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行業趨勢

STMicroelectronics Introduces Page EEPROM 2-in-1 Memory

發表於 十月 16, 2024
STMicroelectronics has introduced its new Page EEPROM, which combines the energy efficiency and durability of EEPROM technology with the storage capacity and read/write speed of flash memory. This hybrid memory solution is ideal for applications that face extreme space and power constraints, providing embedded systems with storage options that meet rising demands for both capacity and performance.

X-FAB New Generation Photodiodes Significantly Improve Sensing Sensitivity

發表於 十月 11, 2024
X-FAB Silicon Foundries (“X-FAB”), a globally recognized leader in analog/mixed-signal semiconductor foundries, today announced the release of four new high-performance photodiodes on its 180nm CMOS process platform, XS018, which is specially optimized for optical sensor applications. This addition expands the options available for photodetectors and strengthens X-FAB's already extensive product portfolio.

Bourns Introduces AEC-Q200 Compliant High Voltage Gas Discharge Tubes (GDTs)

發表於 十月 8, 2024
Bourns, Inc., a globally recognized manufacturer of power, protection, and sensing solutions, has introduced the SA2-A Series high-voltage Gas Discharge Tube (GDT). As the latest addition to Bourns' extensive AEC-Q200 compliant product lineup, the SA2-A Series is specifically engineered to meet the stringent requirements of harsh environments, ensuring exceptional reliability, durability, and regulatory compliance.

Challenges Brought to Gate Driver Power Supplies by WBG Devices

發表於 九月 27, 2024
The gate driver power supplies for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices must meet the unique biasing requirements of these wide-bandgap semiconductors. This article discusses the key factors to consider when designing gate driver power supplies for SiC and GaN applications.

STMicroelectronics Launches FIPS 140-3 Certified TPM Modules

發表於 九月 27, 2024
STMicroelectronics has announced that its STSAFE-TPM Trusted Platform Module (TPM) has achieved FIPS 140-3 certification, making it one of the first standardized cryptographic modules on the market to receive this certification.

In-Depth Analysis of Modular Silicon Carbide (SiC) Device Evaluation

發表於 九月 24, 2024
Silicon Carbide (SiC) is revolutionizing the power electronics field by delivering exceptional efficiency, increased power density, and improved thermal performance, especially in automotive applications such as main drives, onboard chargers, and battery charging stations.

Teledyne e2v EV10AS940: A Revolutionary Journey in Microwave ADCs

發表於 九月 13, 2024
In today’s rapidly advancing technology landscape, high-speed data acquisition and processing capabilities are essential drivers of innovation. The EV10AS940, the latest development by Teledyne e2v, is a cutting-edge microwave analog-to-digital converter (ADC) designed to meet the demand for high-speed data acquisition. This 10-bit, single-channel, 12.8 GSPS ADC not only stands out with its exceptional performance but also sets a new industry benchmark with its integrated digital features—frequency hopping and beamforming.

Melexis Unveils Triphibian™ Digital Output Pressure Sensor Chip

發表於 九月 12, 2024
Melexis Unveils Triphibian™ Digital Output Pressure Sensor Chip

The New Era of Electrochemical Sensing Technology

發表於 九月 10, 2024
At the forefront of scientific exploration, electrochemical sensing has emerged as an indispensable and adaptable tool, influencing various industries. From life sciences and environmental studies to industrial materials and food processing, the ability to quantify chemical substances leads to deeper insights, ultimately enhancing safety, efficiency, and understanding.

Switzerland Develops World’s First Miniature BCI Chip MiBMI with 91% Accuracy

發表於 九月 6, 2024
Brain-Computer Interface (BCI) technology, a cutting-edge innovation explored by countries worldwide, holds groundbreaking potential for helping patients with severe motor disabilities restore communication and physical control. It may even extend to fields like speech synthesis and handwriting assistance. However, current BCI devices are bulky, power-hungry, and have limited practical applications.