Trenz Electronic GmbH 產品

TE0600-03B

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-100
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0710-02-35-2CF

Trenz Electronic GmbH

SOM ARTIX-7 35T 512 MBYTE DDR3

• Module/Board Type: FPGA
• Core Processor: Artix-7 A35T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: 512MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0711-01-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2C

• Module/Board Type: FPGA
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0723-03M

Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7010

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7010)
• Speed: 12MHz
• Flash Size: 16MB
• RAM Size: 512MB
• Connector Type: B2B
• Size / Dimension: -
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0720-03-1CF-S

Trenz Electronic GmbH

STARTER KIT XILINX ZYNQ MICROSOM

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封裝: -

TE0745-02-30-2IA

Trenz Electronic GmbH

SOM DDR3

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

TE0808-04-09EG-2IE

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL MIT ZYNQ U

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

TE0820-03-03EG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
• Operating Temperature: 0°C ~ 80°C

封裝: -

TE0803-03-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

TE0712-02-82C36-AW

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A200T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0813-02-2AE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0803-04-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0712-03-82C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

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TE0600-04-52I11-M

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA
• Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 16MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0782-02-045-2IC

Trenz Electronic GmbH

IC MODULE CORTEX

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0745-03-92I31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I AND HE

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0720-03-61Q42NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32GB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -

封裝: -

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TE0720-03-62I33GA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: 125MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0821-01-3BI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
• Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: 2 x 160 Pin
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0808-05-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: 4 x 160 Pin
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0630-02-52C12-A

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

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TE0712-02-82I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A200T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0821-01-3BE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: 2 x 100 Pin
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0808-04-BBE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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AM0010-02-4AE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ ZU4CG-1E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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TE0745-03-71I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: FPGA
• Core Processor: ARM® Cortex®-A9
• Co-Processor: Zynq-7000 (Z-7030)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封裝: -

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TE0820-05-2AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封裝: -

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TE0817-01-7DE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

封裝: -

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