頁 17 - NXP 產品 - PMIC - 電源管理 - 專用 | 黑森爾電子
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NXP 產品 - PMIC - 電源管理 - 專用

記錄 1,370
頁  17/49
圖片
零件編號
製造商
描述
封裝
庫存
數量
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MPF5024CMMA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 4

  • Applications: High Performance i.MX 8 Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MPF5024AMBA0ES
NXP

POWER MANAGEMENT IC, PRE-PROG, 4

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
庫存1,470
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MWSP10C1AVLCR
NXP

AUTOQI WIRELESS CHARGING

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MFS8416AMBP5ES
NXP

SAFETY POWER MANAGEMENT IC, QFN4

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MVR5510AVMANEPR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6527LAER2
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS2600AMDA0ADR2
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
封裝: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33FS8530A4KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8530A0ES
NXP

SYSTEM BASIS CHIP FS8500

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
庫存780
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8530A0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8530A1ES
NXP

SYSTEM BASIS CHIP FS8500

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
庫存1,560
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8530A1KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS2600AMDA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
封裝: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33FS8530A4ES
NXP

SYSTEM BASIS CHIP FS8530

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MPF5020AVNA0ES
NXP

PF5020

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MC33FS6506CAER2
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MPF7100BMBA0ESR2
NXP

POWER MANAGEMENT IC, I.MX 8, I.M

  • Applications: i.MX Processors
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MWCT1015SFVLLPR
NXP

WCT1015,NO CSEC/CAN-FD

  • Applications: Wireless Power Transmitter
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: -
Request a Quote
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
100-LQFP
100-LQFP (14x14)
MPF5030BMMA0ES
NXP

PMIC 3 BUCKS 2 LDO A1 DIE

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MC33FS6506NAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS2613AMDA0ADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
封裝: -
Request a Quote
-
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MFS2601AMDA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
封裝: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33FS5502Y3KSR2
NXP

HIGH VOLTAGE POWER MANAGEMENT IC

  • Applications: SMPS Start-Up
  • Current - Supply: -
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
-
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MPF5030BMMA4ES
NXP

PMIC 3 BUCKS 2 LDO A1 DIE

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
庫存1,470
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MFS8416AMBP5ESR2
NXP

SAFETY POWER MANAGEMENT IC, QFN4

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MWCT2016SGVPAR
NXP

MWCT2016S,MAXQFP100

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MVR5510AMMAHESR2
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS2303BMBA0EPR2
NXP

IC

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
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