頁 223 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S05VO8C	Xilinx Inc.	IC PROM PROG 50K 8-SOIC Programmable Type: OTP Memory Size: 50kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存7,600
XCZU19EG-1FFVD1760I	Xilinx Inc.	IC FPGA 308 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,176
XC7Z035-2FFG900I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,392
XCZU4EG-2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存6,720
XCV300-5PQ240I	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 166 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存15,744
XCV1000E-6FG900C	Xilinx Inc.	IC FPGA 660 I/O 900FGBA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 660 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存7,440
XC4013XL-3HT176I	Xilinx Inc.	IC FPGA 145 I/O 176HTQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 145 Number of Gates: 13000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-TQFP (24x24)	封裝: 176-LQFP Exposed Pad	庫存3,872
XC3042-125PQ100C	Xilinx Inc.	IC FPGA 82 I/O 100QFP Number of LABs/CLBs: 144 Number of Logic Elements/Cells: - Total RAM Bits: 30784 Number of I/O: 82 Number of Gates: 3000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存35,760
XCVU095-1FFVB2104I	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 62259200 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存7,392
XC6VSX475T-1FFG1759C	Xilinx Inc.	IC FPGA 840 I/O 1759FCBGA Number of LABs/CLBs: 37200 Number of Logic Elements/Cells: 476160 Total RAM Bits: 39223296 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存6,320
XC4VLX160-11FFG1148C	Xilinx Inc.	IC FPGA 768 I/O 1148FCBGA Number of LABs/CLBs: 16896 Number of Logic Elements/Cells: 152064 Total RAM Bits: 5308416 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	封裝: 1148-BBGA, FCBGA	庫存6,736
XCKU13P-1FFVE900E	Xilinx Inc.	XCKU13P-1FFVE900E Number of LABs/CLBs: 42660 Number of Logic Elements/Cells: 746550 Total RAM Bits: 59084800 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存5,984
XC6VCX195T-2FF784I	Xilinx Inc.	IC FPGA 400 I/O 784FCBGA Number of LABs/CLBs: 15600 Number of Logic Elements/Cells: 199680 Total RAM Bits: 12681216 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (29x29)	封裝: 784-BBGA, FCBGA	庫存5,568
XC7K325T-2FBG676I	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,968
XC4VSX35-10FFG668C	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 34560 Total RAM Bits: 3538944 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存6,640
XC6SLX150T-2FG900C	Xilinx Inc.	IC FPGA 540 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 540 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存3,200
XA6SLX45T-3FGG484Q	Xilinx Inc.	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,064
XC3S1200E-5FG400C	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 2168 Number of Logic Elements/Cells: 19512 Total RAM Bits: 516096 Number of I/O: 304 Number of Gates: 1200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存6,704
XA6SLX16-3FTG256Q	Xilinx Inc.	IC FPGA 186 I/O 256FTGBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存5,760
XC3S250E-5PQG208C	Xilinx Inc.	IC FPGA 158 I/O 208QFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 158 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存17,076
XC3S250E-4VQG100C	Xilinx Inc.	IC FPGA 66 I/O 100VQFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 66 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存39,828
XC9536-10VQ44I	Xilinx Inc.	IC CPLD 36MC 10NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存22,092
XC95288XV-7FG256C	Xilinx Inc.	IC CPLD 288MC 7.5NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.37 V ~ 2.62 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存36,336
XCR3512XL-10FG324I	Xilinx Inc.	IC CPLD 512MC 9NS 324BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 260 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-BBGA Supplier Device Package: 324-FBGA (23x23)	封裝: 324-BBGA	庫存7,952
XC2C512-10FT256I	Xilinx Inc.	IC CPLD 512MC 9.2NS 256BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.2ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 212 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存12,756
XCR3064XL-10VQ44I	Xilinx Inc.	IC CPLD 64MC 9.1NS 44VQFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存5,024
XC7A25T-2CSG325C	Xilinx Inc.	XC7A25T-2CSG325C Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存5,664
XCKU15P-2FFVE1517I	Xilinx Inc.	XCKU15P-2FFVE1517I Number of LABs/CLBs: 65340 Number of Logic Elements/Cells: 1143450 Total RAM Bits: 82329600 Number of I/O: 512 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存4,400

XC17S05VO8C

Xilinx Inc.

IC PROM PROG 50K 8-SOIC

Programmable Type: OTP
Memory Size: 50kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存7,600

XCZU19EG-1FFVD1760I

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,176

XC7Z035-2FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,392

XCZU4EG-2FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存6,720

XCV300-5PQ240I

Xilinx Inc.

IC FPGA 166 I/O 240QFP

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 166
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存15,744

XCV1000E-6FG900C

Xilinx Inc.

IC FPGA 660 I/O 900FGBA

Number of LABs/CLBs: 6144
Number of Logic Elements/Cells: 27648
Total RAM Bits: 393216
Number of I/O: 660
Number of Gates: 1569178
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存7,440

XC4013XL-3HT176I

Xilinx Inc.

IC FPGA 145 I/O 176HTQFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 145
Number of Gates: 13000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-TQFP (24x24)

封裝: 176-LQFP Exposed Pad

庫存3,872

XC3042-125PQ100C

Xilinx Inc.

IC FPGA 82 I/O 100QFP

Number of LABs/CLBs: 144
Number of Logic Elements/Cells: -
Total RAM Bits: 30784
Number of I/O: 82
Number of Gates: 3000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存35,760

XCVU095-1FFVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 62259200
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存7,392

XC6VSX475T-1FFG1759C

Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

Number of LABs/CLBs: 37200
Number of Logic Elements/Cells: 476160
Total RAM Bits: 39223296
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存6,320

XC4VLX160-11FFG1148C

Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

Number of LABs/CLBs: 16896
Number of Logic Elements/Cells: 152064
Total RAM Bits: 5308416
Number of I/O: 768
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1148-BBGA, FCBGA
Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

庫存6,736

XCKU13P-1FFVE900E

Xilinx Inc.

XCKU13P-1FFVE900E

Number of LABs/CLBs: 42660
Number of Logic Elements/Cells: 746550
Total RAM Bits: 59084800
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,984

XC6VCX195T-2FF784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

Number of LABs/CLBs: 15600
Number of Logic Elements/Cells: 199680
Total RAM Bits: 12681216
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (29x29)

封裝: 784-BBGA, FCBGA

庫存5,568

XC7K325T-2FBG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,968

XC4VSX35-10FFG668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 34560
Total RAM Bits: 3538944
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存6,640

XC6SLX150T-2FG900C

Xilinx Inc.

IC FPGA 540 I/O 900FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 540
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存3,200

XA6SLX45T-3FGG484Q

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,064

XC3S1200E-5FG400C

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 2168
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 304
Number of Gates: 1200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存6,704

XA6SLX16-3FTG256Q

Xilinx Inc.

IC FPGA 186 I/O 256FTGBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 186
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存5,760

XC3S250E-5PQG208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 158
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存17,076

XC3S250E-4VQG100C

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 66
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存39,828

XC9536-10VQ44I

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存22,092

XC95288XV-7FG256C

Xilinx Inc.

IC CPLD 288MC 7.5NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 2.37 V ~ 2.62 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存36,336

XCR3512XL-10FG324I

Xilinx Inc.

IC CPLD 512MC 9NS 324BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.0ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 260
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Supplier Device Package: 324-FBGA (23x23)

封裝: 324-BBGA

庫存7,952

XC2C512-10FT256I

Xilinx Inc.

IC CPLD 512MC 9.2NS 256BGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 9.2ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 212
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存12,756

XCR3064XL-10VQ44I

Xilinx Inc.

IC CPLD 64MC 9.1NS 44VQFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存5,024

XC7A25T-2CSG325C

Xilinx Inc.

XC7A25T-2CSG325C

Number of LABs/CLBs: 1825
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存5,664

XCKU15P-2FFVE1517I

Xilinx Inc.

XCKU15P-2FFVE1517I

Number of LABs/CLBs: 65340
Number of Logic Elements/Cells: 1143450
Total RAM Bits: 82329600
Number of I/O: 512
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存4,400