圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
SIP SOCKET SINGLE ROW 6/7
|
封裝: - |
庫存6,516 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CS-7724 ASSY CAMERA SOCKET 24P
|
封裝: - |
庫存5,868 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SIP IC SKT 10 SSR SN/AU FLH ROHS
|
封裝: - |
庫存4,356 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
|
封裝: - |
庫存5,274 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TIN
|
封裝: - |
庫存4,554 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
510-AG91D-2LF= SIP ROHS, GOLD/TI
|
封裝: - |
庫存3,294 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存3,490 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TIN
|
封裝: - |
庫存5,886 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS TIN
|
封裝: - |
庫存5,562 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存5,328 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存6,174 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存2,844 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存8,334 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS TIN
|
封裝: - |
庫存5,400 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存2,790 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TIN
|
封裝: - |
庫存3,870 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存5,634 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
|
封裝: - |
庫存3,744 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
封裝: - |
庫存2,196 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
|
封裝: - |
庫存8,964 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
|
封裝: - |
庫存7,416 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
封裝: - |
庫存7,560 |
|
20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
封裝: - |
庫存3,780 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
|
封裝: - |
庫存2,196 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS TIN
|
封裝: - |
庫存7,632 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SIP IC SKT 5 SSR SN/AU FLH ROHS
|
封裝: - |
庫存2,268 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 6POS TIN
|
封裝: - |
庫存6,390 |
|
6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
808-11P1= INSUL.(RYNITE,BLK.)W
|
封裝: - |
庫存4,032 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |