頁 444 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PHM21NQ15T,518	NXP	MOSFET N-CH 150V 22.2A 8HVSON FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 150V Current - Continuous Drain (Id) @ 25°C: 22.2A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 36.2nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 2080pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 55 mOhm @ 15A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (6x5) Package / Case: 8-VDFN Exposed Pad	封裝: 8-VDFN Exposed Pad	庫存6,640
AFT26H050W26SR3	NXP	FET RF 2CH 65V 2.69GHZ NI780-4 Transistor Type: LDMOS Frequency: 2.69GHz Gain: 14.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 9W Voltage - Rated: 65V Package / Case: NI-780S-4L4L-8 Supplier Device Package: NI-780S-4L4L-8	封裝: NI-780S-4L4L-8	庫存3,296
BZX284-C4V3,115	NXP	DIODE ZENER 4.3V 400MW SOD2 Voltage - Zener (Nom) (Vz): 4.3V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封裝: SOD-110	庫存6,624
MMPF0200NPANESR2	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 11 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	封裝: 56-VFQFN Exposed Pad	庫存2,896
74ALVT16501DL,518	NXP	IC UNIV BUS TXRX 18BIT 56SSOP Logic Type: Universal Bus Transceiver Number of Circuits: 18-Bit Current - Output High, Low: 8mA, 24mA; 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 56-SSOP	封裝: 56-BSSOP (0.295", 7.50mm Width)	庫存5,184
CBT6820DGG,118	NXP	IC BUS SWITCH 20BIT 48TSSOP Type: Bus Switch Circuit: 10 x 1:1 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存5,616
N74F521D,602	NXP	IC COMPARATOR IDENTITY 8B 20SOIC Type: Identity Comparator Number of Bits: 8 Output: Active Low Output Function: A=B Voltage - Supply: 4.5 V ~ 5.5 V Current - Output High, Low: 1mA, 20mA Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Current - Quiescent (Iq): - Operating Temperature: 0°C ~ 70°C Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存3,168
SAF7167AHW/V1,157	NXP	IC DAC YUV TO RGB 48HTQFP Type: RGB Video Amplifier Applications: Video Mounting Type: Surface Mount Package / Case: 48-TQFP Exposed Pad Supplier Device Package: 48-HTQFP	封裝: 48-TQFP Exposed Pad	庫存6,112
SA5211D/01,112	NXP	IC OPAMP TRANSIMP 180MHZ 14SO Amplifier Type: Transimpedance Number of Circuits: 1 Output Type: Differential Slew Rate: - Gain Bandwidth Product: - -3db Bandwidth: 180MHz Current - Input Bias: - Voltage - Input Offset: - Current - Supply: 26mA Current - Output / Channel: 4mA Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存7,984
PCA9673BS,118	NXP	IC I/O EXPANDER I2C 16B 24HVQFN Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	封裝: 24-VFQFN Exposed Pad	庫存5,392
KMPC8360EZUAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存7,456
MC68E360ZP25VLR2	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BGA	庫存3,344
MPC862TCVR50B	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 115°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存5,312
P2020NSN2NHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存3,008
MCF5253VM140J	NXP	IC MCU 32BIT ROMLESS 225MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 140MHz Connectivity: CAN, EBI/EMI, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V Data Converters: A/D 6x12b Oscillator Type: External Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: - Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13)	封裝: 225-LFBGA	庫存4,944
LPC2157FBD100,551	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存5,200
MKL02Z32VFG4	NXP	IC MCU 32BIT 32KB FLASH 16QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-WFQFN Exposed Pad Supplier Device Package: 16-QFN (3x3)	封裝: 16-WFQFN Exposed Pad	庫存5,232
ADC1012D105HN/C1,5	NXP	IC ADC 105MHZ SOT804-3 Number of Bits: - Sampling Rate (Per Second): - Number of Inputs: - Input Type: - Data Interface: - Configuration: - Ratio - S/H:ADC: - Number of A/D Converters: - Architecture: - Reference Type: - Voltage - Supply, Analog: - Voltage - Supply, Digital: - Features: - Operating Temperature: - Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存7,120
SA56004ETK,118	NXP	SENSOR TEMP I2C/SMBUS 8HVSON Sensor Type: Digital, Local/Remote Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Output Type: I2C/SMBus Voltage - Supply: 3 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	封裝: 8-VDFN Exposed Pad	庫存6,210
T1023NXE7KQA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,424
MKL81Z128VLK7	NXP	KINETIS KL81: 72MHZ CORTEX-M0+ S Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, D/A 1x6b, 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-FQFP (12x12)	封裝: 80-LQFP	庫存7,856
SPC5646CCK0VMJ1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	封裝: 256-LBGA	庫存6,496
SM912F634DV2AER2	NXP	MAGNIV S12 RELAY DRIVER 2X HS/L Core Processor: S12 Core Size: 16-Bit Speed: 20MHz Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 3 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,000
MC33GD3100BEKR2	NXP	GATE DRIVERS HV ISOLATED GATE DR Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 5V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	封裝: -	Request a Quote
SAF7753HV-N207WY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SAF775DHV-N208Q-KK	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MC33FS4508CAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
SAF7770EL-101S13AY	NXP	SOFTWARE DEFINED RADIO Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	封裝: -	Request a Quote

PHM21NQ15T,518

NXP

MOSFET N-CH 150V 22.2A 8HVSON

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 150V
Current - Continuous Drain (Id) @ 25°C: 22.2A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 36.2nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 2080pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 62.5W (Tc)
Rds On (Max) @ Id, Vgs: 55 mOhm @ 15A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (6x5)
Package / Case: 8-VDFN Exposed Pad

封裝: 8-VDFN Exposed Pad

庫存6,640

AFT26H050W26SR3

NXP

FET RF 2CH 65V 2.69GHZ NI780-4

Transistor Type: LDMOS
Frequency: 2.69GHz
Gain: 14.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 9W
Voltage - Rated: 65V
Package / Case: NI-780S-4L4L-8
Supplier Device Package: NI-780S-4L4L-8

封裝: NI-780S-4L4L-8

庫存3,296

BZX284-C4V3,115

NXP

DIODE ZENER 4.3V 400MW SOD2

Voltage - Zener (Nom) (Vz): 4.3V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封裝: SOD-110

庫存6,624

MMPF0200NPANESR2

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 11
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

封裝: 56-VFQFN Exposed Pad

庫存2,896

74ALVT16501DL,518

NXP

IC UNIV BUS TXRX 18BIT 56SSOP

Logic Type: Universal Bus Transceiver
Number of Circuits: 18-Bit
Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 56-SSOP

封裝: 56-BSSOP (0.295", 7.50mm Width)

庫存5,184

CBT6820DGG,118

NXP

IC BUS SWITCH 20BIT 48TSSOP

Type: Bus Switch
Circuit: 10 x 1:1
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存5,616

N74F521D,602

NXP

IC COMPARATOR IDENTITY 8B 20SOIC

Type: Identity Comparator
Number of Bits: 8
Output: Active Low
Output Function: A=B
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Output High, Low: 1mA, 20mA
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Current - Quiescent (Iq): -
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存3,168

SAF7167AHW/V1,157

NXP

IC DAC YUV TO RGB 48HTQFP

Type: RGB Video Amplifier
Applications: Video
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Supplier Device Package: 48-HTQFP

封裝: 48-TQFP Exposed Pad

庫存6,112

SA5211D/01,112

NXP

IC OPAMP TRANSIMP 180MHZ 14SO

Amplifier Type: Transimpedance
Number of Circuits: 1
Output Type: Differential
Slew Rate: -
Gain Bandwidth Product: -
-3db Bandwidth: 180MHz
Current - Input Bias: -
Voltage - Input Offset: -
Current - Supply: 26mA
Current - Output / Channel: 4mA
Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存7,984

PCA9673BS,118

NXP

IC I/O EXPANDER I2C 16B 24HVQFN

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

封裝: 24-VFQFN Exposed Pad

庫存5,392

KMPC8360EZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存7,456

MC68E360ZP25VLR2

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BGA

庫存3,344

MPC862TCVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 115°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存5,312

P2020NSN2NHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存3,008

MCF5253VM140J

NXP

IC MCU 32BIT ROMLESS 225MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 140MHz
Connectivity: CAN, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V
Data Converters: A/D 6x12b
Oscillator Type: External
Operating Temperature: -20°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-MAPBGA (13x13)

封裝: 225-LFBGA

庫存4,944

LPC2157FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存5,200

MKL02Z32VFG4

NXP

IC MCU 32BIT 32KB FLASH 16QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 6x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-WFQFN Exposed Pad
Supplier Device Package: 16-QFN (3x3)

封裝: 16-WFQFN Exposed Pad

庫存5,232

ADC1012D105HN/C1,5

NXP

IC ADC 105MHZ SOT804-3

Number of Bits: -
Sampling Rate (Per Second): -
Number of Inputs: -
Input Type: -
Data Interface: -
Configuration: -
Ratio - S/H:ADC: -
Number of A/D Converters: -
Architecture: -
Reference Type: -
Voltage - Supply, Analog: -
Voltage - Supply, Digital: -
Features: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存7,120

SA56004ETK,118

NXP

SENSOR TEMP I2C/SMBUS 8HVSON

Sensor Type: Digital, Local/Remote
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Output Type: I2C/SMBus
Voltage - Supply: 3 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

封裝: 8-VDFN Exposed Pad

庫存6,210

T1023NXE7KQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,424

MKL81Z128VLK7

NXP

KINETIS KL81: 72MHZ CORTEX-M0+ S

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 72MHz
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x16b, D/A 1x6b, 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-FQFP (12x12)

封裝: 80-LQFP

庫存7,856

SPC5646CCK0VMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

封裝: 256-LBGA

庫存6,496

SM912F634DV2AER2

NXP

MAGNIV S12 RELAY DRIVER 2X HS/L

Core Processor: S12
Core Size: 16-Bit
Speed: 20MHz
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 3
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 15x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,000

MC33GD3100BEKR2

NXP

GATE DRIVERS HV ISOLATED GATE DR

Driven Configuration: Half-Bridge
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, N-Channel MOSFET
Voltage - Supply: 5V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

封裝: -

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SAF7753HV-N207WY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

SAF775DHV-N208Q-KK

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MC33FS4508CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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SAF7770EL-101S13AY

NXP

SOFTWARE DEFINED RADIO

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

封裝: -

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