頁 51 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-LC47-VM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存3,232	-	-	-	-	-	-	-	-
CC-WMX-LB69-EYK1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存4,416	-	-	-	-	-	-	-	-
CC-MX-LB69-GMD-1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,752	-	-	-	-	-	-	-	-
CC-MX-LB69-GMD	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,712	-	-	-	-	-	-	-	-
SOMDM3730-31-2780AKCR	Logic	SYSTEM ON MODULE WIRELESS TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,000	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	0°C ~ 70°C
101-1068	Digi International	MODULE RABBITCORE RCM3315 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存3,472	Rabbit 3000	-	44.2MHz	512KB (Internal), 4MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH7A404-11-504HC	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,408	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-SP-01R-C	Digi International	ADAPTER SP CUSTOM MODEL RS-232 Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,056	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
CENGLH7A400-10-504HI	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,800	ARM922T, LH7A400	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
TE0600-03IN	Trenz Electronic GmbH	SOM GIGABEE 2X128MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,840	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0726-03R	Trenz Electronic GmbH	SBC ZYNQBERRY Z7010 HDMI USB ETH Module/Board Type: FPGA Core Processor: - Co-Processor: Zynq-7000 (Z-7010) Speed: 667MHz Flash Size: 16MB RAM Size: 128MB Connector Type: CSI, DSI Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,640	-	Zynq-7000 (Z-7010)	667MHz	16MB	128MB	CSI, DSI	1.57" x 1.18" (40mm x 30mm)	0°C ~ 70°C
3352-HX-X47-RI	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 1GB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,720	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	1GB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
20-101-0518	Digi International	MODULE RABBITCORE RCM3110 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 1.65" (47mm x 42mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,308	Rabbit 3000	-	29.4MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 1.65" (47mm x 42mm)	-40°C ~ 85°C
ME-XU1-6EG-1I-D11E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU6EG 2GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0715-04-71C33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
ME-ZX1-30-2I-D10-R3	Enclustra FPGA Solutions	SOM ZYNQ 7Z030 1GB+0.25GB PL Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Kintex-7 Speed: 800MHz Flash Size: 512MB RAM Size: 256MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存288	ARM® Dual-Core Cortex-A9	Kintex-7	800MHz	512MB	256MB, 1GB	168 Pin	2.520" L x 2.130" W (64.00mm x 54.00mm)	-40°C ~ 85°C
TE0813-02-5DI81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0723-03-41C64-A	Trenz Electronic GmbH	IC MOD CORTEX-A9 12MHZ 512MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-4DE21-L	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0714-03-50-2IAC6	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A50T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
TMS380C16PQL	Texas Instruments	TOKEN RING COMMPROCESSOR Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
5748-PJ-4AA-RC	Critical Link LLC	TEXAS INSTRUMENTS AM5748 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
ME-XU7-6EG-1I-D11E-R3	Enclustra FPGA Solutions	IC MOD 533MHZ/1.333GHZ 1GB/2BG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 1GB, 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	1GB, 2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0741-04-G2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
ME-XU1-15EG-1E-D12E-G1-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0745-02-81C11-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0712-03-72C36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Processor: Artix-7 XC7A100T-2FGG484C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Artix-7 XC7A100T-2FGG484C	-	-	32MB	1GB	Board-to-Board (BTB) Socket - 160	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
8ULP_SOM_2R16E_I	Boundary Devices	I.MX8ULP SOM / 2GB / 16GB EMMC / Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存30	-	-	-	-	-	-	-	-

CC-WMX-LC47-VM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存3,232

-

CC-WMX-LB69-EYK1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存4,416

-

CC-MX-LB69-GMD-1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,752

-

CC-MX-LB69-GMD

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,712

-

SOMDM3730-31-2780AKCR

Logic

SYSTEM ON MODULE WIRELESS TORP

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,000

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

0°C ~ 70°C

101-1068

Digi International

MODULE RABBITCORE RCM3315

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存3,472

Rabbit 3000

-

44.2MHz

512KB (Internal), 4MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGLH7A404-11-504HC

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,408

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

DC-SP-01R-C

Digi International

ADAPTER SP CUSTOM MODEL RS-232

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,056

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

CENGLH7A400-10-504HI

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,800

ARM922T, LH7A400

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

TE0600-03IN

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,840

Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0726-03R

Trenz Electronic GmbH

SBC ZYNQBERRY Z7010 HDMI USB ETH

Module/Board Type: FPGA
Core Processor: -
Co-Processor: Zynq-7000 (Z-7010)
Speed: 667MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: CSI, DSI
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,640

-

Zynq-7000 (Z-7010)

667MHz

16MB

128MB

CSI, DSI

1.57" x 1.18" (40mm x 30mm)

0°C ~ 70°C

3352-HX-X47-RI

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 1GB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,720

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

1GB

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

20-101-0518

Digi International

MODULE RABBITCORE RCM3110

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 1.65" (47mm x 42mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,308

Rabbit 3000

-

29.4MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 1.65" (47mm x 42mm)

-40°C ~ 85°C

ME-XU1-6EG-1I-D11E-R4-1

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU6EG 2GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

Request a Quote

ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0715-04-71C33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

ME-ZX1-30-2I-D10-R3

Enclustra FPGA Solutions

SOM ZYNQ 7Z030 1GB+0.25GB PL

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Kintex-7
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存288

ARM® Dual-Core Cortex-A9

Kintex-7

800MHz

512MB

256MB, 1GB

168 Pin

2.520" L x 2.130" W (64.00mm x 54.00mm)

-40°C ~ 85°C

TE0813-02-5DI81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

TE0723-03-41C64-A

Trenz Electronic GmbH

IC MOD CORTEX-A9 12MHZ 512MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

TE0803-04-4DE21-L

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0714-03-50-2IAC6

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A50T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Artix-7 A50T

Artix-7

-

16MB

-

1.570" L x 1.180" W (40.00mm x 30.00mm)

-40°C ~ 85°C

TMS380C16PQL

Texas Instruments

TOKEN RING COMMPROCESSOR

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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-

5748-PJ-4AA-RC

Critical Link LLC

TEXAS INSTRUMENTS AM5748 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

ME-XU7-6EG-1I-D11E-R3

Enclustra FPGA Solutions

IC MOD 533MHZ/1.333GHZ 1GB/2BG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 1GB, 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

1GB, 2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0741-04-G2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Xilinx Kintex-7 FPGA XC7K410T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

ME-XU1-15EG-1E-D12E-G1-R4-1

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0745-02-81C11-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7035)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0712-03-72C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA
Core Processor: Artix-7 XC7A100T-2FGG484C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Artix-7 XC7A100T-2FGG484C

-

32MB

1GB

Board-to-Board (BTB) Socket - 160

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

8ULP_SOM_2R16E_I

Boundary Devices

I.MX8ULP SOM / 2GB / 16GB EMMC /

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

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