頁 712 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PHD22NQ20T,118	NXP	MOSFET N-CH 200V 21.1A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 200V Current - Continuous Drain (Id) @ 25°C: 21.1A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 30.8nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1380pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 150W (Tc) Rds On (Max) @ Id, Vgs: 120 mOhm @ 12A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	封裝: TO-252-3, DPak (2 Leads + Tab), SC-63	庫存7,808
PMEM4020APD,115	NXP	TRANS PNP 40V 0.75A 6TSOP Transistor Type: PNP + Diode (Isolated) Current - Collector (Ic) (Max): 750mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 530mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 500mA, 5V Power - Max: 500mW Frequency - Transition: 150MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP	封裝: SC-74, SOT-457	庫存7,584
BB178,315	NXP	DIODE VHF VAR CAP 32V SOD523 Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz Capacitance Ratio: 15 Capacitance Ratio Condition: C1/C28 Voltage - Peak Reverse (Max): 32V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封裝: SC-79, SOD-523	庫存2,592
TEA1506P/N1,112	NXP	IC CONTROLLER SMPS 8-DIP Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: 650V Topology: Flyback Voltage - Start Up: 11V Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V Duty Cycle: - Frequency - Switching: 25kHz ~ 175kHz Power (Watts): 150W Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit Control Features: - Operating Temperature: -20°C ~ 145°C (TJ) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Mounting Type: Through Hole	封裝: 8-DIP (0.300", 7.62mm)	庫存7,440
N74F158AN,602	NXP	IC DATA SELECTOR/MUX 2IN 16-DIP Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存3,216
74ABT16841ADGG,118	NXP	IC 20BIT BUS INTFC LATCH 56TSSOP Logic Type: D-Type Transparent Latch Circuit: 10:10 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 2 Delay Time - Propagation: 2.2ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	封裝: 56-TFSOP (0.240", 6.10mm Width)	庫存6,848
SAA7377GP/M1,518	NXP	IC DIGITAL PROCESSOR/CD7 64QFP Type: Video Processor Applications: Compact Disc Mounting Type: Surface Mount Package / Case: 64-BQFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-BQFP	庫存5,024
PC33663JEFR2	NXP	LINCELL SO14 Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存7,680
UJA1076ATW/5V0/WDJ	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存6,272
MC7448VS867ND	NXP	IC MPU MPC74XX 867MHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 867MHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	封裝: 360-CLGA, FCCLGA	庫存2,336
KMC7447AHX1420LB	NXP	IC MPU MPC74XX 1.42GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.42GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封裝: 360-BCBGA, FCCBGA	庫存5,888
LPC2919FBD144/01/,	NXP	IC MCU 32BIT 768KB FLASH 144LQFP Core Processor: ARM9? Core Size: 16/32-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, LIN, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 108 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存7,456
MC9S08RD16FJE	NXP	IC MCU 8BIT 16KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存3,872
SVF511R3K2CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,496
SPC5517EAVLU66	NXP	IC MCU 32BIT 1.5MB FLASH 176LQFP Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP	庫存4,944
LPC11U67JBD100E	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存5,184
LPC18S10FBD144E	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 83 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存7,888
MOD5270BXXE	NXP	MOD NETBURNER MOD5270 10 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,440
KMC8144TVT800B	NXP	IC DSP 783FCBGA Type: SC3400 Core Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存7,504
PCF7961XTT/D1AC09J	NXP	IC REMOTE KEYLESS ENTRY 20TSSOP Frequency: - Applications: - Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: - Antenna Connector: - Memory Size: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: -	封裝: -	庫存3,580
TDA8271AHN/C1,557	NXP	IC TUNER DGTL CBL STB 40HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: General Purpose Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: 40-VFQFN Exposed Pad	庫存8,856
SPC5777MK0MVA8R	NXP	NXP 32-BIT MCU QUAD POWER ARCH Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 300MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8.64MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 404K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 512-FBGA Supplier Device Package: 512-TEPBGA (25x25)	封裝: 512-FBGA	庫存7,728
MPC5554MZP112	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	封裝: 416-BBGA	庫存2,768
MC9RS08KA8CTGR	NXP	FINISHED GOOD Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存4,208
MC33FS6526NAE	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 2.7V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
MC56F80746VLF	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: 56800EF Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 14x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote
S32G254ASBK1VUCT	NXP	S32G254A ARM CORTEX-M7 AND -A53, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5Gbps (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: -	Request a Quote
MC33FS6508CAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote

PHD22NQ20T,118

NXP

MOSFET N-CH 200V 21.1A DPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 200V
Current - Continuous Drain (Id) @ 25°C: 21.1A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 30.8nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1380pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 150W (Tc)
Rds On (Max) @ Id, Vgs: 120 mOhm @ 12A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

封裝: TO-252-3, DPak (2 Leads + Tab), SC-63

庫存7,808

PMEM4020APD,115

NXP

TRANS PNP 40V 0.75A 6TSOP

Transistor Type: PNP + Diode (Isolated)
Current - Collector (Ic) (Max): 750mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 530mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 500mA, 5V
Power - Max: 500mW
Frequency - Transition: 150MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP

封裝: SC-74, SOT-457

庫存7,584

BB178,315

NXP

DIODE VHF VAR CAP 32V SOD523

Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio: 15
Capacitance Ratio Condition: C1/C28
Voltage - Peak Reverse (Max): 32V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封裝: SC-79, SOD-523

庫存2,592

TEA1506P/N1,112

NXP

IC CONTROLLER SMPS 8-DIP

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: 650V
Topology: Flyback
Voltage - Start Up: 11V
Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
Duty Cycle: -
Frequency - Switching: 25kHz ~ 175kHz
Power (Watts): 150W
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Control Features: -
Operating Temperature: -20°C ~ 145°C (TJ)
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP
Mounting Type: Through Hole

封裝: 8-DIP (0.300", 7.62mm)

庫存7,440

N74F158AN,602

NXP

IC DATA SELECTOR/MUX 2IN 16-DIP

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存3,216

74ABT16841ADGG,118

NXP

IC 20BIT BUS INTFC LATCH 56TSSOP

Logic Type: D-Type Transparent Latch
Circuit: 10:10
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 2
Delay Time - Propagation: 2.2ns
Current - Output High, Low: 32mA, 64mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

封裝: 56-TFSOP (0.240", 6.10mm Width)

庫存6,848

SAA7377GP/M1,518

NXP

IC DIGITAL PROCESSOR/CD7 64QFP

Type: Video Processor
Applications: Compact Disc
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-BQFP

庫存5,024

PC33663JEFR2

NXP

LINCELL SO14

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存7,680

UJA1076ATW/5V0/WDJ

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存6,272

MC7448VS867ND

NXP

IC MPU MPC74XX 867MHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 867MHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

封裝: 360-CLGA, FCCLGA

庫存2,336

KMC7447AHX1420LB

NXP

IC MPU MPC74XX 1.42GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.42GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

庫存5,888

LPC2919FBD144/01/,

NXP

IC MCU 32BIT 768KB FLASH 144LQFP

Core Processor: ARM9?
Core Size: 16/32-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, LIN, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 108
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存7,456

MC9S08RD16FJE

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存3,872

SVF511R3K2CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,496

SPC5517EAVLU66

NXP

IC MCU 32BIT 1.5MB FLASH 176LQFP

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 137
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

庫存4,944

LPC11U67JBD100E

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 20K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存5,184

LPC18S10FBD144E

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存7,888

MOD5270BXXE

NXP

MOD NETBURNER MOD5270 10 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,440

KMC8144TVT800B

NXP

IC DSP 783FCBGA

Type: SC3400 Core
Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存7,504

PCF7961XTT/D1AC09J

NXP

IC REMOTE KEYLESS ENTRY 20TSSOP

Frequency: -
Applications: -
Modulation or Protocol: -
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: -
Antenna Connector: -
Memory Size: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -

封裝: -

庫存3,580

TDA8271AHN/C1,557

NXP

IC TUNER DGTL CBL STB 40HVQFN

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: General Purpose
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

庫存8,856

SPC5777MK0MVA8R

NXP

NXP 32-BIT MCU QUAD POWER ARCH

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 300MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8.64MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 404K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 512-FBGA
Supplier Device Package: 512-TEPBGA (25x25)

封裝: 512-FBGA

庫存7,728

MPC5554MZP112

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封裝: 416-BBGA

庫存2,768

MC9RS08KA8CTGR

NXP

FINISHED GOOD

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 254 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存4,208

MC33FS6526NAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 2.7V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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MC56F80746VLF

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: 56800EF
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 14x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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S32G254ASBK1VUCT

NXP

S32G254A ARM CORTEX-M7 AND -A53,

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5Gbps (4)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: -

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MC33FS6508CAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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