of Logic Elements/Cells: 570000 Total RAM Bits: 42082304 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,832
EP2S60F484C3N	Intel	IC FPGA 334 I/O 484FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 334 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,984
EP3CLS70U484C8N	Intel	IC FPGA 278 I/O 484UBGA Number of LABs/CLBs: 4388 Number of Logic Elements/Cells: 70208 Total RAM Bits: 3068928 Number of I/O: 278 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存4,944
10CL025YU256C8G	Intel	256-PIN UBGA Number of LABs/CLBs: 1539 Number of Logic Elements/Cells: 24624 Total RAM Bits: 608256 Number of I/O: 150 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-UBGA (14x14)	封裝: 256-LFBGA	庫存7,408
EP3C5E144C8	Intel	IC FPGA 94 I/O 144EQFP Number of LABs/CLBs: 321 Number of Logic Elements/Cells: 5136 Total RAM Bits: 423936 Number of I/O: 94 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存6,288
EP4CE55F29I7N	Intel	IC FPGA 374 I/O 780FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 374 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BGA	庫存2,224
EPM7256ERC208-20	Intel	IC CPLD 256MC 20NS 208RQFP Programmable Type: EE PLD Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存6,996
EPM7032SLC44-7N	Intel	IC CPLD 32MC 7.5NS 44PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 600 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存2,576
EPM7256SRC208-7N	Intel	IC CPLD 256MC 7.5NS 208RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存9,360
EPM570F256I5	Intel	IC CPLD 440MC 5.4NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 160 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存4,864
5AGXBA1D4F31C4G	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 3537 Number of Logic Elements/Cells: 75000 Total RAM Bits: 8666112 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存5,152
AGIA035R39A2I1V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 3.54M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封裝: -	Request a Quote
1SX165HN1F43E2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 1650K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGXMA3K3F35C2LG	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5SGXEA5N3F45C4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
1ST210EU1F50I2VGAS	Intel	IC FPGA 440 I/O 2397BGA Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
AGIB041R31B2E2VR0	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote

1SX280LN2F43E2VG

Intel

1760-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,760

10AS027E2F29I2LG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,032

EP1SGX10CF672C6NGA

Intel

IC FPGA STRATIX GX 672FBGA

Number of LABs/CLBs: 1057
Number of Logic Elements/Cells: 10570
Total RAM Bits: 920448
Number of I/O: 362
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存4,592

10AX032H2F35I1SG

Intel

IC FPGA 384 I/O 1152FCBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,040

XC40200XV-07BG560C

Intel

IC FPGA APEX 560BGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,824

10M08SCE144C7G

Intel

IC FPGA/CPLD NV 144EQFP

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 101
Number of Gates: -
Voltage - Supply: 2.85 V ~ 3.465 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存3,424

EP20K300EQC240-3N

Intel

IC FPGA 152 I/O 240QFP

Number of LABs/CLBs: 1152
Number of Logic Elements/Cells: 11520
Total RAM Bits: 147456
Number of I/O: 152
Number of Gates: 728000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BQFP

庫存6,624

EP20K200RC208-1V

Intel

IC FPGA 144 I/O 208RQFP

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 144
Number of Gates: 526000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BQFP
Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BQFP

庫存4,672

EP1S10F484C6

Intel

IC FPGA 335 I/O 484FBGA

Number of LABs/CLBs: 1057
Number of Logic Elements/Cells: 10570
Total RAM Bits: 920448
Number of I/O: 335
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存2,272

5SGXEA7N2F45I2N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存5,216

5SGSMD4E2H29C2N

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 23946240
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: 780-BBGA, FCBGA

庫存7,200

10AX057K3F40E2LG

Intel

IC FPGA 696 I/O 1517FCBGA

Number of LABs/CLBs: 217080
Number of Logic Elements/Cells: 570000
Total RAM Bits: 42082304
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,832

EP2S60F484C3N

Intel

IC FPGA 334 I/O 484FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 334
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,984

EP3CLS70U484C8N

Intel

IC FPGA 278 I/O 484UBGA

Number of LABs/CLBs: 4388
Number of Logic Elements/Cells: 70208
Total RAM Bits: 3068928
Number of I/O: 278
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存4,944

10CL025YU256C8G

Intel

256-PIN UBGA

Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 1.2V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-UBGA (14x14)

封裝: 256-LFBGA

庫存7,408

EP3C5E144C8

Intel

IC FPGA 94 I/O 144EQFP

Number of LABs/CLBs: 321
Number of Logic Elements/Cells: 5136
Total RAM Bits: 423936
Number of I/O: 94
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存6,288

EP4CE55F29I7N

Intel

IC FPGA 374 I/O 780FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 374
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

庫存2,224

EPM7256ERC208-20

Intel

IC CPLD 256MC 20NS 208RQFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存6,996

EPM7032SLC44-7N

Intel

IC CPLD 32MC 7.5NS 44PLCC

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 600
Number of I/O: 36
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存2,576

EPM7256SRC208-7N

Intel

IC CPLD 256MC 7.5NS 208RQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存9,360

EPM570F256I5

Intel

IC CPLD 440MC 5.4NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 160
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存4,864

5AGXBA1D4F31C4G

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 3537
Number of Logic Elements/Cells: 75000
Total RAM Bits: 8666112
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存5,152

AGIA035R39A2I1V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 3.54M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封裝: -

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1SX165HN1F43E2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 1650K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5SGXMA3K3F35C2LG

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXEA5N3F45C4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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1ST210EU1F50I2VGAS

Intel

IC FPGA 440 I/O 2397BGA

Number of LABs/CLBs: 262500
Number of Logic Elements/Cells: 2100000
Total RAM Bits: -
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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AGIB041R31B2E2VR0

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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