頁 14 - NXP 產品 - PMIC - 電源管理 - 專用 | 黑森爾電子
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NXP 產品 - PMIC - 電源管理 - 專用

記錄 1,370
頁  14/49
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零件編號
製造商
描述
封裝
庫存
數量
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS8435G0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8435G0ES
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC35FS6517NAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
PCA9420KUKZ
NXP

IC

  • Applications: Microcontroller, MCU
  • Current - Supply: 4.5µA
  • Voltage - Supply: 3.3V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 25-UFBGA, WLCSP
  • Supplier Device Package: 25-WLCSP (2.09x2.09)
封裝: -
Request a Quote
4.5µA
3.3V ~ 5.5V
-40°C ~ 85°C (TA)
Surface Mount
25-UFBGA, WLCSP
25-WLCSP (2.09x2.09)
MVR5510AVMAHEP
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MVR5510AVMANEP
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MVR5510AVMALEP
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC35FS6517CAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MVR5510AVMA0EP
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS8633BMDA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
-
36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MC35FS6518CAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MPF5030BMDA0ESR2
NXP

POWER MANAGEMENT IC, S32, NON-PR

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MVR5510AVMA4EP
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MPF5200AMMG0ES
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: -
  • Current - Supply: 40µA
  • Voltage - Supply: 2.7V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-PowerWFQFN
  • Supplier Device Package: 32-HWQFN (5x5)
封裝: -
Request a Quote
40µA
2.7V ~ 5.5V
-40°C ~ 125°C
Surface Mount, Wettable Flank
32-PowerWFQFN
32-HWQFN (5x5)
MPF5200AMBA2ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-PowerWFQFN
  • Supplier Device Package: 32-HWQFN (5x5)
封裝: -
Request a Quote
-
-
-
Surface Mount, Wettable Flank
32-PowerWFQFN
32-HWQFN (5x5)
MWCT2014SHVPAR
NXP

MAXQFP100,512KB

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MPF5032BMMA5ES
NXP

PMIC 2 BUCKS 2 LDO A1 DIE

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
庫存1,470
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MVR5510AVMA6EP
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MPF5032BMMA0ES
NXP

PMIC 2 BUCKS 2 LDO A1 DIE

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MVR5510AMBA4ESR2
NXP

IC PMIC VR5510 ASIL-B

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS8612BMBA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
-
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MC33FS8430G4ESR2
NXP

SYSTEM BASIS CHIP FS8430

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MPF7100BMMA0ESR2
NXP

POWER MANAGEMENT IC, I.MX 8, I.M

  • Applications: i.MX Processors
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MVR5510AVMALEPR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MWCT2D16SHT1VPB
NXP

MWCT2D16S, MAXQFP172

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
-
-
MC35FS6506CAER2
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33PF8100ERESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100F3ESR2
NXP

POWER MANAGEMENT IC, I.MX8, PRE-

  • Applications: Processor
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)