頁 201 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
GD82550EYSL4MJ	Intel	IC ETH PCI/CARDBUS CTRL 196BGA Protocol: Ethernet Function: MAC Controller Interface: PCI Standards: 100 Base-TX PHY Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 196-BGA Supplier Device Package: 196-BGA (15x15)	封裝: 196-BGA	庫存5,936
10AS027E2F29E1SG	Intel	IC SOC FPGA 360 I/O 780FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存3,936
10AS066H3F34E2LG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,848
5CSEBA2U19C6N	Intel	IC FPGA 240 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存5,120
EP3C25F256C7ES	Intel	IC FPGA 156 I/O 256FBGA Number of LABs/CLBs: 1539 Number of Logic Elements/Cells: 24624 Total RAM Bits: 608256 Number of I/O: 156 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存7,968
EP2A40F672C9	Intel	IC FPGA 492 I/O 672FBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 655360 Number of I/O: 492 Number of Gates: 3000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存4,848
EP20K60EFC324-1X	Intel	IC FPGA 196 I/O 324FBGA Number of LABs/CLBs: 2560 Number of Logic Elements/Cells: 2560 Total RAM Bits: 32768 Number of I/O: 196 Number of Gates: 162000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	封裝: 324-BGA	庫存7,024
EP1S80F1020I7	Intel	IC FPGA 773 I/O 1020FBGA Number of LABs/CLBs: 7904 Number of Logic Elements/Cells: 79040 Total RAM Bits: 7427520 Number of I/O: 773 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存3,584
EPF6024AQC208-2N	Intel	IC FPGA 171 I/O 208QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 1960 Total RAM Bits: - Number of I/O: 171 Number of Gates: 24000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存2,336
EP1S40F1020C7	Intel	IC FPGA 773 I/O 1020FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 3423744 Number of I/O: 773 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存5,968
EP3C80F780C8N	Intel	IC FPGA 429 I/O 780FBGA Number of LABs/CLBs: 5079 Number of Logic Elements/Cells: 81264 Total RAM Bits: 2810880 Number of I/O: 429 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BGA	庫存7,920
5SGXMB6R1F40C2N	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,472
5SGXEA7N2F45I2	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存5,136
5SGSMD5K1F40I2	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 46769152 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,376
EP3SL200H780I4L	Intel	IC FPGA 488 I/O 780HBGA Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 200000 Total RAM Bits: 10901504 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: 780-BBGA, FCBGA	庫存5,856
10AX115H3F34I2LG	Intel	IC FPGA 504 I/O 1152FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 504 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,232
5SGXEA7K2F35C3N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,680
5SGXMA4K2F35I3N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,264
5SGXEA3K2F40I2L	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存4,608
5SGXMA4H3F35I3N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,224
5AGZME5K3F40I4N	Intel	IC FPGA 674 I/O 1517FBGA Number of LABs/CLBs: 18870 Number of Logic Elements/Cells: 400000 Total RAM Bits: 34322432 Number of I/O: 674 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,152
EP3C5E144C7	Intel	IC FPGA 94 I/O 144EQFP Number of LABs/CLBs: 321 Number of Logic Elements/Cells: 5136 Total RAM Bits: 423936 Number of I/O: 94 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存6,048
10CL016YE144C8G	Intel	144-PIN EQFP Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 78 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存4,080
EPM7128BTC100-7	Intel	IC CPLD 128MC 7.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存5,856
1ST110EN1F43I2LGAS	Intel	IC FPGA 440 I/O 1760FBGA Number of LABs/CLBs: 137500 Number of Logic Elements/Cells: 1100000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
AGFC019R24C2I3V	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封裝: -	Request a Quote
AGFA019R31C2E3V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
RH80530GZ009512	Intel	MICROPROCESSOR, 32-BIT, 1200MHZ, Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

GD82550EYSL4MJ

Intel

IC ETH PCI/CARDBUS CTRL 196BGA

Protocol: Ethernet
Function: MAC Controller
Interface: PCI
Standards: 100 Base-TX PHY
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Package / Case: 196-BGA
Supplier Device Package: 196-BGA (15x15)

封裝: 196-BGA

庫存5,936

10AS027E2F29E1SG

Intel

IC SOC FPGA 360 I/O 780FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存3,936

10AS066H3F34E2LG

Intel

IC SOC FPGA 492 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,848

5CSEBA2U19C6N

Intel

IC FPGA 240 I/O 484UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存5,120

EP3C25F256C7ES

Intel

IC FPGA 156 I/O 256FBGA

Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 156
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存7,968

EP2A40F672C9

Intel

IC FPGA 492 I/O 672FBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 655360
Number of I/O: 492
Number of Gates: 3000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存4,848

EP20K60EFC324-1X

Intel

IC FPGA 196 I/O 324FBGA

Number of LABs/CLBs: 2560
Number of Logic Elements/Cells: 2560
Total RAM Bits: 32768
Number of I/O: 196
Number of Gates: 162000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

封裝: 324-BGA

庫存7,024

EP1S80F1020I7

Intel

IC FPGA 773 I/O 1020FBGA

Number of LABs/CLBs: 7904
Number of Logic Elements/Cells: 79040
Total RAM Bits: 7427520
Number of I/O: 773
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存3,584

EPF6024AQC208-2N

Intel

IC FPGA 171 I/O 208QFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 1960
Total RAM Bits: -
Number of I/O: 171
Number of Gates: 24000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存2,336

EP1S40F1020C7

Intel

IC FPGA 773 I/O 1020FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 3423744
Number of I/O: 773
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存5,968

EP3C80F780C8N

Intel

IC FPGA 429 I/O 780FBGA

Number of LABs/CLBs: 5079
Number of Logic Elements/Cells: 81264
Total RAM Bits: 2810880
Number of I/O: 429
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

庫存7,920

5SGXMB6R1F40C2N

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,472

5SGXEA7N2F45I2

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存5,136

5SGSMD5K1F40I2

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 46769152
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,376

EP3SL200H780I4L

Intel

IC FPGA 488 I/O 780HBGA

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 200000
Total RAM Bits: 10901504
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: 780-BBGA, FCBGA

庫存5,856

10AX115H3F34I2LG

Intel

IC FPGA 504 I/O 1152FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 504
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,232

5SGXEA7K2F35C3N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,680

5SGXMA4K2F35I3N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,264

5SGXEA3K2F40I2L

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存4,608

5SGXMA4H3F35I3N

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,224

5AGZME5K3F40I4N

Intel

IC FPGA 674 I/O 1517FBGA

Number of LABs/CLBs: 18870
Number of Logic Elements/Cells: 400000
Total RAM Bits: 34322432
Number of I/O: 674
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,152

EP3C5E144C7

Intel

IC FPGA 94 I/O 144EQFP

Number of LABs/CLBs: 321
Number of Logic Elements/Cells: 5136
Total RAM Bits: 423936
Number of I/O: 94
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存6,048

10CL016YE144C8G

Intel

144-PIN EQFP

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 78
Number of Gates: -
Voltage - Supply: 1.2V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存4,080

EPM7128BTC100-7

Intel

IC CPLD 128MC 7.5NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 2.375 V ~ 2.625 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存5,856

1ST110EN1F43I2LGAS

Intel

IC FPGA 440 I/O 1760FBGA

Number of LABs/CLBs: 137500
Number of Logic Elements/Cells: 1100000
Total RAM Bits: -
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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AGFC019R24C2I3V

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封裝: -

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AGFA019R31C2E3V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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RH80530GZ009512

Intel

MICROPROCESSOR, 32-BIT, 1200MHZ,

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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