Qualcomm Technologies, Inc., announced that the Qualcomm X100 5G RAN Accelerator Card and Qualcomm QRU100 5G RAN Platform are starting to demo to customers and partners worldwide to integrate and validate next-generation 5G mobile infrastructure solutions.
Qorvo QPA1724 Ku/K-band Gallium Nitride (GaN) Power Amplifier (PA). It delivers twice the power of comparable PAs and delivers excellent broadband linear power, gain, and power-added efficiency (PAE) with very good RF performance. The product is housed in a 7.5mm × 6.0mm × 1.6mm QFN package and is fully DC and RF tested to ensure electrical compliance
Qualcomm launched the Snapdragon W5+ and Snapdragon W5 platforms for the next generation of wearable devices, achieving a comprehensive jump. The new platform is designed to bring ultra-low power consumption and breakthrough performance to the next generation of connected wearables by delivering long-lasting battery life, a premium user experience and innovative thin and light designs.
EDIFIER Lolli3 true Wireless Bluetooth headset and MiniBuds2 true wireless Bluetooth headset have been released. Snapdragon Sound™ Snapdragon Audio Is a powerful Bluetooth connection that delivers high quality audio, full link low latency optimization, professional call noise reduction technology and smooth transmission performance. Bring users a full range of listening experience.
The new unified Qualcomm AI software stack product portfolio changes the way developers access, expands the company's AI leadership in the intelligent network edge field, and the complete AI product portfolio works with Qualcomm Technologies' products at different levels to provide OEM manufacturers and developers. Bring advanced AI solutions and increase efficiency
