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NXP 產品

記錄 26,590
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NE1619DS,118
NXP

IC TEMP MONITOR 16SSOP

  • Function: Temp Monitoring System (Sensor)
  • Sensor Type: Internal and External
  • Sensing Temperature: 0°C ~ 125°C, External Sensor
  • Accuracy: ±3°C Local(Max), ±5°C Remote(Max)
  • Topology: ADC, Multiplexer, Register Bank
  • Output Type: SMBus
  • Output Alarm: Yes
  • Output Fan: No
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SSOP (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SSOP
封裝: 16-SSOP (0.154", 3.90mm Width)
庫存7,664
MC40XSF500EKR2
NXP

IC SWITCH HIGH SIDE 32SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 5
  • Ratio - Input:Output: -
  • Output Configuration: High Side
  • Output Type: -
  • Interface: SPI
  • Voltage - Load: 7 V ~ 18 V
  • Voltage - Supply (Vcc/Vdd): -
  • Current - Output (Max): -
  • Rds On (Typ): 40 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Over Voltage
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
庫存4,096
hot MPC17531ATEP
NXP

IC MOTOR DRIVER PAR 24QFN

  • Motor Type - Stepper: Bipolar
  • Motor Type - AC, DC: Brushed DC
  • Function: Driver - Fully Integrated, Control and Power Stage
  • Output Configuration: Half Bridge (4)
  • Interface: Parallel
  • Technology: Power MOSFET
  • Step Resolution: -
  • Applications: Battery Powered
  • Current - Output: 700mA
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Voltage - Load: 2 V ~ 8.6 V
  • Operating Temperature: -20°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-QFN-EP (4x4)
封裝: 24-VFQFN Exposed Pad
庫存14,976
hot MC33395DWBR2
NXP

IC GATE DRIVER 3PHASE 32-SOIC

  • Driven Configuration: Half-Bridge
  • Channel Type: 3-Phase
  • Number of Drivers: 6
  • Gate Type: N-Channel MOSFET
  • Voltage - Supply: 5.5 V ~ 24 V
  • Logic Voltage - VIL, VIH: -
  • Current - Peak Output (Source, Sink): -
  • Input Type: Non-Inverting
  • High Side Voltage - Max (Bootstrap): -
  • Rise / Fall Time (Typ): 350ns, 250ns
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
封裝: 32-SOIC (0.295", 7.50mm Width)
庫存5,408
74HCT373N,652
NXP

IC LATCH TRANSP OCT D 3ST 20DIP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 8:8
  • Output Type: Tri-State
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 14ns
  • Current - Output High, Low: 6mA, 6mA
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
封裝: 20-DIP (0.300", 7.62mm)
庫存3,408
MC33389CDHR2
NXP

IC SYSTEM BASE W/CAN 20-HSOP

  • Applications: Automotive
  • Interface: CAN
  • Voltage - Supply: 5 V ~ 18 V
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
  • Mounting Type: Surface Mount
封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
庫存5,232
PCA9555BSHP
NXP

IC I/O EXPANDER I2C 16B 24HVQFN

  • Number of I/O: 16
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
封裝: 24-VFQFN Exposed Pad
庫存4,400
SC16IS750IBS,128
NXP

IC UART I2C/SPI 24-HVQFN

  • Protocol: RS232, RS485
  • Function: Controller
  • Interface: I2C, SPI, UART
  • Standards: -
  • Voltage - Supply: 2.5V, 3.3V
  • Current - Supply: 6mA
  • Operating Temperature: -40°C ~ 95°C
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
封裝: 24-VFQFN Exposed Pad
庫存13,218
MPC8535AVTAQGA
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存3,040
MPC862TCZQ66B
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 115°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
封裝: 357-BBGA
庫存4,512
MPC8536BVJAULA
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存7,904
hot MCIMX6D7CVT08AD
NXP

IC MPU I.MX6D 800MHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封裝: 624-FBGA, FCBGA
庫存11,664
MPXR4040VVU264
NXP

IC MCU 32BIT 4MB FLASH 416BGA

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 264MHz
  • Connectivity: CAN, EBI/EMI, LIN, SCI, SPI, UART/USART
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 198
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
封裝: 416-BBGA
庫存3,232
hot MC908QC16CDZE
NXP

IC MCU 8BIT 16KB FLASH 28SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 24
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存6,592
hot MCF5307FT66B
NXP

IC MCU 32BIT ROMLESS 208FQFP

  • Core Processor: Coldfire V3
  • Core Size: 32-Bit
  • Speed: 66MHz
  • Connectivity: EBI/EMI, I2C, UART/USART
  • Peripherals: DMA, POR, WDT
  • Number of I/O: 16
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-FQFP (28x28)
封裝: 208-BFQFP
庫存6,368
hot MC9RS08KA4CWJ
NXP

IC MCU 8BIT 4KB FLASH 20SOIC

  • Core Processor: RS08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 126 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存7,848
MKL25Z32VLH4
NXP

IC MCU 32BIT 32KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 14x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存7,032
hot MK20FX512VMD12
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 58x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
封裝: 144-LBGA
庫存12,684
hot MPC9600FA
NXP

IC CLOCK DRVR PLL LV 1:21 48LQFP

  • Type: Clock Driver, Fanout Distribution, Multiplexer, Zero Delay Buffer
  • PLL: Yes
  • Input: LVCMOS, LVPECL, LVTTL
  • Output: LVCMOS
  • Number of Circuits: 1
  • Ratio - Input:Output: 2:21
  • Differential - Input:Output: Yes/No
  • Frequency - Max: 200MHz
  • Divider/Multiplier: Yes/Yes
  • Voltage - Supply: 2.375 V ~ 3.465 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存5,536
MPL015A2T1
NXP

IC BAROMETER I2C DGTL MINI 8-LGA

  • Pressure Type: Absolute
  • Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
  • Output Type: I2C
  • Output: 10 b
  • Accuracy: ±0.145 PSI (±1 kPa)
  • Voltage - Supply: 2.375 V ~ 5.5 V
  • Port Size: -
  • Port Style: No Port
  • Features: Shutdown Mode
  • Termination Style: PCB
  • Maximum Pressure: 145.04 PSI (1000 kPa)
  • Operating Temperature: -40°C ~ 105°C
  • Package / Case: 8-TLGA
  • Supplier Device Package: 8-LGA
封裝: 8-TLGA
庫存6,948
HTMS1101FTK/AF,115
NXP

RFID HTAG SOT899-1

  • Style: Encapsulated
  • Technology: Passive
  • Frequency: 100kHz ~ 150kHz
  • Memory Type: Read/Write
  • Writable Memory: 1.76kb (User)
  • Standards: ISO 11784, ISO 11785
  • Operating Temperature: -
  • Size / Dimension: 1.45mm x 1.00mm x 0.50mm
封裝: -
庫存2,088
MC33FS6511NAER2
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP Exposed Pad
庫存4,784
MCIMX6Y0DVM05AB
NXP

I.MX6ULL ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Electrophoretic, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
封裝: 289-LFBGA
庫存5,664
FS32K142MNT0VLLR
NXP

S32K144 32-BIT MCU ARM

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存7,344
MC9S08SE8VWLR
NXP

S08SE 8-BIT MCU S08 CORE 8KB F

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: LINbus, SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 24
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存7,776
LPC2460FET208Y
NXP

IC MCU 16/32BIT ROMLESS 208TFBGA

  • Core Processor: ARM7TDMI-S
  • Core Size: 16/32-Bit
  • Speed: 72MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: 160
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 98K x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-TFBGA
  • Supplier Device Package: 208-TFBGA (15x15)
封裝: -
Request a Quote
K32L2B11VMP0AR
NXP

K32 L2B, 64MAPBGA

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
  • Peripherals: DMA, LCD, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 16x16b; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LFBGA
  • Supplier Device Package: 64-MAPBGA (5x5)
封裝: -
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SPC5745CK1AVMH2
NXP

IC MCU 32BIT 2MB FLASH 100LFBGA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
  • Peripherals: DMA, I2S, LVD, POR, WDT
  • Number of I/O: 65
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
  • Data Converters: A/D 68x10b, 31x12b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LFBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
封裝: -
Request a Quote