頁 45 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC) | 黑森爾電子
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嵌入式 - 微控制器、微處理器、FPGA 模組

記錄 1,650
頁  45/59
圖片
零件編號
製造商
描述
封裝
庫存
數量
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
SOMOMAP3530-20-1670AGIR
Logic

SYSTEM ON MODULE LV OMAP3530

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, OMAP3530
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 256MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存3,920
ARM? Cortex?-A8, OMAP3530
-
600MHz
256MB
128MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.06" (15mm x 27mm)
-40°C ~ 85°C
M5485EFE
NXP

MODULE FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5485
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 2MB (Boot)
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存3,056
ColdFire V4e, MCF5485
-
200MHz
2MB (Boot)
64MB
-
3.7" x 4.5" (93.4mm x 114.3mm)
-40°C ~ 85°C
CENGLH7A400-10-503HCR
Logic

CARD ENGINE 64MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM922T, LH7A400
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,664
ARM922T, LH7A400
-
200MHz
16MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
30064
Parallax Inc.

STAMP PLC

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存7,552
-
-
-
-
-
-
-
-
BS2SX-IC
Parallax Inc.

BASIC STAMP 2SX MODULE

  • Module/Board Type: MCU Core
  • Core Processor: SX28AC
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 16KB EEPROM
  • RAM Size: 32B
  • Connector Type: -
  • Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存4,544
SX28AC
-
50MHz
16KB EEPROM
32B
-
1.2" x 0.6" (30mm x 15mm)
0°C ~ 70°C
TE0782-02-100-2I
Trenz Electronic GmbH

SOM ZYNQ XC7Z100-2I 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7100)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec QTH
  • Size / Dimension: 3.35" x 3.35" (85mm x 85mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,384
ARM Cortex-A9
Zynq-7000 (Z-7100)
-
32MB
1GB
Samtec QTH
3.35" x 3.35" (85mm x 85mm)
-40°C ~ 85°C
TE0841-01-035-1I
Trenz Electronic GmbH

SOM USCALE XCKU035-1I 1GB DDR4

  • Module/Board Type: FPGA
  • Core Processor: Kintex UltraScale KU35
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 4GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存7,744
Kintex UltraScale KU35
-
-
32MB
4GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
CC-MX-LD69-ZM
Digi International

MODULE I.MX53 800MHZ 512MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存6,560
-
-
-
-
-
-
-
-
TE0720-03-1CF
Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,120
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
3354-HX-X38-RI
Critical Link LLC

MITYSOM-3354 W/ AM3354

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3354
  • Co-Processor: NEON SIMD
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,864
ARM? Cortex?-A8, AM3354
NEON SIMD
800MHz
512MB
512MB
SO-DIMM-204
2.66" x 1.5" (67.6mm x 38.1mm)
-40°C ~ 85°C
TE0741-03-160-2C1
Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 160T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存3,840
Kintex-7 160T
-
200MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
CC-MX-LD6A-ZM
Digi International

MOD I.MX53 1GB FLASH 512MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, i.MX53
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 1GB
  • RAM Size: 512MB
  • Connector Type: Board-to-Board (BTB) Socket - 360
  • Size / Dimension: 3.23" x 1.97" (82mm x 50mm
  • Operating Temperature: -20°C ~ 85°C
封裝: -
庫存5,760
ARM? Cortex?-A8, i.MX53
-
800MHz
1GB
512MB
Board-to-Board (BTB) Socket - 360
3.23" x 1.97" (82mm x 50mm
-20°C ~ 85°C
DC-ME4-01T-S
Digi International

MOD ME 8MB SDRAM 4MB FLASH SGL

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,096
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
BS2-IC
Parallax Inc.

BASIC STAMP II MODULE

  • Module/Board Type: MCU Core
  • Core Processor: PIC16C57C
  • Co-Processor: -
  • Speed: 20MHz
  • Flash Size: 2KB EEPROM
  • RAM Size: 32B
  • Connector Type: -
  • Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存10,224
PIC16C57C
-
20MHz
2KB EEPROM
32B
-
1.2" x 0.6" (30mm x 15mm)
0°C ~ 70°C
DC-ME4-01T-VTY
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,960
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
DC-ME4-01T-HPA-1
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存7,072
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
TE0720-03-61C33FA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: 125MHz
  • Flash Size: 4GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
125MHz
4GB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
EC-VA-MPEG2-8B-60-1080-MD00C-A200T
System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 ENC 60FPS 1080 SODIMM

  • Module/Board Type: DSP, FPGA Core
  • Core Processor: -
  • Co-Processor: Xilinx Artix-7 XC7A200T
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: SO-DIMM
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
-
Xilinx Artix-7 XC7A200T
-
32MB
512MB
SO-DIMM
-
-
DC-V-H264-8B-30-1080-MXC-SL
System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 256KB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
Artix-7 A200T
-
-
32MB
256KB
SO-DIMM-204
2.700" L x 2.000" W (68.00mm x 51.00mm)
0°C ~ 85°C
TE0808-05-9BE81-L
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: -
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -
封裝: -
Request a Quote
-
-
-
128MB
4GB
-
2.990" L x 2.050" W (76.00mm x 52.00mm)
-
FORLINX-FETMX6ULL-S-08512SE8GED13
Forlinx Embedded

NXP i.MX6ULLSOM,512MB DDR3,8GB e

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 8GB eMMC
  • RAM Size: 512MB
  • Connector Type: Edge Connector
  • Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm)
  • Operating Temperature: -25°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A7
-
800MHz
8GB eMMC
512MB
Edge Connector
1.380" L x 1.732" W (35.00mm x 44.00mm)
-25°C ~ 85°C
TE0712-03-82C36-AW
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 XC7A200T-2FBG484C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
Artix-7 XC7A200T-2FBG484C
-
-
32MB
1GB
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
A20-SOM204-1GS16ME16G-MC
Olimex LTD

IC

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: 16MB
  • RAM Size: 1GB
  • Connector Type: 204 Pin
  • Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
ARM® Cortex®-A7
-
1GHz
16MB
1GB
204 Pin
3.307" L x 2.638" W (84.00mm x 67.00mm)
0°C ~ 70°C
ME-XU5-5EV-2I-D12E-R1-2
Enclustra FPGA Solutions

SOM ZYNQ US+ ZU5EV 4GB+1GB PL

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
  • Co-Processor: -
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 1GB, 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存153
ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
-
600MHz, 1.5GHz
16GB
1GB, 4GB
168 Pin
2.200" L x 2.130" W (56.00mm x 54.00mm)
-40°C ~ 85°C
TE0745-03-81C31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
ARM® Cortex®-A9
Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
-
64MB
1GB
Board-to-Board (BTB) Socket
2.047" L x 2.992" W (52.00mm x 76.00mm)
0°C ~ 70°C
MA-XU3-2CG-1E-D10-R2
Enclustra FPGA Solutions

SOM ZYNQ US+ ZU2CG 1GB

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
  • Co-Processor: -
  • Speed: 533MHz, 1.333GHz
  • Flash Size: 16GB
  • RAM Size: 1GB
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
-
533MHz, 1.333GHz
16GB
1GB
SO-DIMM-200
2.660" L x 1.180" W (67.60mm x 30.00mm)
0°C ~ 85°C
TE0741-04-D2I-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA Core
  • Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0720-03-S003C1
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: -
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 8GB
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
-
Zynq-7000 (Z-7020)
-
8GB
-
-
-
-