頁 25 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  25/351
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10AX115S1F45I2SGES
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存7,360
EP2A25B724C8
Intel

IC FPGA 540 I/O 724BGA

  • Number of LABs/CLBs: 2430
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 622592
  • Number of I/O: 540
  • Number of Gates: 2750000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 724-BBGA, FCBGA
  • Supplier Device Package: 724-BGA (35x35)
封裝: 724-BBGA, FCBGA
庫存7,440
hot EP1K50QC208-3N
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 147
  • Number of Gates: 199000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存8,436
hot EP1C3T100C8N
Intel

IC FPGA 65 I/O 100TQFP

  • Number of LABs/CLBs: 291
  • Number of Logic Elements/Cells: 2910
  • Total RAM Bits: 59904
  • Number of I/O: 65
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: 100-TQFP
庫存10,704
5SGSMD8K3F40C2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存7,248
5SGXMA7K2F35I3N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,544
5SGXMA4K1F35C1N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存7,888
5SGSMD4K1F40C2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 23946240
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存2,096
5SGXEA4K2F35I3LN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,104
10AX057N2F40E2SG
Intel

IC FPGA 588 I/O 1517FCBGA

  • Number of LABs/CLBs: 217080
  • Number of Logic Elements/Cells: 570000
  • Total RAM Bits: 42082304
  • Number of I/O: 588
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存7,440
10AX048E3F29E2LG
Intel

780-PIN FBGA

  • Number of LABs/CLBs: 183590
  • Number of Logic Elements/Cells: 480000
  • Total RAM Bits: 5664768
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存4,432
hot EP2SGX60EF1152I4N
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 3022
  • Number of Logic Elements/Cells: 60440
  • Total RAM Bits: 2544192
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存14,940
EP3SL50F780C2
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 2184192
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存4,288
EP3C16E144C7N
Intel

IC FPGA 84 I/O 144EQFP

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 84
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
封裝: 144-LQFP Exposed Pad
庫存5,600
EP4CE22E22C8
Intel

IC FPGA 79 I/O 144EQFP

  • Number of LABs/CLBs: 1395
  • Number of Logic Elements/Cells: 22320
  • Total RAM Bits: 608256
  • Number of I/O: 79
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
封裝: 144-LQFP Exposed Pad
庫存4,848
5AGZME3E2H29C3G
Intel

IC FPGA 342 I/O 780HBGA

  • Number of LABs/CLBs: 16980
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 23946240
  • Number of I/O: 342
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封裝: -
Request a Quote
5SGXEBBR3H43C3G
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
封裝: -
Request a Quote
5SGXEB6R3F43C3G
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
封裝: -
Request a Quote
5SGXEA5N1F45C2G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: -
Request a Quote
AGFD019R31C2E1V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封裝: -
Request a Quote
AGFA027R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
RH80536NC0171M
Intel

IC MPU 360 1.4GHZ 478PPGA

  • Core Processor: Intel® Celeron® D Processor 360
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 1.4GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.26V, 1.004V, 1.292V
  • Operating Temperature: 100°C (TJ)
  • Security Features: -
  • Package / Case: 478-PGA
  • Supplier Device Package: 478-PPGA (35x35)
封裝: -
Request a Quote
5SGXEA7K2F40C1G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
5SGXEA3K2F40C2LG
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
5SGXEA5N3F40I3LG
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
LE80536NE0251M
Intel

DOTHAN

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
GD82550GY
Intel

ETHERNET PCI CARD

  • Protocol: -
  • Function: -
  • Interface: -
  • Standards: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
AGFA023R24C2I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote