頁 184 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BZX284-B56,115	NXP	DIODE ZENER 56V 400MW SOD2 Voltage - Zener (Nom) (Vz): 56V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 120 Ohms Current - Reverse Leakage @ Vr: 50nA @ 39.2V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封裝: SOD-110	庫存7,936
BAP70AM,135	NXP	DIODE PIN 50V 100MA 6TSSOP Diode Type: PIN - 2 Pair Series Voltage - Peak Reverse (Max): 50V Current - Max: 100mA Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz Power Dissipation (Max): 300mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	封裝: 6-TSSOP, SC-88, SOT-363	庫存2,864
TLVH431CDBZR,215	NXP	IC VREF SHUNT ADJ SOT23-3 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 1.24V Voltage - Output (Max): 18V Current - Output: 70mA Tolerance: ±1.5% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 80µA Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存5,920
PCA9685PW,112	NXP	IC LED DRVR LIN DIM 25MA 28TSSOP Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: - Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	封裝: 28-TSSOP (0.173", 4.40mm Width)	庫存23,064
74ABT899DB,118	NXP	IC 9BIT DUAL LATCH TXRX 28SSOP Logic Type: Parity Generator/Checker Supply Voltage: 4.5 V ~ 5.5 V Number of Bits: 9 Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP	封裝: 28-SSOP (0.209", 5.30mm Width)	庫存5,904
74HCT151N,652	NXP	IC MULTIPLEXER 8-INPUT 16-DIP Type: Multiplexer Circuit: 1 x 8:1 Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存5,168
74HC7731D,112	NXP	IC QUAD 64BIT SHIFT REGIS 16SOIC Logic Type: Register, Multiplexed Output Type: Push-Pull Number of Elements: 4 Number of Bits per Element: 64 Function: Universal Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存6,016
MCIMX6L3DVN10AA	NXP	IC MPU I.MX6SL 1.0GHZ 432MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 432-TFBGA Supplier Device Package: 432-MAPBGA (13x13)	封裝: 432-TFBGA	庫存6,528
MPC8572VTAULE	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	封裝: 1023-BFBGA, FCBGA	庫存3,984
XPC8240RZU250E	NXP	IC MPU MPC82XX 250MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 250MHz Co-Processors/DSP: - RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	封裝: 352-LBGA	庫存6,324
MC68SEC000AA20R2	NXP	IC MPU M680X0 20MHZ 64QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V, 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存2,992
SPC5516SBMLQ66	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: e200z1 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,144
MC908QL4MDW	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存11,364
S912XEQ384F1VAL	NXP	IC MCU 16BIT 384KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存6,320
MC56F84789VLL	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, 16x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存7,312
UDA1361TS/N1,112	NXP	IC ADC STEREO AUDIO 24BIT 16SSOP Type: ADC, Audio Number of Channels: - Resolution (Bits): 24 b Sampling Rate (Per Second): 110k Data Interface: Serial Voltage Supply Source: Analog and Digital Voltage - Supply: 2.4 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-SSOP	封裝: 16-LSSOP (0.173", 4.40mm Width)	庫存13,878
MMA8125EGR2	NXP	ACCEL 250G DSI/SPI 16SOIC Type: Digital Axis: Z Acceleration Range: ±250g Sensitivity (LSB/g): 1 Sensitivity (mV/g): - Bandwidth: - Output Type: DSI, SPI Voltage - Supply: 6.3 V ~ 30 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存2,124
OL2381AHN/C0B,515	NXP	IC RF TXRX ISM<1GHZ 32-VFQFN Type: TxRx Only RF Family/Standard: General ISM < 1GHz Protocol: - Modulation: ASK, FSK, GFSK Frequency: 315MHz, 434MHz, 868MHz, 915MHz Data Rate (Max): 20kbps Power - Output: 11dBm Sensitivity: -118dBm Memory Size: - Serial Interfaces: SPI GPIO: - Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 16.5mA Current - Transmitting: 14mA ~ 22mA Operating Temperature: -25°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	封裝: 32-VFQFN Exposed Pad	庫存236,406
BGU8M1UKAZ	NXP	IC MMIC AMP LNA WLCSP6 Frequency: 1.8GHz ~ 2.2GHz P1dB: - Gain: 17dB Noise Figure: 0.7dB RF Type: Cellular Voltage - Supply: 1.5 V ~ 3.1 V Current - Supply: 5mA Test Frequency: 2.2GHz Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (0.65x0.44)	封裝: 6-XFBGA, WLCSP	庫存3,636
MC9S08AC96CFGER	NXP	S08AC 8-BIT MCU S08 CORE 96KB Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存3,376
FH32K142HFT0MLHT	NXP	S32K142 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LPC5526JEV98K	NXP	IC MCU 32BIT 256KB FLASH 98VFBGA Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 98-VFBGA Supplier Device Package: 98-VFBGA (7x7)	封裝: -	庫存2,958
MPF5024CMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: -	Request a Quote
MC35FS6516CAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 2.7V ~ 40V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
SAF7730HV-N317D-S1	NXP	SAF7730HV/N317D/S1 Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
PCA85073ADP-Q900Z	NXP	IC RTC CLK/CALENDAR I2C 8TSSOP Type: Clock/Calendar Features: Alarm Memory Size: - Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Interface: I2C Voltage - Supply: 1.8V ~ 5.5V Voltage - Supply, Battery: - Current - Timekeeping (Max): - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	封裝: -	庫存14,481
MC35FS4508CAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
MGD3162AM551EKR2	NXP	IC Driven Configuration: - Channel Type: - Number of Drivers: - Gate Type: - Voltage - Supply: - Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): - Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

BZX284-B56,115

NXP

DIODE ZENER 56V 400MW SOD2

Voltage - Zener (Nom) (Vz): 56V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 120 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 39.2V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封裝: SOD-110

庫存7,936

BAP70AM,135

NXP

DIODE PIN 50V 100MA 6TSSOP

Diode Type: PIN - 2 Pair Series
Voltage - Peak Reverse (Max): 50V
Current - Max: 100mA
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz
Power Dissipation (Max): 300mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

庫存2,864

TLVH431CDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 18V
Current - Output: 70mA
Tolerance: ±1.5%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 80µA
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存5,920

PCA9685PW,112

NXP

IC LED DRVR LIN DIM 25MA 28TSSOP

Type: Linear
Topology: -
Internal Switch(s): Yes
Number of Outputs: 16
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: 5.5V
Current - Output / Channel: 25mA
Frequency: -
Dimming: PWM
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

封裝: 28-TSSOP (0.173", 4.40mm Width)

庫存23,064

74ABT899DB,118

NXP

IC 9BIT DUAL LATCH TXRX 28SSOP

Logic Type: Parity Generator/Checker
Supply Voltage: 4.5 V ~ 5.5 V
Number of Bits: 9
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP

封裝: 28-SSOP (0.209", 5.30mm Width)

庫存5,904

74HCT151N,652

NXP

IC MULTIPLEXER 8-INPUT 16-DIP

Type: Multiplexer
Circuit: 1 x 8:1
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存5,168

74HC7731D,112

NXP

IC QUAD 64BIT SHIFT REGIS 16SOIC

Logic Type: Register, Multiplexed
Output Type: Push-Pull
Number of Elements: 4
Number of Bits per Element: 64
Function: Universal
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存6,016

MCIMX6L3DVN10AA

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (3)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 432-TFBGA
Supplier Device Package: 432-MAPBGA (13x13)

封裝: 432-TFBGA

庫存6,528

MPC8572VTAULE

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

封裝: 1023-BFBGA, FCBGA

庫存3,984

XPC8240RZU250E

NXP

IC MPU MPC82XX 250MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 250MHz
Co-Processors/DSP: -
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

封裝: 352-LBGA

庫存6,324

MC68SEC000AA20R2

NXP

IC MPU M680X0 20MHZ 64QFP

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 20MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V, 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存2,992

SPC5516SBMLQ66

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: e200z1
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,144

MC908QL4MDW

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存11,364

S912XEQ384F1VAL

NXP

IC MCU 16BIT 384KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存6,320

MC56F84789VLL

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x12b, 16x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存7,312

UDA1361TS/N1,112

NXP

IC ADC STEREO AUDIO 24BIT 16SSOP

Type: ADC, Audio
Number of Channels: -
Resolution (Bits): 24 b
Sampling Rate (Per Second): 110k
Data Interface: Serial
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.4 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-SSOP

封裝: 16-LSSOP (0.173", 4.40mm Width)

庫存13,878

MMA8125EGR2

NXP

ACCEL 250G DSI/SPI 16SOIC

Type: Digital
Axis: Z
Acceleration Range: ±250g
Sensitivity (LSB/g): 1
Sensitivity (mV/g): -
Bandwidth: -
Output Type: DSI, SPI
Voltage - Supply: 6.3 V ~ 30 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存2,124

OL2381AHN/C0B,515

NXP

IC RF TXRX ISM<1GHZ 32-VFQFN

Type: TxRx Only
RF Family/Standard: General ISM < 1GHz
Protocol: -
Modulation: ASK, FSK, GFSK
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Data Rate (Max): 20kbps
Power - Output: 11dBm
Sensitivity: -118dBm
Memory Size: -
Serial Interfaces: SPI
GPIO: -
Voltage - Supply: 2.1 V ~ 3.6 V
Current - Receiving: 16.5mA
Current - Transmitting: 14mA ~ 22mA
Operating Temperature: -25°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

封裝: 32-VFQFN Exposed Pad

庫存236,406

BGU8M1UKAZ

NXP

IC MMIC AMP LNA WLCSP6

Frequency: 1.8GHz ~ 2.2GHz
P1dB: -
Gain: 17dB
Noise Figure: 0.7dB
RF Type: Cellular
Voltage - Supply: 1.5 V ~ 3.1 V
Current - Supply: 5mA
Test Frequency: 2.2GHz
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (0.65x0.44)

封裝: 6-XFBGA, WLCSP

庫存3,636

MC9S08AC96CFGER

NXP

S08AC 8-BIT MCU S08 CORE 96KB

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存3,376

FH32K142HFT0MLHT

NXP

S32K142 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LPC5526JEV98K

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封裝: -

庫存2,958

MPF5024CMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: -

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MC35FS6516CAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 2.7V ~ 40V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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SAF7730HV-N317D-S1

NXP

SAF7730HV/N317D/S1

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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PCA85073ADP-Q900Z

NXP

IC RTC CLK/CALENDAR I2C 8TSSOP

Type: Clock/Calendar
Features: Alarm
Memory Size: -
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Interface: I2C
Voltage - Supply: 1.8V ~ 5.5V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

封裝: -

庫存14,481

MC35FS4508CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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MGD3162AM551EKR2

NXP

IC

Driven Configuration: -
Channel Type: -
Number of Drivers: -
Gate Type: -
Voltage - Supply: -
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): -
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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