Omron Electronics Inc-EMC Div 產品 - IC、電晶體用插槽

XR2A-2401-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,418

24 (2 x 12)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-2811-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,138

28 (2 x 14)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-2005

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 20POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,640

20 (1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-3211-NZ

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25µin (0.63µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,722

32 (2 x 16)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-2015

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 20POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,668

20 (1 x 20)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2T-1621-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame, Seal Tape
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,832

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame, Seal Tape

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1625

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,424

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C2611N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 26POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Threaded
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,374

26 (1 x 26)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Threaded

-

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1425

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,092

14 (2 x 7)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2P1041

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 10POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Threaded
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,344

10 (1 x 10)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Threaded

-

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2H-1611-N

Omron Electronics Inc-EMC Div

CONN ZIG-ZAG 16POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,858

16 (2 x 8)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1801-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,608

18 (2 x 9)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-1511-N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 15POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,304

15 (1 x 15)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-2011-N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 20POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,202

20 (1 x 20)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-1501-N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 15POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,754

15 (1 x 15)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1411-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,274

14 (2 x 7)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-1611-N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 16POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,974

16 (1 x 16)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-0825

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,742

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C1011N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 10POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Threaded
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,436

10 (1 x 10)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Threaded

-

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A0815

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Threaded
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,704

8 (2 x 4)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Threaded

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-0811-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,660

8 (2 x 4)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-0311-N

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 3POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,912

3 (1 x 3)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-3200-HSG

Omron Electronics Inc-EMC Div

CONN IC SOCKET 32POS

Type: Housing
Number of Positions or Pins (Grid): 32 (1 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,082

32 (1 x 32)

0.100" (2.54mm)

-

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

-

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2C-2000-HSG

Omron Electronics Inc-EMC Div

CONN IC SOCKET 20POS

Type: Housing
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: -
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,532

20 (1 x 20)

0.100" (2.54mm)

-

Beryllium Copper

-

Closed Frame

Solder

0.100" (2.54mm)

-

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-0802

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,910

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1401-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存14,460

14 (2 x 7)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-1611-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存9,108

16 (2 x 8)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C

XR2A-2411-N

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,068

24 (2 x 12)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Polybutylene Terephthalate (PBT), Glass Filled

-55°C ~ 125°C