頁 709 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  709/950
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PMBF4392,215
NXP

JFET N-CH 40V 250MW SOT23

  • FET Type: N-Channel
  • Voltage - Breakdown (V(BR)GSS): 40V
  • Drain to Source Voltage (Vdss): 40V
  • Current - Drain (Idss) @ Vds (Vgs=0): 25mA @ 20V
  • Current Drain (Id) - Max: -
  • Voltage - Cutoff (VGS off) @ Id: 2V @ 1nA
  • Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
  • Resistance - RDS(On): -
  • Power - Max: 250mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23 (TO-236AB)
封裝: TO-236-3, SC-59, SOT-23-3
庫存5,312
MRF6P24190HR5
NXP

FET RF 68V 2.39GHZ NI-1230

  • Transistor Type: LDMOS
  • Frequency: 2.39GHz
  • Gain: 14dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.9A
  • Power - Output: 40W
  • Voltage - Rated: 68V
  • Package / Case: NI-1230
  • Supplier Device Package: NI-1230
封裝: NI-1230
庫存7,296
PCF2119IU/2DA/2Z
NXP

IC LCD CTLR/DRIVER UNCASED

  • Display Type: LCD
  • Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
  • Interface: I2C, Parallel
  • Digits or Characters: 16 Characters, 32 Characters, 40 Elements
  • Current - Supply: 35µA
  • Voltage - Supply: 1.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
封裝: Die
庫存6,992
N74F1804D,602
NXP

IC GATE NAND 6CH 2-INP 20-SO

  • Logic Type: NAND Gate
  • Number of Circuits: 6
  • Number of Inputs: 2
  • Features: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Max): -
  • Current - Output High, Low: 48mA, 48mA
  • Logic Level - Low: 0.8V
  • Logic Level - High: 2V
  • Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 20-SO
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存2,512
UJA1061TW/3V3/C/T,
NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

  • Applications: Automotive Networking
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 27 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
庫存5,712
TJA1055T,518
NXP

IC CAN TXRX FAULT-TOL 14-SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
封裝: 14-SOIC (0.154", 3.90mm Width)
庫存6,736
TJA1051T/3,118
NXP

IC CAN TRANSEIVER HS 8SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 120mV
  • Data Rate: 5Mbps
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存225,258
P1022PSE2EBA
NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
封裝: 689-BBGA Exposed Pad
庫存3,712
MCIMX6U5DVM10ABR
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
封裝: 624-LFBGA
庫存5,856
hot MCIMX6U7CVM08AC
NXP

IC MPU I.MX6DL 800MHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
封裝: 624-LFBGA
庫存19,860
S9S08AW60E5CFGE
NXP

IC MCU 8BIT 60KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
封裝: 44-LQFP
庫存6,960
MC711E9CFNE2R
NXP

IC MCU 8BIT 12KB OTP 52PLCC

  • Core Processor: HC11
  • Core Size: 8-Bit
  • Speed: 2MHz
  • Connectivity: SCI, SPI
  • Peripherals: POR, WDT
  • Number of I/O: 38
  • Program Memory Size: 12KB (12K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: 512 x 8
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 52-LCC (J-Lead)
  • Supplier Device Package: 52-PLCC (19.1x19.1)
封裝: 52-LCC (J-Lead)
庫存4,112
MCR908JK1ECDWER
NXP

IC MCU 8BIT 1.5KB FLASH 20SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 14
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
  • Data Converters: A/D 12x8b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存4,592
SPC5675KFF0VMS2R
NXP

IC MCU 32BIT 2MB FLASH 473MAPBGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
封裝: 473-LFBGA
庫存2,100
MC9S12DB128CPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封裝: 112-LQFP
庫存4,240
S9S12P96J0CFT
NXP

IC MCU 16BIT 96KB FLASH 48QFN

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CAN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
封裝: 48-VFQFN Exposed Pad
庫存4,944
LPC11A13JHI33/201E
NXP

IC MCU 32BIT 24KB FLASH 33HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 28
  • Program Memory Size: 24KB (24K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
封裝: 32-VFQFN Exposed Pad
庫存5,664
PCK2001MDB,118
NXP

IC CLK BUFFER 1:10 150MHZ 28SSOP

  • Type: Fanout Buffer (Distribution)
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:10
  • Differential - Input:Output: No/No
  • Input: LVTTL
  • Output: LVTTL
  • Frequency - Max: 150MHz
  • Voltage - Supply: 3.135 V ~ 3.465 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 28-SSOP
封裝: 28-SSOP (0.209", 5.30mm Width)
庫存3,632
TEF6894H/V3,557
NXP

IC RADIO SIGNAL PROC 44-QFP

  • Function: Audio Tone Processor
  • Applications: Automotive Audio
  • Number of Channels: 6
  • Interface: I2C
  • Voltage - Supply: 8 V ~ 9 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Specifications: AM, FM
  • Package / Case: 44-QFP
  • Supplier Device Package: 44-PQFP (10x10)
封裝: 44-QFP
庫存7,184
BGA3021Y
NXP

IC MMIC AMP CATV 1.2GHZ 8HSOP

  • Frequency: 40MHz ~ 1.2GHz
  • P1dB: 29dBm
  • Gain: 16dB
  • Noise Figure: 5.5dB
  • RF Type: CATV
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Current - Supply: 350mA
  • Test Frequency: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
  • Supplier Device Package: 8-HSO
封裝: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
庫存3,816
hot MCIMX7D2DVM12SD
NXP

MPU I.MX 7D 1.2GHZ 19X19 MAPBGA

  • Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD, MIPI
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
  • Package / Case: 541-LFBGA
  • Supplier Device Package: 541-MAPBGA (19x19)
封裝: 541-LFBGA
庫存25,788
S912XET256W1VAAR
NXP

16-BIT MCU S12X CORE 256KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
封裝: 80-QFP
庫存5,568
MC35FS6506CAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
SAF4000EL-103Q234K
NXP

IC

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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LS2084ACE7TTB
NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

  • Core Processor: ARM® Cortex®-A72
  • Number of Cores/Bus Width: 8 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR4, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
  • SATA: SATA 6Gbps (2)
  • USB: USB 3.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Secure Boot, TrustZone®
  • Package / Case: 1292-BBGA
  • Supplier Device Package: 1292-BGA (37.5x37.5)
封裝: -
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LPC55S06JBD64E
NXP

IC MCU 32BIT 256KB FLASH 64HTQFP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 96MHz
  • Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 45
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 9x16b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP Exposed Pad
  • Supplier Device Package: 64-HTQFP (10x10)
封裝: -
庫存2,841
SAF4000EL-102Z22AY
NXP

SAF4000EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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MGD3100BM38EKR2
NXP

GATE DRIVERS GATE DRIVER, HV ISO

  • Driven Configuration: Half-Bridge
  • Channel Type: Single
  • Number of Drivers: 1
  • Gate Type: IGBT, N-Channel MOSFET
  • Voltage - Supply: 3.3V
  • Logic Voltage - VIL, VIH: -
  • Current - Peak Output (Source, Sink): 15A, 15A
  • Input Type: -
  • High Side Voltage - Max (Bootstrap): -
  • Rise / Fall Time (Typ): -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
封裝: -
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