頁 186 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BF1108R,215	NXP	IC RF SWITCH SOT-143R Transistor Type: N-Channel Frequency: - Gain: - Voltage - Test: - Current Rating: 10mA Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: 3V Package / Case: SOT-143R Supplier Device Package: SOT-143R	封裝: SOT-143R	庫存3,312
PZM27NB,115	NXP	DIODE ZENER 27V 300MW SMT3 Voltage - Zener (Nom) (Vz): 27V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 40 Ohms Current - Reverse Leakage @ Vr: 70nA @ 21V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存3,616
SL2MOS5001EV,118	NXP	IC I-CODE SLI PLLMC Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,760
LD6806F/22P,115	NXP	IC REG LINEAR 2.2V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	封裝: 6-XFDFN	庫存2,960
PCA9625D/S911,518	NXP	IC LED DRIVER LIN DIM 100MA 32SO Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 24V Current - Output / Channel: 100mA Frequency: 100kHz ~ 1MHz Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	封裝: 32-SOIC (0.295", 7.50mm Width)	庫存3,536
N74F166D,623	NXP	IC SHIFT REGISTER 8BIT 16SOIC Logic Type: Register, Bidirectional Output Type: Push-Pull Number of Elements: 1 Number of Bits per Element: 8 Function: Universal Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存7,936
74ABT651D,118	NXP	IC TRANSCVR 3-ST 8BIT INV 24SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存4,272
TJA1055T/1J	NXP	IC TXRX CAN ENH FAULT-TOL 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存26,916
MPC8547VUAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存4,704
MPC859TZP133A	NXP	IC MPU MPC8XX 133MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存3,936
LPC4350FBD208,551	NXP	IC MCU 32BIT ROMLESS 208LQFP Core Processor: ARM? Cortex?-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Number of I/O: 142 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 264K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	封裝: 208-LQFP	庫存2,480
P89LV51RB2BBC,557	NXP	IC MCU 8BIT 16KB FLASH 44TQFP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	封裝: 44-TQFP	庫存6,128
MC68336GMAB20	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 7.5K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	封裝: 160-BQFP	庫存5,264
MC68331CFC16	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	封裝: 132-BQFP Bumpered	庫存9,768
MPC9658AC	NXP	IC PLL CLK GENERATOR 1:10 32LQFP Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer PLL: Yes with Bypass Input: LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: Yes/No Frequency - Max: 250MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存6,816
MMA6280Q	NXP	ACCELEROMETER 1.5-6G ANAL 16QFN Type: Analog Axis: X, Z Acceleration Range: ±1.5g, 2g, 4g, 6g Sensitivity (LSB/g): - Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g) Bandwidth: 350Hz (X), 150Hz (Z) Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封裝: 16-LQFN Exposed Pad	庫存2,052
USB-KW41Z	NXP	USB DONGLE FOR SNIFFER OPERATION Type: Transceiver; Bluetooth? Smart 4.x Low Energy (BLE) Frequency: 2.4GHz For Use With/Related Products: KW41Z Supplied Contents: Board	封裝: -	庫存6,858
S912XEQ384AMALR	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存2,384
FS32K142HAT0VLHT	NXP	S32K142 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存2,016
MC9S08SH16VTJ	NXP	IC MCU 8BIT 16KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存5,456
LPC54016JET180	NXP	IC MCU 32BIT ROMLESS 180TFBGA Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 145 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	封裝: -	Request a Quote
MIMX9332CVVXMAB	NXP	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MIMX8UD5CVP08SA	NXP	8ULP DUAL CORTEX A35 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MC56F83769AMLLA	NXP	IC MCU 32BIT 128MB FLASH 100LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, I2C, SPI, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 82 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	Request a Quote
TJA1051ATK-3-0Z	NXP	IC TRANSCEIVER 1/1 8HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 120 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	封裝: -	Request a Quote
SAF775DEL-N208ZK	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
FS32V232CKN2VUB	NXP	IC MPU FS32V23 1GHZ 621FCPBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE SATA: - USB: - Voltage - I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	封裝: -	Request a Quote
FS32K148UAT0VMHR	NXP	S32K148 32-BIT MCU, ARM CORTEX- Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 156 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: -	Request a Quote

BF1108R,215

NXP

IC RF SWITCH SOT-143R

Transistor Type: N-Channel
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: 10mA
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: 3V
Package / Case: SOT-143R
Supplier Device Package: SOT-143R

封裝: SOT-143R

庫存3,312

PZM27NB,115

NXP

DIODE ZENER 27V 300MW SMT3

Voltage - Zener (Nom) (Vz): 27V
Tolerance: ±5%
Power - Max: 300mW
Impedance (Max) (Zzt): 40 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 21V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存3,616

SL2MOS5001EV,118

NXP

IC I-CODE SLI PLLMC

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,760

LD6806F/22P,115

NXP

IC REG LINEAR 2.2V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

封裝: 6-XFDFN

庫存2,960

PCA9625D/S911,518

NXP

IC LED DRIVER LIN DIM 100MA 32SO

Type: Linear
Topology: -
Internal Switch(s): Yes
Number of Outputs: 16
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: 24V
Current - Output / Channel: 100mA
Frequency: 100kHz ~ 1MHz
Dimming: PWM
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SO

封裝: 32-SOIC (0.295", 7.50mm Width)

庫存3,536

N74F166D,623

NXP

IC SHIFT REGISTER 8BIT 16SOIC

Logic Type: Register, Bidirectional
Output Type: Push-Pull
Number of Elements: 1
Number of Bits per Element: 8
Function: Universal
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存7,936

74ABT651D,118

NXP

IC TRANSCVR 3-ST 8BIT INV 24SOIC

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存4,272

TJA1055T/1J

NXP

IC TXRX CAN ENH FAULT-TOL 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存26,916

MPC8547VUAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存4,704

MPC859TZP133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存3,936

LPC4350FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

Core Processor: ARM? Cortex?-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 264K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

封裝: 208-LQFP

庫存2,480

P89LV51RB2BBC,557

NXP

IC MCU 8BIT 16KB FLASH 44TQFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

庫存6,128

MC68336GMAB20

NXP

IC MCU 32BIT ROMLESS 160QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 7.5K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 160-BQFP
Supplier Device Package: 160-QFP (28x28)

封裝: 160-BQFP

庫存5,264

MC68331CFC16

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

封裝: 132-BQFP Bumpered

庫存9,768

MPC9658AC

NXP

IC PLL CLK GENERATOR 1:10 32LQFP

Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
PLL: Yes with Bypass
Input: LVPECL
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/No
Frequency - Max: 250MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存6,816

MMA6280Q

NXP

ACCELEROMETER 1.5-6G ANAL 16QFN

Type: Analog
Axis: X, Z
Acceleration Range: ±1.5g, 2g, 4g, 6g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
Bandwidth: 350Hz (X), 150Hz (Z)
Output Type: Analog Voltage
Voltage - Supply: 2.2 V ~ 3.6 V
Features: Selectable Scale, Sleep Mode
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封裝: 16-LQFN Exposed Pad

庫存2,052

USB-KW41Z

NXP

USB DONGLE FOR SNIFFER OPERATION

Type: Transceiver; Bluetooth? Smart 4.x Low Energy (BLE)
Frequency: 2.4GHz
For Use With/Related Products: KW41Z
Supplied Contents: Board

封裝: -

庫存6,858

S912XEQ384AMALR

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存2,384

FS32K142HAT0VLHT

NXP

S32K142 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存2,016

MC9S08SH16VTJ

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存5,456

LPC54016JET180

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

封裝: -

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MIMX9332CVVXMAB

NXP

IC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MIMX8UD5CVP08SA

NXP

8ULP DUAL CORTEX A35

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MC56F83769AMLLA

NXP

IC MCU 32BIT 128MB FLASH 100LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CANbus, I2C, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 82
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 20x12b; D/A 2x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

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TJA1051ATK-3-0Z

NXP

IC TRANSCEIVER 1/1 8HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 120 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

封裝: -

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SAF775DEL-N208ZK

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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FS32V232CKN2VUB

NXP

IC MPU FS32V23 1GHZ 621FCPBGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Speed: 1GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet: GbE
SATA: -
USB: -
Voltage - I/O: 1V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

封裝: -

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FS32K148UAT0VMHR

NXP

S32K148 32-BIT MCU, ARM CORTEX-

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 156
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 32x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: -

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