頁 21 - Intel 產品 | 黑森爾電子
聯繫我們
SalesDept@heisener.com +86-755-83210559 ext. 803
登入/註冊
Language Translation

* Please refer to the English Version as our Official Version.

BOM
購物車 0

Intel 產品

記錄 9,824
頁  21/351
圖片
零件編號
製造商
描述
封裝
庫存
數量
1SX280LU2F50E1VG
Intel

2397-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存3,856
10AS032H2F35I1HG
Intel

IC SOC FPGA 384 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存4,448
10AS032E2F29I1HG
Intel

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存7,024
EPF10K100EQC208-2N
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 624
  • Number of Logic Elements/Cells: 4992
  • Total RAM Bits: 49152
  • Number of I/O: 147
  • Number of Gates: 257000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存2,096
hot EP20K200EBC652-1X
Intel

IC FPGA 376 I/O 652BGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 376
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 652-BBGA
  • Supplier Device Package: 652-BGA (45x45)
封裝: 652-BBGA
庫存6,592
hot EP20K160EQC240-2
Intel

IC FPGA 175 I/O 240QFP

  • Number of LABs/CLBs: 640
  • Number of Logic Elements/Cells: 6400
  • Total RAM Bits: 81920
  • Number of I/O: 175
  • Number of Gates: 404000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存5,024
hot EP1S60F1508C7N
Intel

IC FPGA 1022 I/O 1508FBGA

  • Number of LABs/CLBs: 5712
  • Number of Logic Elements/Cells: 57120
  • Total RAM Bits: 5215104
  • Number of I/O: 1022
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1508-BBGA, FCBGA
  • Supplier Device Package: 1508-FBGA (30x30)
封裝: 1508-BBGA, FCBGA
庫存10,980
EP3C10F256I7
Intel

IC FPGA 182 I/O 256FBGA

  • Number of LABs/CLBs: 645
  • Number of Logic Elements/Cells: 10320
  • Total RAM Bits: 423936
  • Number of I/O: 182
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存7,488
5SGXMA7K2F35I2N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存3,344
5SGSMD6N3F45I3LN
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 54553600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存4,352
EP2S130F1508I4
Intel

IC FPGA 1126 I/O 1508FBGA

  • Number of LABs/CLBs: 6627
  • Number of Logic Elements/Cells: 132540
  • Total RAM Bits: 6747840
  • Number of I/O: 1126
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1508-BBGA, FCBGA
  • Supplier Device Package: 1508-FBGA (30x30)
封裝: 1508-BBGA, FCBGA
庫存2,976
5SGXEA5K2F35I3LN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,584
hot EP1SGX25FF1020I6N
Intel

IC FPGA 607 I/O 1020FBGA

  • Number of LABs/CLBs: 2566
  • Number of Logic Elements/Cells: 25660
  • Total RAM Bits: 1944576
  • Number of I/O: 607
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封裝: 1020-BBGA
庫存4,368
5AGXFB1H4F35I5G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 14151
  • Number of Logic Elements/Cells: 300000
  • Total RAM Bits: 17358848
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA Exposed Pad
庫存7,616
EP4SGX70DF29C4
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 2904
  • Number of Logic Elements/Cells: 72600
  • Total RAM Bits: 7564880
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存5,664
5CGTFD7C5F23C7N
Intel

IC FPGA 240 I/O 484FBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存2,384
10M16DCF484C7G
Intel

IC FPGA 320 I/O 484FBGA

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 16000
  • Total RAM Bits: 562176
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存4,032
hot EP1C6Q240I7N
Intel

IC FPGA 185 I/O 240QFP

  • Number of LABs/CLBs: 598
  • Number of Logic Elements/Cells: 5980
  • Total RAM Bits: 92160
  • Number of I/O: 185
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存15,420
5AGXA3F31I3NAC
Intel

IC FPGA 416 I/O 896FBGA

  • Number of LABs/CLBs: 56100
  • Number of Logic Elements/Cells: 148670
  • Total RAM Bits: 893952
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.12V ~ 1.18V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封裝: 896-BBGA, FCBGA
庫存2,416
NE80546KG0802MM-L8P6
Intel

LOW VOLTAGE INTEL XEON PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
QG5000P
Intel

MEMORY CONTROLLER HUB

  • Controller Type: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXMA7N3F45C3G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: -
Request a Quote
1ST280EY1F55I2LG
Intel

IC FPGA 296 I/O 2912BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封裝: -
Request a Quote
5SGXMA3K1F35I2G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
D2716
Intel

IC EPROM 16KBIT PARALLEL 24CDIP

  • Memory Type: Non-Volatile
  • Memory Format: EPROM
  • Technology: EPROM - UV
  • Memory Size: 16Kbit
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: -
  • Access Time: 450 ns
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Mounting Type: Through Hole
  • Package / Case: 24-CDIP
  • Supplier Device Package: 24-CDIP
封裝: -
Request a Quote
5ASXFB3G4F35I5G
Intel

IC SOC CORTEX-A9 800MHZ 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA, FC (35x35)
封裝: -
Request a Quote
5SGXEB6R2F40I3LG
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
5SGXEB6R2F40C3G
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote