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NXP 產品

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MRFE6VP61K25GNR6
NXP

TRANS RF LDMOS 1250W 50V

  • Transistor Type: LDMOS (Dual)
  • Frequency: 230MHz
  • Gain: 23dB
  • Voltage - Test: 50V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 100mA
  • Power - Output: 1250W
  • Voltage - Rated: 133V
  • Package / Case: OM-1230G-4L
  • Supplier Device Package: OM-1230G-4L
封裝: OM-1230G-4L
庫存4,624
PDTD123EK,115
NXP

TRANS PREBIAS NPN 250MW SMT3

  • Transistor Type: NPN - Pre-Biased
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): 2.2k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
  • Current - Collector Cutoff (Max): 500nA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封裝: TO-236-3, SC-59, SOT-23-3
庫存3,216
MBC13900T1
NXP

IC TRANS NPN RF LOW NOISE SC70-4

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 6.5V
  • Frequency - Transition: 15GHz
  • Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz
  • Gain: 15dB ~ 22dB
  • Power - Max: 188mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V
  • Current - Collector (Ic) (Max): 20mA
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-82A, SOT-343
  • Supplier Device Package: SOT-343
封裝: SC-82A, SOT-343
庫存5,200
MC07XS3200EKR2
NXP

IC SWITCH DUAL 32SOIC SPDL07

  • Switch Type: General Purpose
  • Number of Outputs: 2
  • Ratio - Input:Output: 1:2
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 6 V ~ 20 V
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Current - Output (Max): 26A
  • Rds On (Typ): 7 mOhm
  • Input Type: -
  • Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
庫存6,576
74LVCH322245AEC/G,
NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
封裝: 96-LFBGA
庫存5,424
74ALVT162244DGG:51
NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 48-TSSOP
封裝: 48-TFSOP (0.240", 6.10mm Width)
庫存4,800
TDA9981BHL/15/C1:5
NXP

IC HDMI TX 150MHZ 80-LQFP

  • Type: Transmitter
  • Applications: Recorders, Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
封裝: 80-LQFP
庫存4,976
TDA9898HN/V3,551
NXP

IC IF PROCESSOR HYBRID 48-HVQFN

  • Type: Demodulator
  • Applications: TV
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: 48-VFQFN Exposed Pad
庫存7,424
TDA8511J/N2,112
NXP

IC AMP AUDIO PWR 13W QUAD 17SIL

  • Type: Class B
  • Output Type: 4-Channel (Quad)
  • Max Output Power x Channels @ Load: 13W x 4 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: DBS17P
  • Package / Case: 17-SIP Formed Leads
封裝: 17-SIP Formed Leads
庫存2,592
KMPC8347EVVAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
封裝: 672-LBGA
庫存7,088
KMPC860DPVR66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (2), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
封裝: 357-BBGA
庫存3,520
MCIMX6Y7DVM09AA
NXP

I.MX 6ULL 900 MHZ CONSUMER WITH

  • Core Processor: ARM? Cortex?-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 900MHz
  • Co-Processors/DSP: Multimedia; NEON? MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Electrophoretic, LCD
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
封裝: 289-LFBGA
庫存6,336
S908QY4H0CDWE
NXP

IC MCU 8BIT 4KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
封裝: 16-SOIC (0.295", 7.50mm Width)
庫存6,768
MCHC705B16NVFNE
NXP

IC MCU 8BIT 15KB OTP 52PLCC

  • Core Processor: HC05
  • Core Size: 8-Bit
  • Speed: 2.1MHz
  • Connectivity: SCI
  • Peripherals: POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 15KB (15K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: 256 x 8
  • RAM Size: 352 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 52-LCC (J-Lead)
  • Supplier Device Package: 52-PLCC (19.1x19.1)
封裝: 52-LCC (J-Lead)
庫存7,968
MCHC908AB32CFUR2
NXP

IC MCU 8BIT 32KB FLASH 64QFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: POR, PWM
  • Number of I/O: 51
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
封裝: 64-QFP
庫存7,104
hot LPC4353FET256,551
NXP

IC MCU 32BIT 512KB FLASH 256LBGA

  • Core Processor: ARM? Cortex?-M4/M0
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 164
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-LBGA (17x17)
封裝: 256-LBGA
庫存3,888
LPC18S57JET256E
NXP

IC MCU 32BIT 1MB FLASH 256LBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
  • Number of I/O: 164
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-LBGA (17x17)
封裝: 256-LBGA
庫存6,576
MC68HC908QT4CPE
NXP

IC MCU 8BIT 4KB FLASH 8DIP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 5
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存14,022
MF3ICD8101DUD/05,0
NXP

IC SMART CARD 8K EEPROM FFC

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: UART
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: Die
  • Supplier Device Package: Die
封裝: Die
庫存7,812
MPXY8600DK6T1
NXP

IC PRESSURE SENSOR 32QFN

  • Frequency: 315MHz, 434MHz
  • Applications: TPM (Tire Pressure Monitor)
  • Modulation or Protocol: FSK, OOK
  • Data Rate (Max): -
  • Power - Output: -
  • Current - Transmitting: -
  • Data Interface: PCB, Surface Mount
  • Antenna Connector: PCB, Surface Mount
  • Memory Size: 8kB Flash, 512B SRAM
  • Features: -
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 32-QFN Exposed Pad
封裝: 32-QFN Exposed Pad
庫存5,724
MMPF0100FCANESR2
NXP

POWER MANAGEMENT IC I.MX6 NO-P

  • Applications: -
  • Voltage - Input: -
  • Number of Outputs: -
  • Voltage - Output: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存3,616
TDA18280HN/C1Y
NXP

CABLE FST DEMOD

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,792
LS2044AXN7TTB
NXP

LS2044A XT 1800 R1.1

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存5,680
SPC5744BK1AMMH2
NXP

SINGLE CORE 1.5M FLASH 192K RA

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
封裝: 100-LBGA
庫存4,288
S912XEG256BCALR
NXP

16-BIT MCU S12X CORE 256KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封裝: 112-LQFP
庫存6,816
MCF51AC256ACPUER
NXP

MCF51AC 32-BIT MCU COLDFIRE V1

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 20x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存5,968
S9S08RNA8W2MTGR
NXP

8-BIT MCU S08 CORE 16KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
封裝: 16-TSSOP (0.173", 4.40mm Width)
庫存5,456
BAS21-MI-215
NXP

BAS21 - HIGH-VOLTAGE SWITCHING D

  • Diode Type: -
  • Voltage - DC Reverse (Vr) (Max): -
  • Current - Average Rectified (Io): -
  • Voltage - Forward (Vf) (Max) @ If: -
  • Speed: -
  • Reverse Recovery Time (trr): -
  • Current - Reverse Leakage @ Vr: -
  • Capacitance @ Vr, F: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
  • Operating Temperature - Junction: -
封裝: -
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