頁 222 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S15APD8I	Xilinx Inc.	IC PROM SER 5000 I-TEMP 8-DIP Programmable Type: OTP Memory Size: 150kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存7,856
XCZU11EG-3FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,760
XC7Z100-1FFG900I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存2,384
XCZU5CG-L1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,280
XCZU5EV-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存2,560
XC7Z035-2FBG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,640
XC3S50AN-4FTG256I	Xilinx Inc.	IC FPGA 195 I/O 256FTBGA Number of LABs/CLBs: 176 Number of Logic Elements/Cells: 1584 Total RAM Bits: 55296 Number of I/O: 195 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,496
XCS40-4PQ208C	Xilinx Inc.	IC FPGA 169 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 169 Number of Gates: 40000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存12,168
XC4052XL-2HQ304C	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 256 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	封裝: 304-BFQFP Exposed Pad	庫存2,960
XC4044XL-3BG352C	Xilinx Inc.	IC FPGA 289 I/O 352MBGA Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 289 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存5,248
XC4028XL-3HQ208I	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 160 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存5,328
XC4008E-3PC84C	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 61 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存5,696
XC4003E-3PC84I	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 61 Number of Gates: 3000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存2,320
XC5204-6PQ160C	Xilinx Inc.	IC FPGA 124 I/O 160QFP Number of LABs/CLBs: 120 Number of Logic Elements/Cells: 480 Total RAM Bits: - Number of I/O: 124 Number of Gates: 6000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存9,960
XC4036XL-2HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 193 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存2,544
XC7VX485T-3FFG1930E	Xilinx Inc.	IC FPGA 700 I/O 1930FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1930-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存5,808
XQ5VLX220T-1EF1738I	Xilinx Inc.	IC FPGA VIRTEX-5 220K 1738FBGA Number of LABs/CLBs: 17280 Number of Logic Elements/Cells: 221184 Total RAM Bits: 7815168 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存5,072
XC7VX690T-2FF1157C	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,424
XC7VX415T-1FFG1927I	Xilinx Inc.	IC FPGA 600 I/O 1927FCBGA Number of LABs/CLBs: 32200 Number of Logic Elements/Cells: 412160 Total RAM Bits: 32440320 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1927-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存3,536
XC7K420T-L2FFG901I	Xilinx Inc.	IC FPGA 380 I/O 901FCBGA Number of LABs/CLBs: 32575 Number of Logic Elements/Cells: 416960 Total RAM Bits: 30781440 Number of I/O: 380 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 901-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存7,216
XC5VLX85-1FFG1153I	Xilinx Inc.	IC FPGA 560 I/O 1153FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 560 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	封裝: 1153-BBGA, FCBGA	庫存5,760
XC7K355T-2FFG901C	Xilinx Inc.	IC FPGA 300 I/O 901FCBGA Number of LABs/CLBs: 27825 Number of Logic Elements/Cells: 356160 Total RAM Bits: 26357760 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 901-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存6,400
XC4VLX80-11FFG1148C	Xilinx Inc.	IC FPGA 768 I/O 1148FCBGA Number of LABs/CLBs: 8960 Number of Logic Elements/Cells: 80640 Total RAM Bits: 3686400 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	封裝: 1148-BBGA, FCBGA	庫存6,320
XC2VP20-5FF1152C	Xilinx Inc.	IC FPGA 564 I/O 1152FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 564 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,048
XC3S250E-5FTG256C	Xilinx Inc.	IC FPGA 172 I/O 256FTBGA Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 172 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存4,800
XC7K410T-1FFG900C	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存6,288
XC2C64A-7VQG44C	Xilinx Inc.	IC CPLD 64MC 6.7NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存12,060
XC4VFX100-11FF1152C	Xilinx Inc.	IC FPGA VIRTEX-4 100K 1152-FBGA Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,840

XC17S15APD8I

Xilinx Inc.

IC PROM SER 5000 I-TEMP 8-DIP

Programmable Type: OTP
Memory Size: 150kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存7,856

XCZU11EG-3FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,760

XC7Z100-1FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存2,384

XCZU5CG-L1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,280

XCZU5EV-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存2,560

XC7Z035-2FBG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,640

XC3S50AN-4FTG256I

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Number of LABs/CLBs: 176
Number of Logic Elements/Cells: 1584
Total RAM Bits: 55296
Number of I/O: 195
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,496

XCS40-4PQ208C

Xilinx Inc.

IC FPGA 169 I/O 208QFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 169
Number of Gates: 40000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存12,168

XC4052XL-2HQ304C

Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Number of LABs/CLBs: 1936
Number of Logic Elements/Cells: 4598
Total RAM Bits: 61952
Number of I/O: 256
Number of Gates: 52000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 304-BFQFP Exposed Pad
Supplier Device Package: 304-PQFP (40x40)

封裝: 304-BFQFP Exposed Pad

庫存2,960

XC4044XL-3BG352C

Xilinx Inc.

IC FPGA 289 I/O 352MBGA

Number of LABs/CLBs: 1600
Number of Logic Elements/Cells: 3800
Total RAM Bits: 51200
Number of I/O: 289
Number of Gates: 44000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存5,248

XC4028XL-3HQ208I

Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Number of LABs/CLBs: 1024
Number of Logic Elements/Cells: 2432
Total RAM Bits: 32768
Number of I/O: 160
Number of Gates: 28000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存5,328

XC4008E-3PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 61
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存5,696

XC4003E-3PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: 238
Total RAM Bits: 3200
Number of I/O: 61
Number of Gates: 3000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存2,320

XC5204-6PQ160C

Xilinx Inc.

IC FPGA 124 I/O 160QFP

Number of LABs/CLBs: 120
Number of Logic Elements/Cells: 480
Total RAM Bits: -
Number of I/O: 124
Number of Gates: 6000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存9,960

XC4036XL-2HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Number of LABs/CLBs: 1296
Number of Logic Elements/Cells: 3078
Total RAM Bits: 41472
Number of I/O: 193
Number of Gates: 36000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存2,544

XC7VX485T-3FFG1930E

Xilinx Inc.

IC FPGA 700 I/O 1930FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1930-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存5,808

XQ5VLX220T-1EF1738I

Xilinx Inc.

IC FPGA VIRTEX-5 220K 1738FBGA

Number of LABs/CLBs: 17280
Number of Logic Elements/Cells: 221184
Total RAM Bits: 7815168
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存5,072

XC7VX690T-2FF1157C

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 54150
Number of Logic Elements/Cells: 693120
Total RAM Bits: 54190080
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,424

XC7VX415T-1FFG1927I

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

Number of LABs/CLBs: 32200
Number of Logic Elements/Cells: 412160
Total RAM Bits: 32440320
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1927-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存3,536

XC7K420T-L2FFG901I

Xilinx Inc.

IC FPGA 380 I/O 901FCBGA

Number of LABs/CLBs: 32575
Number of Logic Elements/Cells: 416960
Total RAM Bits: 30781440
Number of I/O: 380
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 901-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存7,216

XC5VLX85-1FFG1153I

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3538944
Number of I/O: 560
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1153-BBGA, FCBGA
Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

庫存5,760

XC7K355T-2FFG901C

Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

Number of LABs/CLBs: 27825
Number of Logic Elements/Cells: 356160
Total RAM Bits: 26357760
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 901-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存6,400

XC4VLX80-11FFG1148C

Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

Number of LABs/CLBs: 8960
Number of Logic Elements/Cells: 80640
Total RAM Bits: 3686400
Number of I/O: 768
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1148-BBGA, FCBGA
Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

庫存6,320

XC2VP20-5FF1152C

Xilinx Inc.

IC FPGA 564 I/O 1152FCBGA

Number of LABs/CLBs: 2320
Number of Logic Elements/Cells: 20880
Total RAM Bits: 1622016
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,048

XC3S250E-5FTG256C

Xilinx Inc.

IC FPGA 172 I/O 256FTBGA

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 172
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存4,800

XC7K410T-1FFG900C

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存6,288

XC2C64A-7VQG44C

Xilinx Inc.

IC CPLD 64MC 6.7NS 44VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.7ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 33
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存12,060

XC4VFX100-11FF1152C

Xilinx Inc.

IC FPGA VIRTEX-4 100K 1152-FBGA

Number of LABs/CLBs: 10544
Number of Logic Elements/Cells: 94896
Total RAM Bits: 6930432
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,840