頁 62 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  62/351
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10AS032E4F27E3SG
Intel

672-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存6,304
10AX048E2F29I1SG
Intel

IC FPGA 360 I/O 780FBGA

  • Number of LABs/CLBs: 183590
  • Number of Logic Elements/Cells: 480000
  • Total RAM Bits: 5664768
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存6,976
5SGXMBBR2H43I2LN
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
封裝: 1760-BBGA, FCBGA
庫存2,720
5SGXEA9N3F45I3N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存6,112
5SGXEA5N2F45I2L
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存3,456
EP4SE530F43C4
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存5,008
5SGSMD3E3H29C2N
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 16937984
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封裝: 780-BBGA, FCBGA
庫存4,944
10AX032H2F35I2LG
Intel

1152-PIN FBGA

  • Number of LABs/CLBs: 119900
  • Number of Logic Elements/Cells: 320000
  • Total RAM Bits: 21040128
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,080
10AX027E1F27E1HG
Intel

IC FPGA 240 I/O 672FBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存6,928
10AX027E3F27E2LG
Intel

672-PIN FBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA, FC (27x27)
封裝: 672-BBGA, FCBGA
庫存5,040
hot EP4CGX50CF23C8N
Intel

IC FPGA 290 I/O 484FBGA

  • Number of LABs/CLBs: 3118
  • Number of Logic Elements/Cells: 49888
  • Total RAM Bits: 2562048
  • Number of I/O: 290
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存4,464
5CEFA7F31C8N
Intel

IC FPGA 480 I/O 896FBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FBGA (31x31)
封裝: 896-BGA
庫存5,264
hot EP1C12F256C8
Intel

IC FPGA 185 I/O 256FBGA

  • Number of LABs/CLBs: 1206
  • Number of Logic Elements/Cells: 12060
  • Total RAM Bits: 239616
  • Number of I/O: 185
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存10,884
EPM7032QC44-6
Intel

IC CPLD 32MC 6NS 44PLCC

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 600
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存3,520
hot EPM7128BTC144-10
Intel

IC CPLD 128MC 10NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 100
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存6,336
EPM7128STC100-6F
Intel

IC CPLD 128MC 6NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: 100-TQFP
庫存3,488
hot EPM570F100C5N
Intel

IC CPLD 440MC 5.4NS 100FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 76
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-FBGA (11x11)
封裝: 100-LBGA
庫存19,008
AGFA012R24B2E3E
Intel

IC FPGA AGILEX-F 2486FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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5AGZME5H2F35I3LG
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 18870
  • Number of Logic Elements/Cells: 400000
  • Total RAM Bits: 34322432
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
5AGXMB5G4F40C4G
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 158491
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA, FC (40x40)
封裝: -
Request a Quote
EPM240T100I5NGA
Intel

IC CPLD 192MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 240
  • Number of Macrocells: 192
  • Number of Gates: -
  • Number of I/O: 80
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: -
Request a Quote
5SGXEA7K3F35C2G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
FWIXP422ABB
Intel

IC MPU INTEL 266MHZ PBGA492

  • Core Processor: Intel® IXP42X
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100Mbps (2)
  • SATA: -
  • USB: USB 1.1 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: 3DES, AES, DES, MD5, SHA-1
  • Package / Case: 492-BBGA
  • Supplier Device Package: 492-PBGA (35x35)
封裝: -
Request a Quote
1SX280HH1F55I2VG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封裝: -
Request a Quote
1SG166HN3F43E1VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 207500
  • Number of Logic Elements/Cells: 1660000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
AGFA014R24C2E4F
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5AGZME7H3F35C4G
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 21225
  • Number of Logic Elements/Cells: 450000
  • Total RAM Bits: 40249344
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
1SX040HH3F35I1VG
Intel

IC FPGA STRATIX10SX 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 400K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote