頁 310 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
GT28F320C3BA110	Intel	IC FLASH 32MBIT 110NS 48UBGA Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - Boot Block Memory Size: 32Mb (2M x 16) Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: 110ns Access Time: 110ns Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFBGA Supplier Device Package: 48-µBGA CSP	封裝: 48-VFBGA	庫存39,936
1SX250LN3F43I2LG	Intel	1760-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,768
10AS057N3F40E2SG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,592
EPXA1F484C2	Intel	IC EXCALIBUR ARM 484FBGA Core Type: 32-Bit ARM9 Speed: 200MHz Interface: EBI/EMI, UART/USART Program SRAM Bytes: 32K FPGA SRAM: - EEPROM Size: - Data SRAM Bytes: 16K FPGA Core Cells: 4160 FPGA Gates: 100K FPGA Registers: - Voltage - Supply: 1.8V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存7,712
HC20K600BC652	Intel	IC FPGA APEX 652BGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 24320 Total RAM Bits: 311296 Number of I/O: - Number of Gates: 600000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: - Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存3,008
EP20K600EFC784-2	Intel	IC FPGA Number of LABs/CLBs: 2432 Number of Logic Elements/Cells: 24320 Total RAM Bits: 311296 Number of I/O: - Number of Gates: 1537000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存2,944
10M08DAF484C7G	Intel	IC FPGA 250 I/O 484FBGA Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 250 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存3,136
EPF8636ALC84-3	Intel	IC FPGA 68 I/O 84PLCC Number of LABs/CLBs: 63 Number of Logic Elements/Cells: 504 Total RAM Bits: - Number of I/O: 68 Number of Gates: 6000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.21x29.21)	封裝: 84-LCC (J-Lead)	庫存5,344
EPF10K30EFC484-2	Intel	IC FPGA 220 I/O 484FBGA Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 220 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,624
EP20K1000EBC652-2	Intel	IC FPGA 488 I/O 652BGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: 488 Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BBGA Supplier Device Package: 652-BGA (45x45)	封裝: 652-BBGA	庫存5,248
EPF10K50VBI356-4N	Intel	IC FPGA 274 I/O 356BGA Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 20480 Number of I/O: 274 Number of Gates: 116000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	封裝: 356-LBGA	庫存7,232
EP1S40F1020C7N	Intel	IC FPGA 773 I/O 1020FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 3423744 Number of I/O: 773 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存6,176
EP1K30FC256-1	Intel	IC FPGA 171 I/O 256FBGA Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 171 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BBGA	庫存4,528
5SGSMD5H3F35I3L	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 46769152 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,112
5SGXEA5N3F45C2N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存6,592
5AGZME5K2F40C3N	Intel	IC FPGA 674 I/O 1517FBGA Number of LABs/CLBs: 18870 Number of Logic Elements/Cells: 400000 Total RAM Bits: 34322432 Number of I/O: 674 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,808
5SGXMA7K2F40C1N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,392
5AGXFB5H4F35I5N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 19811 Number of Logic Elements/Cells: 420000 Total RAM Bits: 23625728 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA Exposed Pad	庫存3,824
5AGXBA7D4F35I5N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA Exposed Pad	庫存5,856
EP3C55F484C7N	Intel	IC FPGA 327 I/O 484FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 327 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存4,720
EP4CE15E22C9LN	Intel	IC FPGA 81 I/O 144EQFP Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 81 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存7,408
EPM7160STC100-7N	Intel	IC CPLD 160MC 7.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 10 Number of Macrocells: 160 Number of Gates: 3200 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存5,984
EPM9560RC240-15	Intel	IC CPLD 560MC 15NS 240RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 35 Number of Macrocells: 560 Number of Gates: 12000 Number of I/O: 191 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-RQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存13,128
5AGXBA5D4F35I5G	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存6,064
5SGXMB5R3F43I3LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: -	Request a Quote
AGIB022R31B2I1V	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGID023R18A2E2VB	Intel	IC FPGA AGILEX-I 1805BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1805-BBGA Exposed Pad Supplier Device Package: 1805-BGA (42.5x42.5)	封裝: -	Request a Quote
5SGXMB9R2H43I2G	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封裝: -	Request a Quote

GT28F320C3BA110

Intel

IC FLASH 32MBIT 110NS 48UBGA

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 32Mb (2M x 16)
Memory Interface: Parallel
Clock Frequency: -
Write Cycle Time - Word, Page: 110ns
Access Time: 110ns
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFBGA
Supplier Device Package: 48-µBGA CSP

封裝: 48-VFBGA

庫存39,936

1SX250LN3F43I2LG

Intel

1760-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,768

10AS057N3F40E2SG

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,592

EPXA1F484C2

Intel

IC EXCALIBUR ARM 484FBGA

Core Type: 32-Bit ARM9
Speed: 200MHz
Interface: EBI/EMI, UART/USART
Program SRAM Bytes: 32K
FPGA SRAM: -
EEPROM Size: -
Data SRAM Bytes: 16K
FPGA Core Cells: 4160
FPGA Gates: 100K
FPGA Registers: -
Voltage - Supply: 1.8V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存7,712

HC20K600BC652

Intel

IC FPGA APEX 652BGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 24320
Total RAM Bits: 311296
Number of I/O: -
Number of Gates: 600000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: -
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,008

EP20K600EFC784-2

Intel

IC FPGA

Number of LABs/CLBs: 2432
Number of Logic Elements/Cells: 24320
Total RAM Bits: 311296
Number of I/O: -
Number of Gates: 1537000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,944

10M08DAF484C7G

Intel

IC FPGA 250 I/O 484FBGA

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存3,136

EPF8636ALC84-3

Intel

IC FPGA 68 I/O 84PLCC

Number of LABs/CLBs: 63
Number of Logic Elements/Cells: 504
Total RAM Bits: -
Number of I/O: 68
Number of Gates: 6000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.21x29.21)

封裝: 84-LCC (J-Lead)

庫存5,344

EPF10K30EFC484-2

Intel

IC FPGA 220 I/O 484FBGA

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 220
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,624

EP20K1000EBC652-2

Intel

IC FPGA 488 I/O 652BGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: 488
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 652-BBGA
Supplier Device Package: 652-BGA (45x45)

封裝: 652-BBGA

庫存5,248

EPF10K50VBI356-4N

Intel

IC FPGA 274 I/O 356BGA

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 20480
Number of I/O: 274
Number of Gates: 116000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

封裝: 356-LBGA

庫存7,232

EP1S40F1020C7N

Intel

IC FPGA 773 I/O 1020FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 3423744
Number of I/O: 773
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存6,176

EP1K30FC256-1

Intel

IC FPGA 171 I/O 256FBGA

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 171
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 256-BBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BBGA

庫存4,528

5SGSMD5H3F35I3L

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 46769152
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,112

5SGXEA5N3F45C2N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存6,592

5AGZME5K2F40C3N

Intel

IC FPGA 674 I/O 1517FBGA

Number of LABs/CLBs: 18870
Number of Logic Elements/Cells: 400000
Total RAM Bits: 34322432
Number of I/O: 674
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,808

5SGXMA7K2F40C1N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,392

5AGXFB5H4F35I5N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 19811
Number of Logic Elements/Cells: 420000
Total RAM Bits: 23625728
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA Exposed Pad

庫存3,824

5AGXBA7D4F35I5N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 11460
Number of Logic Elements/Cells: 242000
Total RAM Bits: 15470592
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA Exposed Pad

庫存5,856

EP3C55F484C7N

Intel

IC FPGA 327 I/O 484FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 327
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存4,720

EP4CE15E22C9LN

Intel

IC FPGA 81 I/O 144EQFP

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 81
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存7,408

EPM7160STC100-7N

Intel

IC CPLD 160MC 7.5NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 10
Number of Macrocells: 160
Number of Gates: 3200
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存5,984

EPM9560RC240-15

Intel

IC CPLD 560MC 15NS 240RQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 35
Number of Macrocells: 560
Number of Gates: 12000
Number of I/O: 191
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-RQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存13,128

5AGXBA5D4F35I5G

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 8962
Number of Logic Elements/Cells: 190000
Total RAM Bits: 13284352
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存6,064

5SGXMB5R3F43I3LG

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: -

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AGIB022R31B2I1V

Intel

IC FPGA AGILEX-I 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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AGID023R18A2E2VB

Intel

IC FPGA AGILEX-I 1805BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1805-BBGA Exposed Pad
Supplier Device Package: 1805-BGA (42.5x42.5)

封裝: -

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5SGXMB9R2H43I2G

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封裝: -

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