頁 335 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
5ASXFB3G4F35I5N	Intel	IC FPGA 350 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存7,744
10AS032E2F27I2LG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存4,416
EN2362QI	Intel	IC REG BUCK ADJ 6A SYNC 68QFN Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Adjustable Number of Outputs: 1 Voltage - Input (Min): 4.5V Voltage - Input (Max): 14V Voltage - Output (Min/Fixed): 0.75V Voltage - Output (Max): 5V Current - Output: 6A Frequency - Switching: - Synchronous Rectifier: Yes Operating Temperature: - Mounting Type: Surface Mount Package / Case: 68-PowerBFQFN Supplier Device Package: 68-QFN (8x11)	封裝: 68-PowerBFQFN	庫存3,152
EP1C6F256C6NGA	Intel	IC FPGA FBGA Number of LABs/CLBs: 598 Number of Logic Elements/Cells: 5980 Total RAM Bits: 92160 Number of I/O: 185 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存2,528
EPF10K30ETI144-3	Intel	IC FPGA Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 102 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存4,992
EPF10K200SFI672-2	Intel	IC FPGA 470 I/O 672FBGA Number of LABs/CLBs: 1248 Number of Logic Elements/Cells: 9984 Total RAM Bits: 98304 Number of I/O: 470 Number of Gates: 513000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA	庫存2,400
EPF6016AQC208-2N	Intel	IC FPGA 171 I/O 208QFP Number of LABs/CLBs: 132 Number of Logic Elements/Cells: 1320 Total RAM Bits: - Number of I/O: 171 Number of Gates: 16000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存5,184
EPF10K130EFC484-2X	Intel	IC FPGA 369 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 6656 Total RAM Bits: 65536 Number of I/O: 369 Number of Gates: 342000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存2,880
EP4S100G3F45I2	Intel	IC FPGA 781 I/O 1932FBGA Number of LABs/CLBs: 11648 Number of Logic Elements/Cells: 291200 Total RAM Bits: 17661952 Number of I/O: 781 Number of Gates: - Voltage - Supply: 0.92 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存6,080
5SEE9H40I2LN	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封裝: 1517-BBGA, FCBGA	庫存7,584
5SGSMD4K2F40I2L	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 23946240 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,072
10AX090N2F45E2SG	Intel	IC FPGA 768 I/O 1932FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 768 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存4,880
EP3SE80F1152I4	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 3200 Number of Logic Elements/Cells: 80000 Total RAM Bits: 6843392 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,064
5CGXFC9E7F35C8N	Intel	IC FPGA 560 I/O 1152FBGA Number of LABs/CLBs: 113560 Number of Logic Elements/Cells: 301000 Total RAM Bits: 14251008 Number of I/O: 560 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BGA	庫存6,592
EP3C55F780I7	Intel	IC FPGA 377 I/O 780FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 377 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BGA	庫存7,760
EP4CGX30CF23C8N	Intel	IC FPGA 290 I/O 484FBGA Number of LABs/CLBs: 1840 Number of Logic Elements/Cells: 29440 Total RAM Bits: 1105920 Number of I/O: 290 Number of Gates: - Voltage - Supply: 1.16 V ~ 1.24 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存7,260
EP4CE15E22C9L	Intel	IC FPGA 81 I/O 144EQFP Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 81 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存7,456
EPM7064SLC84-10N	Intel	IC CPLD 64MC 10NS 84PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存4,784
5SGSMD3H3F35I3G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
AGIB022R29A1I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote
AGIC035R39A1I1VB	Intel	IC FPGA AGILEX-I 3948FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 3.54M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封裝: -	Request a Quote
5SGXMB6R3F43C2LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: -	Request a Quote
AGIC040R39A2I2VB	Intel	IC FPGA AGILEX-I 3948FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4.047M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封裝: -	Request a Quote
AGIC035R39A1E1V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 3.54M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封裝: -	Request a Quote
5SGXMA3E3H29I4G	Intel	IC FPGA 600 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: -	Request a Quote
EPM2210F256C5NGA	Intel	IC CPLD 1700MC 11.2NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 11.2 ns Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 2210 Number of Macrocells: 1700 Number of Gates: - Number of I/O: 204 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: -	Request a Quote
KU82303-25	Intel	IC I/O CHIP 100QFP Type: I/O Chip Applications: - Mounting Type: Surface Mount Package / Case: 100-QFP Supplier Device Package: 100-PQFP	封裝: -	Request a Quote
5SGXEA7N3F45I4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote

5ASXFB3G4F35I5N

Intel

IC FPGA 350 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存7,744

10AS032E2F27I2LG

Intel

672-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,416

EN2362QI

Intel

IC REG BUCK ADJ 6A SYNC 68QFN

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Adjustable
Number of Outputs: 1
Voltage - Input (Min): 4.5V
Voltage - Input (Max): 14V
Voltage - Output (Min/Fixed): 0.75V
Voltage - Output (Max): 5V
Current - Output: 6A
Frequency - Switching: -
Synchronous Rectifier: Yes
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 68-PowerBFQFN
Supplier Device Package: 68-QFN (8x11)

封裝: 68-PowerBFQFN

庫存3,152

EP1C6F256C6NGA

Intel

IC FPGA FBGA

Number of LABs/CLBs: 598
Number of Logic Elements/Cells: 5980
Total RAM Bits: 92160
Number of I/O: 185
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存2,528

EPF10K30ETI144-3

Intel

IC FPGA

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 102
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存4,992

EPF10K200SFI672-2

Intel

IC FPGA 470 I/O 672FBGA

Number of LABs/CLBs: 1248
Number of Logic Elements/Cells: 9984
Total RAM Bits: 98304
Number of I/O: 470
Number of Gates: 513000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA

庫存2,400

EPF6016AQC208-2N

Intel

IC FPGA 171 I/O 208QFP

Number of LABs/CLBs: 132
Number of Logic Elements/Cells: 1320
Total RAM Bits: -
Number of I/O: 171
Number of Gates: 16000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存5,184

EPF10K130EFC484-2X

Intel

IC FPGA 369 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 6656
Total RAM Bits: 65536
Number of I/O: 369
Number of Gates: 342000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存2,880

EP4S100G3F45I2

Intel

IC FPGA 781 I/O 1932FBGA

Number of LABs/CLBs: 11648
Number of Logic Elements/Cells: 291200
Total RAM Bits: 17661952
Number of I/O: 781
Number of Gates: -
Voltage - Supply: 0.92 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存6,080

5SEE9H40I2LN

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 64210944
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封裝: 1517-BBGA, FCBGA

庫存7,584

5SGSMD4K2F40I2L

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 23946240
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,072

10AX090N2F45E2SG

Intel

IC FPGA 768 I/O 1932FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 768
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存4,880

EP3SE80F1152I4

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 3200
Number of Logic Elements/Cells: 80000
Total RAM Bits: 6843392
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,064

5CGXFC9E7F35C8N

Intel

IC FPGA 560 I/O 1152FBGA

Number of LABs/CLBs: 113560
Number of Logic Elements/Cells: 301000
Total RAM Bits: 14251008
Number of I/O: 560
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BGA

庫存6,592

EP3C55F780I7

Intel

IC FPGA 377 I/O 780FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 377
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

庫存7,760

EP4CGX30CF23C8N

Intel

IC FPGA 290 I/O 484FBGA

Number of LABs/CLBs: 1840
Number of Logic Elements/Cells: 29440
Total RAM Bits: 1105920
Number of I/O: 290
Number of Gates: -
Voltage - Supply: 1.16 V ~ 1.24 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存7,260

EP4CE15E22C9L

Intel

IC FPGA 81 I/O 144EQFP

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 81
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存7,456

EPM7064SLC84-10N

Intel

IC CPLD 64MC 10NS 84PLCC

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存4,784

5SGSMD3H3F35I3G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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AGIB022R29A1I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

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AGIC035R39A1I1VB

Intel

IC FPGA AGILEX-I 3948FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 3.54M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封裝: -

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5SGXMB6R3F43C2LG

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: -

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AGIC040R39A2I2VB

Intel

IC FPGA AGILEX-I 3948FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4.047M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封裝: -

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AGIC035R39A1E1V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 3.54M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封裝: -

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5SGXMA3E3H29I4G

Intel

IC FPGA 600 I/O 780HBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: -

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EPM2210F256C5NGA

Intel

IC CPLD 1700MC 11.2NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 11.2 ns
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 2210
Number of Macrocells: 1700
Number of Gates: -
Number of I/O: 204
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: -

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KU82303-25

Intel

IC I/O CHIP 100QFP

Type: I/O Chip
Applications: -
Mounting Type: Surface Mount
Package / Case: 100-QFP
Supplier Device Package: 100-PQFP

封裝: -

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5SGXEA7N3F45I4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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