圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
LEFT SIDE LGA3647-1 SOCKET-P1
|
封裝: - |
庫存8,514 |
|
1823 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
RIGHT SIDE LGA3647-1 SOCKET-P1
|
封裝: - |
庫存7,524 |
|
1823 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
LEFT SIDE LGA3647-0 SOCKET- P0
|
封裝: - |
庫存7,056 |
|
1823 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET LGA 1366POS GOLD
|
封裝: - |
庫存8,874 |
|
1366 (32 x 41) | 0.040" (1.01mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
封裝: - |
庫存6,660 |
|
4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET LGA 771POS GOLD
|
封裝: - |
庫存7,116 |
|
771 (33 x 33) | 0.043" (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -25°C ~ 100°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存18,672 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS TIN
|
封裝: - |
庫存30,996 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存20,388 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
|
封裝: - |
庫存26,754 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存27,318 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
32P,DIP SKT,600 CL,OTC,PB FREE
|
封裝: - |
庫存16,950 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA2011-1 0.38AU
|
封裝: - |
庫存7,254 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
封裝: - |
庫存9,192 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存7,248 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS TIN
|
封裝: - |
庫存16,980 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET LGA 2011POS GOLD
|
封裝: - |
庫存7,020 |
|
2011 (47 x 58) | - | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | 15µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
封裝: - |
庫存6,960 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
封裝: - |
庫存12,654 |
|
4 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
封裝: - |
庫存6,864 |
|
4 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | - | Solder Cup | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
封裝: - |
庫存20,484 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存27,192 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存17,940 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
24P,DIP SKT,300 CL,LDR,PB FREE
|
封裝: - |
庫存23,226 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
RIGHT SIDE LGA3647-0 SOCKET-P0
|
封裝: - |
庫存8,748 |
|
1823 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA2011-3
|
封裝: - |
庫存8,280 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 4POS GOLD
|
封裝: - |
庫存6,264 |
|
4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
封裝: - |
庫存6,648 |
|
3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |