頁 208 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
10AS066N4F40E3LG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,952
10AS032E3F27E2LG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,336
HC1S60F1020BY	Intel	IC FPGA APEX 1020FBGA Number of LABs/CLBs: 5712 Number of Logic Elements/Cells: 57120 Total RAM Bits: 5215104 Number of I/O: 782 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存4,384
10AX115U1F45I2SGES	Intel	IC FPGA 480 I/O 1932FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存5,840
EP20K1000CF672C7	Intel	IC FPGA 508 I/O 672FBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: 508 Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存5,760
5SGXEB6R2F43I2N	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存5,712
5SGXMB5R1F43C1N	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 48927744 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,480
5SGSMD8N3F45C4N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 60968960 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存4,096
EP4SGX180DF29I3	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 7030 Number of Logic Elements/Cells: 175750 Total RAM Bits: 13954048 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存6,208
5AGXFB5K4F40I5	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 19811 Number of Logic Elements/Cells: 420000 Total RAM Bits: 23625728 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA	庫存2,976
5AGTMD3G3F31I3N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 242000 Total RAM Bits: 19822592 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.12 V ~ 1.18 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存3,136
EP1SGX40GF1020C7	Intel	IC FPGA 624 I/O 1020FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 3423744 Number of I/O: 624 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存2,832
5AGXMB3G4F31C5N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存3,808
EP2SGX60EF1152C5	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 534 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,416
EP3C55U484I7N	Intel	IC FPGA 327 I/O 484UBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 327 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存5,648
EPM1270F256C3	Intel	IC CPLD 980MC 6.2NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.2ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 1270 Number of Macrocells: 980 Number of Gates: - Number of I/O: 212 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存5,232
5AGXMB3G4F40I5G	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,856
AGIB041R31B1E2VR0	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
RU82566MM	Intel	IC TXRX FULL/HALF 1/1 81BGA Type: Transceiver Protocol: IEEE 802.3 Number of Drivers/Receivers: 1/1 Duplex: Full, Half Receiver Hysteresis: 160 mV Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage - Supply: 0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 81-BGA Supplier Device Package: 81-BGA (10x10)	封裝: -	Request a Quote
5SGXMA3K2F40I3LG	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
1SG280HN3F43E2VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGXEA9N3F45I4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
5SGXEA5K2F40I2G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
NG80960JF33	Intel	RISC MPU, 32-BIT, 33MHZ PQFP132 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGIB027R29A1I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote
5SGXMA5H1F35I2G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5SGXMA4K2F35I2G	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5SGXEA7H3F35C3WN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote

10AS066N4F40E3LG

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,952

10AS032E3F27E2LG

Intel

672-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,336

HC1S60F1020BY

Intel

IC FPGA APEX 1020FBGA

Number of LABs/CLBs: 5712
Number of Logic Elements/Cells: 57120
Total RAM Bits: 5215104
Number of I/O: 782
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存4,384

10AX115U1F45I2SGES

Intel

IC FPGA 480 I/O 1932FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存5,840

EP20K1000CF672C7

Intel

IC FPGA 508 I/O 672FBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: 508
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存5,760

5SGXEB6R2F43I2N

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存5,712

5SGXMB5R1F43C1N

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 48927744
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,480

5SGSMD8N3F45C4N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 60968960
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存4,096

EP4SGX180DF29I3

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 7030
Number of Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存6,208

5AGXFB5K4F40I5

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 19811
Number of Logic Elements/Cells: 420000
Total RAM Bits: 23625728
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA

庫存2,976

5AGTMD3G3F31I3N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 242000
Total RAM Bits: 19822592
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.12 V ~ 1.18 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存3,136

EP1SGX40GF1020C7

Intel

IC FPGA 624 I/O 1020FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 3423744
Number of I/O: 624
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存2,832

5AGXMB3G4F31C5N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存3,808

EP2SGX60EF1152C5

Intel

IC FPGA 534 I/O 1152FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 534
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,416

EP3C55U484I7N

Intel

IC FPGA 327 I/O 484UBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 327
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存5,648

EPM1270F256C3

Intel

IC CPLD 980MC 6.2NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.2ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 1270
Number of Macrocells: 980
Number of Gates: -
Number of I/O: 212
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存5,232

5AGXMB3G4F40I5G

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,856

AGIB041R31B1E2VR0

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

Request a Quote

RU82566MM

Intel

IC TXRX FULL/HALF 1/1 81BGA

Type: Transceiver
Protocol: IEEE 802.3
Number of Drivers/Receivers: 1/1
Duplex: Full, Half
Receiver Hysteresis: 160 mV
Data Rate: 10Mbps, 100Mbps, 1Gbps
Voltage - Supply: 0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 81-BGA
Supplier Device Package: 81-BGA (10x10)

封裝: -

Request a Quote

5SGXMA3K2F40I3LG

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

Request a Quote

1SG280HN3F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

Request a Quote

5SGXEA9N3F45I4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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5SGXEA5K2F40I2G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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NG80960JF33

Intel

RISC MPU, 32-BIT, 33MHZ PQFP132

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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AGIB027R29A1I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

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5SGXMA5H1F35I2G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXMA4K2F35I2G

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXEA7H3F35C3WN

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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