頁 154 - 最新技術 | 黑森爾電子
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最新技術

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Technology Cover

2022-02-03, 75% space saving data acquisition solution

Mouser is now buying the ADAQ4003µ M module DAQ from Analog Devices, which incorporates a low noise, fully differential ADC driver; Stable reference buffer; High-speed 18-bit 2MSPS SAR ADC. Also included is the company's passive technology with a 7mm x 7mm BGA package that saves up to 75% of board space over a multi-component equivalent solution

Technology Cover

2022-02-02, Plug-in connector switch cuts panel assembly time in half

Foremost Electronics currently offers a range of 22mm control panel switches from IDEC. Push-in terminal technology is commonly used In control panel and machine manufacturing applications. Industry standard YW and HW series and CW series (embedded mounted) switches offer this technology option

Technology Cover

2022-02-02, Smart lighting solutions for reliable and secure wireless Internet of Things networks

The Thread group and the DALI Alliance have adopted Thread as the first networking technology available in DALI+. The DALI protocol for digital lighting control allows for the installation of powerful, scalable and flexible lighting networks. Using Thread's mesh networking technology, DALI+ and Thread offer the same rich lighting control and data-driven capabilities for wireless DALI, such as real-time monitoring and wireless.

Technology Cover

2022-02-02, Microprocessor with first-class power efficiency and high precision AI accelerator

Renesas Electronics has extended its RZ/V family of microprocessors to the new RZ/V2L microprocessors for entry level AI applications. The company's exclusive AI accelerator, DRP-AI, makes embedded AI easier and more energy efficient. Drp-ai provides real-time AI reasoning and image processing capabilities with features critical to camera support such as color correction and noise reduction. RZ/V2L is also packaged and compatible with existing RZ/G2L general-purpose microprocessors. Can be widely used in the field

Technology Cover

2022-02-02, Off-the-shelf cable assemblies are primarily used for automotive and commercial vehicle applications

Molex 300mm MX150 cable assemblies are now available from RS Components and provide a current rating of 22A. It has a gasket cap that protects the seal and ensures proper alignment of the terminal.

Technology Cover

2022-02-02, Six new SiC FETs offer performance and reliability

UnitedSiC has expanded its FET portfolio with six new 650V and 1200V options, and the latest release marks another step in accelerating the migration to SiC in applications such as server and telecom power supplies, industrial battery chargers and power supplies, electric vehicle on-board chargers and DC-DC converters

Technology Cover

2022-02-01, The new varistors increase surge protection while reducing the space occupied by components

Littelfuse has released the Xtreme varistor family. Using a proprietary powder formulation developed by the company, these new, smaller varistors achieve strong surge properties that help protect against damage, fire hazard and even catastrophic failure under severe conditions. The series is available in bulk, tape and reel packaging.

Technology Cover

2022-02-01, Exclusive agreement to provide high quality inspection fixtures

Ignys are the exclusive UK distributor of high-quality test fixtures from MG Products. The company works closely with engineering teams and product development companies of all sizes to help bring their great tech ideas to life.

Technology Cover

2022-02-01, The extension series adds output modules for industrial applications

Vox Power has introduced two new 300W output modules for the NEVO+600 and NEVO+1200 series of modular Power supplies. Fully approved by industrial and medical safety agencies, the product line offers system designers unmatched flexibility in applications where power density, size and weight are key factors. Very reliable output modules are ideal for industrial, Industry 4.0, machine building, robotics and ITE applications

Technology Cover

2022-02-01, Quad-Output Mini PMIC for Camera Applications

The Maxim Integrated MAX25250 Four Output Mini PMIC is an efficient four-output PMIC that combines three DC-DC converters and a high PSRR LDO designed for camera applications. OUT1 is A 1A high voltage synchronous buck converter. OUT2 and OUT3 low voltage synchronous buck converters work from OUT1. OUT2 provides 1.2a for high pixel cameras and high speed serializers. OUT3 provides 1.2a to power the imager, serializer, and MCU secondary rails. The OUT4 is a low voltage, low noise, high PSRR imaging power LDO.

Technology Cover

2022-01-31, OLED with rotary switch and capacitive touchscreen

Raystar's REX128128D COG OLED module adds a rotary switch module, which is now available from Rutronik

Technology Cover

2022-01-31, The low ohmic buffer shunt was developed for high pulse loads

Isabellenhutte has created a powerful low-ohmic buffering shunt, THE SMT-V, with extremely high pulse power ratings. The design and materials of the new SMT-V are better able to withstand pulsed loads. High pulse power ratings can be achieved by using NOVENTIN, an internal resistance material. The device can absorb 2.5J pulse energy with a pulse duration of 0.1 s and a terminal temperature of 120℃. Several 50 pulses can be absorbed with corresponding gap time during its life cycle

Technology Cover

2022-01-31, Optimized multi-band RF Iot front-end modules to improve efficiency

Mouser currently holds Skyworks Solutions' Sky68031-11 Multi-band RF Iot front-end module. The MODULE's PA load line has been optimized to improve efficiency while achieving 3GPP ACLR and emission mask specifications with LTE up to 6RB.

Technology Cover

2022-01-30, Ultra-compact AI reasoning system with powerful low-power computing,

Advantech Has launched the AIR-020 series. Offers a small footprint of 139mm x 110mm x 44.5mm(5.47 "x 4.33" x 1.75 "). It is powered by NVIDIA Xavier NX SoM, Jetson TX2 NX's AIR-020T, and Jetson Nano's Air-020N to meet different AI applications and performance needs. The compact design is only 139mm x 110mm x 44.5mm(5.47 "x 4.33" x 1.75 "). Perfect for edge AI applications,

Technology Cover

2022-01-30, The satellite communications product family includes the first dual beam active beamforming IC series

Renesas Electronics has expanded its mmWave LNAs and Tx BFC product portfolio with the introduction of three new dual-beam active beamforming chips. These new integrated circuits offer first-class power consumption, noise, compact size, and simple integration. The new F61xx Rx device is believed to be the first commercial product to offer dual-beam capability for simultaneous multi-satellite, multi-orbit operations over the full Ku and Ka satellite communications bands. And the new device offers lower power consumption, increased on-chip beam memory

Technology Cover

2022-01-30, BLE RF Transceiver Technology Simplifies Board Design and Improves Power Efficiency

Renesas Electronics has developed two 2.4ghz rf transceiver technologies that support the Bluetooth LE low-power, near-field communication standard. There are also two new technologies to meet these requirements: a matching circuit technique and another signal correction technique for locally generated reference signals. With these new technologies, it reduces the circuit area (including power supply) to 0.84mm2, enabling a smaller installation area and better power efficiency.

Technology Cover

2022-01-29, Unique QVGA resolution ToF sensor with integrated INFRARED band-pass filter

Melexis has introduced a new ToF 3D camera, the MLX75026, which is equipped with a fully integrated Infrared Band-pass (IRBP) filter. By incorporating IRBP, it eliminates the need to incorporate a separate infrared filter in the lens or sensor assembly. The device is targeted at automotive applications, including safety applications related to driver monitoring, in-car monitoring, gesture control, and airbag deployment