頁 347 - Intel 產品 | 黑森爾電子
聯繫我們
SalesDept@heisener.com +86-755-83210559 ext. 803
登入/註冊
Language Translation

* Please refer to the English Version as our Official Version.

BOM
購物車 0

Intel 產品

記錄 9,824
頁  347/351
圖片
零件編號
製造商
描述
封裝
庫存
數量
HC1S80F1020AS
Intel

IC FPGA APEX 1020FBGA

  • Number of LABs/CLBs: 7904
  • Number of Logic Elements/Cells: 79040
  • Total RAM Bits: 5658048
  • Number of I/O: 782
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封裝: 1020-BBGA
庫存6,752
10AX032E1F27E1SG
Intel

IC FPGA 240 I/O 672FBGA

  • Number of LABs/CLBs: 119900
  • Number of Logic Elements/Cells: 320000
  • Total RAM Bits: 21040128
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存4,784
EP20K300ERC208-1X
Intel

IC FPGA

  • Number of LABs/CLBs: 1152
  • Number of Logic Elements/Cells: 11520
  • Total RAM Bits: 147456
  • Number of I/O: -
  • Number of Gates: 728000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BQFP
  • Supplier Device Package: 208-RQFP (28x28)
封裝: 208-BQFP
庫存4,928
EP20K300EQC240-2X
Intel

IC FPGA 152 I/O 240QFP

  • Number of LABs/CLBs: 1152
  • Number of Logic Elements/Cells: 11520
  • Total RAM Bits: 147456
  • Number of I/O: 152
  • Number of Gates: 728000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存5,840
EP1S20F672C7
Intel

IC FPGA 426 I/O 672FBGA

  • Number of LABs/CLBs: 1846
  • Number of Logic Elements/Cells: 18460
  • Total RAM Bits: 1669248
  • Number of I/O: 426
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA
庫存4,464
5SEEBH40I2N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359250
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封裝: 1517-BBGA, FCBGA
庫存7,392
EP4SE530F43C2
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存5,248
hot EP3SL70F780C3N
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 2700
  • Number of Logic Elements/Cells: 67500
  • Total RAM Bits: 2699264
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存5,040
5CGXFC9A6U19I7
Intel

IC FPGA 240 I/O 484UBGA

  • Number of LABs/CLBs: 113560
  • Number of Logic Elements/Cells: 301000
  • Total RAM Bits: 14251008
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
封裝: 484-FBGA
庫存2,592
5AGXBA5D4F27C5N
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 8962
  • Number of Logic Elements/Cells: 190000
  • Total RAM Bits: 13284352
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存2,496
5CGXBC5C6F27C7N
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 29080
  • Number of Logic Elements/Cells: 77000
  • Total RAM Bits: 5001216
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BGA
庫存5,152
10CX105YU484E6G
Intel

484-PIN UBGA

  • Number of LABs/CLBs: 38000
  • Number of Logic Elements/Cells: 104000
  • Total RAM Bits: 8641536
  • Number of I/O: 188
  • Number of Gates: -
  • Voltage - Supply: 0.9V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-UBGA (19x19)
封裝: 484-BFBGA, FCBGA
庫存2,544
EP4CE10F17A7N
Intel

IC FPGA 179 I/O 256FBGA

  • Number of LABs/CLBs: 645
  • Number of Logic Elements/Cells: 10320
  • Total RAM Bits: 423936
  • Number of I/O: 179
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存5,296
10M08SAU169I7G
Intel

IC FPGA 130 I/O 169UBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 130
  • Number of Gates: -
  • Voltage - Supply: 2.85 V ~ 3.465 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 169-LFBGA
  • Supplier Device Package: 169-UBGA (11x11)
封裝: 169-LFBGA
庫存17,868
EPM7KAEFC256AB
Intel

IC CPLE 256FBGA

  • Programmable Type: -
  • Delay Time tpd(1) Max: -
  • Voltage Supply - Internal: -
  • Number of Logic Elements/Blocks: -
  • Number of Macrocells: -
  • Number of Gates: -
  • Number of I/O: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,152
hot EPM7128EQC100-10
Intel

IC CPLD 128MC 10NS 100QFP

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (20x14)
封裝: 100-BQFP
庫存6,192
AGFB027R24C2E3E
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
1SG280HN3F43E2LG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
EP4SGX360FF35I3G
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
10M08DAF256A7G
Intel

IC FPGA 178 I/O 256FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 178
  • Number of Gates: -
  • Voltage - Supply: 1.15V ~ 1.25V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: -
庫存810
AGFB014R24C3I3E
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
1SX085HN1F43E1VG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 850K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
1ST040EH3F35I3XG
Intel

IC FPGA STRATIX10TX 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 378000
  • Total RAM Bits: 31457280
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
EP2C8AF256I8NES
Intel

IC FPGA 182 I/O 256FBGA

  • Number of LABs/CLBs: 516
  • Number of Logic Elements/Cells: 8256
  • Total RAM Bits: 165888
  • Number of I/O: 182
  • Number of Gates: -
  • Voltage - Supply: 1.15V ~ 1.25V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: -
Request a Quote
5SGXMA5H3F35C4WN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
EP4SGX230DF29C2XG
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
KU82303-20
Intel

IC I/O CHIP 100QFP

  • Type: I/O Chip
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 100-QFP
  • Supplier Device Package: 100-PQFP
封裝: -
Request a Quote
AGFB014R24B2E3E
Intel

IC FPGA AGILEX-F 2486FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote