頁 200 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
10AS057H1F34I1SG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,184
5ASXMB3G4F40I5N	Intel	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,984
10AS032E3F27E2SG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存7,296
5CSTFD5D5F31I7N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BGA	庫存6,384
5CSEBA2U23I7N	Intel	IC FPGA 188 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封裝: 672-FBGA	庫存6,480
EP1C6F256C7NAB	Intel	IC FPGA FBGA Number of LABs/CLBs: 598 Number of Logic Elements/Cells: 5980 Total RAM Bits: 92160 Number of I/O: 185 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存2,192
EP20K1000EGI984-3	Intel	IC FPGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: - Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存2,304
EP20K1000CF33C9N	Intel	IC FPGA APEX 20KC 1020-FBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: 708 Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存3,600
EPF10K50EQC208-2	Intel	IC FPGA 147 I/O 208QFP Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 40960 Number of I/O: 147 Number of Gates: 199000 Voltage - Supply: 2.3 V ~ 2.7 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存5,136
EP2AGX190FF35I3	Intel	IC FPGA 612 I/O 1152FBGA Number of LABs/CLBs: 7612 Number of Logic Elements/Cells: 181165 Total RAM Bits: 10177536 Number of I/O: 612 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,328
EP1S10F672I7	Intel	IC FPGA 345 I/O 672FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 345 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA	庫存4,752
EP4SE530F43C4N	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 1120 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,192
5SGXEA5N3F45C4N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存3,424
5SGSMD3E2H29I3N	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: 780-BBGA, FCBGA	庫存4,800
5SGXMABK2H40I2LN	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封裝: 1517-BBGA, FCBGA	庫存2,752
5SGXMA4K3F40C4N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,088
5SGXMABK3H40I4N	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封裝: 1517-BBGA, FCBGA	庫存6,768
5AGXMA5G4F35C4N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA Exposed Pad	庫存6,576
5CEFA9U19C8N	Intel	IC FPGA 240 I/O 484UBGA Number of LABs/CLBs: 113560 Number of Logic Elements/Cells: 301000 Total RAM Bits: 14251008 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存7,952
EPM7064AELI44-7N	Intel	IC CPLD 64MC 7.5NS 44PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存7,552
RB80526PZ001256	Intel	IC MPU INTEL PENT 1GHZ 370PPGA Core Processor: Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.75V Operating Temperature: 75°C (TC) Security Features: - Package / Case: 370-PGA Supplier Device Package: 370-PPGA (49x49)	封裝: -	Request a Quote
5SGXMB9R3H43C4G	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封裝: -	Request a Quote
1SG250HH3F55E2LG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	封裝: -	Request a Quote
EP3SL340F1760I4LG	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
1SX250HU3F50I2VG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXEA7N2F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
5SGXEA4K2F35C3G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
EP3SE110F1152C3G	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

10AS057H1F34I1SG

Intel

IC SOC FPGA 492 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,184

5ASXMB3G4F40I5N

Intel

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,984

10AS032E3F27E2SG

Intel

672-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,296

5CSTFD5D5F31I7N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BGA

庫存6,384

5CSEBA2U23I7N

Intel

IC FPGA 188 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封裝: 672-FBGA

庫存6,480

EP1C6F256C7NAB

Intel

IC FPGA FBGA

Number of LABs/CLBs: 598
Number of Logic Elements/Cells: 5980
Total RAM Bits: 92160
Number of I/O: 185
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存2,192

EP20K1000EGI984-3

Intel

IC FPGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: -
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,304

EP20K1000CF33C9N

Intel

IC FPGA APEX 20KC 1020-FBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: 708
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存3,600

EPF10K50EQC208-2

Intel

IC FPGA 147 I/O 208QFP

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 40960
Number of I/O: 147
Number of Gates: 199000
Voltage - Supply: 2.3 V ~ 2.7 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存5,136

EP2AGX190FF35I3

Intel

IC FPGA 612 I/O 1152FBGA

Number of LABs/CLBs: 7612
Number of Logic Elements/Cells: 181165
Total RAM Bits: 10177536
Number of I/O: 612
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,328

EP1S10F672I7

Intel

IC FPGA 345 I/O 672FBGA

Number of LABs/CLBs: 1057
Number of Logic Elements/Cells: 10570
Total RAM Bits: 920448
Number of I/O: 345
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA

庫存4,752

EP4SE530F43C4N

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 1120
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,192

5SGXEA5N3F45C4N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存3,424

5SGSMD3E2H29I3N

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: 780-BBGA, FCBGA

庫存4,800

5SGXMABK2H40I2LN

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封裝: 1517-BBGA, FCBGA

庫存2,752

5SGXMA4K3F40C4N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,088

5SGXMABK3H40I4N

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封裝: 1517-BBGA, FCBGA

庫存6,768

5AGXMA5G4F35C4N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 8962
Number of Logic Elements/Cells: 190000
Total RAM Bits: 13284352
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA Exposed Pad

庫存6,576

5CEFA9U19C8N

Intel

IC FPGA 240 I/O 484UBGA

Number of LABs/CLBs: 113560
Number of Logic Elements/Cells: 301000
Total RAM Bits: 14251008
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存7,952

EPM7064AELI44-7N

Intel

IC CPLD 64MC 7.5NS 44PLCC

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存7,552

RB80526PZ001256

Intel

IC MPU INTEL PENT 1GHZ 370PPGA

Core Processor: Intel® Pentium® III Processor
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.75V
Operating Temperature: 75°C (TC)
Security Features: -
Package / Case: 370-PGA
Supplier Device Package: 370-PPGA (49x49)

封裝: -

Request a Quote

5SGXMB9R3H43C4G

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封裝: -

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1SG250HH3F55E2LG

Intel

IC FPGA 1160 I/O 2912BGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 1160
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

封裝: -

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EP3SL340F1760I4LG

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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1SX250HU3F50I2VG

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXEA7N2F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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5SGXEA4K2F35C3G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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EP3SE110F1152C3G

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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