頁 48 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-LB69-CV	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,640	-	-	-	-	-	-	-	-
CENGPXA270-416-10-550EI	Logic	CARD ENGINE 64MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,152	PXA270	-	416MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
CENGLH7A404-11-402HC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,104	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A400-10-400BC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,736	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-WMX-L76C-TE-1	Digi International	CONNECTCORE 6 MODULE, I.MX6DUALL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,376	-	-	-	-	-	-	-	-
3354-HX-XX8-RC	Critical Link LLC	MOD MITYSOM-3354 W/ AM3354 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 512MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,432	ARM? Cortex?-A8, AM3354	NEON SIMD	800MHz	-	512MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
AM3352-SOM	Olimex LTD	SYSTEM ON MODULE SITARA A8 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8 Co-Processor: - Speed: 1.0GHz Flash Size: - RAM Size: 512MB Connector Type: 4 connectors × 40 pin @ 0.05" step Size / Dimension: 2.4" x 1.5" (61mm x 38mm) Operating Temperature: -	封裝: -	庫存7,392	ARM? Cortex?-A8	-	1.0GHz	-	512MB	4 connectors × 40 pin @ 0.05" step	2.4" x 1.5" (61mm x 38mm)	-
TE0712-02-200-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A200T-2C 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,944	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0729-02-2IF	Trenz Electronic GmbH	SOM ZYNQ XC7Z020-2I 512MB RTC Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec BTE Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,944	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	Samtec BTE	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
20-101-0508	Digi International	MODULE RABBITCORE RCM3010 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 30MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存7,200	Rabbit 3000	-	30MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
DC-ME9-01-C-50	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,784	-	-	-	-	-	-	-	-
DC-ME4-01T-IPM-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,848	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-EM-02T-GORL	Digi International	MODULE EM CUSTOMIZABLE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,296	-	-	-	-	-	-	-	-
TE0745-02-30-1IA	Trenz Electronic GmbH	SOM DDR3 1GB ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,120	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
TE0820-03-02CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存6,912	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	0°C ~ 85°C
ME-XU5-3EG-2I-D11E-R1-2	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU3EG 2GB+1GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 512MB, 2GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	600MHz, 1.5GHz	16GB	512MB, 2GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0817-01-4AI21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU4CG-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0808-05-9BE21-AK	Trenz Electronic GmbH	IC MOD SOM MPSOC 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0725-04-72I-1-B	Trenz Electronic GmbH	IC MOD ARTIX-7 A100T 100MHZ 32MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
EC-VA-MPEG2-8B-60-1080-OPVXC-0000	System-On-Chip (SOC) Technologies Inc.	ENCODER MEPG2 HD VID/AUD 8BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU8-4CG-1E-D11E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU4CG 2GB+2GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 1GB, 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	1GB, 2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0720-04-62I33NA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
SM-K24-XCL2GC	AMD	SOM K24 KRIA ZYNQ MPSOC Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存741	-	-	-	-	-	-	-	-
5728-PJ-4AA-RC	Critical Link LLC	TEXAS INSTRUMENTS AM5728 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
EC-VA-H265-10B-60-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H265 EN 60FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
SM-K26-XCL2GI	AMD	IC MOD ARM CORTEX A53 533MHZ Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Speed: 533MHz, 1.333GHz Flash Size: 16GB eMMC, 64MB QSPI RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Operating Temperature: -40°C ~ 100°C (TJ)	封裝: -	庫存1,053	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	-40°C ~ 100°C (TJ)
2DC-VA-MPEG2-8B-30-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD MPEG2 DEC 30FPS 1080 SODIMM Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	Artix-7 XC7A200T	-	200MHz	32MB	512MB	-	-	-
ME-XU7-15EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I Speed: - Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I	-	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C

CC-WMX-LB69-CV

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,640

-

CENGPXA270-416-10-550EI

Logic

CARD ENGINE 64MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 416MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,152

PXA270

-

416MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

CENGLH7A404-11-402HC

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,104

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A400-10-400BC

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,736

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-WMX-L76C-TE-1

Digi International

CONNECTCORE 6 MODULE, I.MX6DUALL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,376

-

3354-HX-XX8-RC

Critical Link LLC

MOD MITYSOM-3354 W/ AM3354

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 512MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,432

ARM? Cortex?-A8, AM3354

NEON SIMD

800MHz

-

512MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

AM3352-SOM

Olimex LTD

SYSTEM ON MODULE SITARA A8

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8
Co-Processor: -
Speed: 1.0GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 4 connectors × 40 pin @ 0.05" step
Size / Dimension: 2.4" x 1.5" (61mm x 38mm)
Operating Temperature: -

封裝: -

庫存7,392

ARM? Cortex?-A8

-

1.0GHz

-

512MB

4 connectors × 40 pin @ 0.05" step

2.4" x 1.5" (61mm x 38mm)

-

TE0712-02-200-2C

Trenz Electronic GmbH

SOM ARTIX-7 XC7A200T-2C 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,944

Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0729-02-2IF

Trenz Electronic GmbH

SOM ZYNQ XC7Z020-2I 512MB RTC

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec BTE
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,944

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

512MB

Samtec BTE

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

20-101-0508

Digi International

MODULE RABBITCORE RCM3010

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 30MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存7,200

Rabbit 3000

-

30MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

DC-ME9-01-C-50

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,784

-

DC-ME4-01T-IPM-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,848

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-EM-02T-GORL

Digi International

MODULE EM CUSTOMIZABLE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,296

-

TE0745-02-30-1IA

Trenz Electronic GmbH

SOM DDR3 1GB ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,120

ARM® Cortex®-A9

Zynq-7000 (Z-7030)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

TE0820-03-02CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存6,912

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

0°C ~ 85°C

ME-XU5-3EG-2I-D11E-R1-2

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU3EG 2GB+1GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 512MB, 2GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

Request a Quote

ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

600MHz, 1.5GHz

16GB

512MB, 2GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0817-01-4AI21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU4CG-1FBVB900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

TE0808-05-9BE21-AK

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0725-04-72I-1-B

Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 100MHZ 32MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

EC-VA-MPEG2-8B-60-1080-OPVXC-0000

System-On-Chip (SOC) Technologies Inc.

ENCODER MEPG2 HD VID/AUD 8BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

ME-XU8-4CG-1E-D11E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU4CG 2GB+2GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 1GB, 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

1GB, 2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0720-04-62I33NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6

ARM® Cortex®-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

SM-K24-XCL2GC

AMD

SOM K24 KRIA ZYNQ MPSOC

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存741

-

5728-PJ-4AA-RC

Critical Link LLC

TEXAS INSTRUMENTS AM5728 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

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ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

EC-VA-H265-10B-60-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H265 EN 60FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

SM-K26-XCL2GI

AMD

IC MOD ARM CORTEX A53 533MHZ

Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Speed: 533MHz, 1.333GHz
Flash Size: 16GB eMMC, 64MB QSPI
RAM Size: 4GB
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Operating Temperature: -40°C ~ 100°C (TJ)

封裝: -

庫存1,053

ARM® Cortex®-A53

Arm® Cortex®-R5F

533MHz, 1.333GHz

16GB eMMC, 64MB QSPI

4GB

2 x 240 Pin

3.030" L x 2.360" W (77.00mm x 60.00mm)

-40°C ~ 100°C (TJ)

2DC-VA-MPEG2-8B-30-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 DEC 30FPS 1080 SODIMM

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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Artix-7 XC7A200T

-

200MHz

32MB

512MB

-

ME-XU7-15EG-2I-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I
Speed: -
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I

-

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C