頁 134 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  134/351
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5ASXFB5H4F40C5N
Intel

IC FPGA 528 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,088
EP1K100EFI484-2
Intel

IC FPGA

  • Number of LABs/CLBs: 624
  • Number of Logic Elements/Cells: 4992
  • Total RAM Bits: 49152
  • Number of I/O: 333
  • Number of Gates: 257000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存7,984
EPF10K30AFC256-3
Intel

IC FPGA 191 I/O 256FBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 12288
  • Number of I/O: 191
  • Number of Gates: 69000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存4,512
EPF10K200SFC484-3N
Intel

IC FPGA 369 I/O 484FBGA

  • Number of LABs/CLBs: 1248
  • Number of Logic Elements/Cells: 9984
  • Total RAM Bits: 98304
  • Number of I/O: 369
  • Number of Gates: 513000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存5,824
EPF10K100AFC484-2N
Intel

IC FPGA 369 I/O 484FBGA

  • Number of LABs/CLBs: 624
  • Number of Logic Elements/Cells: 4992
  • Total RAM Bits: 24576
  • Number of I/O: 369
  • Number of Gates: 158000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存4,080
EP20K600CF672C7
Intel

IC FPGA 508 I/O 672FBGA

  • Number of LABs/CLBs: 2432
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 311296
  • Number of I/O: 508
  • Number of Gates: 1537000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存5,936
EP20K160EBC356-1X
Intel

IC FPGA 271 I/O 356BGA

  • Number of LABs/CLBs: 640
  • Number of Logic Elements/Cells: 6400
  • Total RAM Bits: 81920
  • Number of I/O: 271
  • Number of Gates: 404000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封裝: 356-LBGA
庫存5,712
EP3C120F484C8N
Intel

IC FPGA 283 I/O 484FBGA

  • Number of LABs/CLBs: 7443
  • Number of Logic Elements/Cells: 119088
  • Total RAM Bits: 3981312
  • Number of I/O: 283
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存5,296
EP2AGX95EF35C4
Intel

IC FPGA 452 I/O 1152FBGA

  • Number of LABs/CLBs: 3747
  • Number of Logic Elements/Cells: 89178
  • Total RAM Bits: 6839296
  • Number of I/O: 452
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存6,688
10M04DAU324C8G
Intel

IC FPGA 246 I/O 324UBGA

  • Number of LABs/CLBs: 250
  • Number of Logic Elements/Cells: 4000
  • Total RAM Bits: 193536
  • Number of I/O: 246
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA
  • Supplier Device Package: 324-UBGA (15x15)
封裝: 324-LFBGA
庫存16,884
EP4CE40F23C6
Intel

IC FPGA 328 I/O 484FBGA

  • Number of LABs/CLBs: 2475
  • Number of Logic Elements/Cells: 39600
  • Total RAM Bits: 1161216
  • Number of I/O: 328
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存2,624
hot EP4CE6U14I7N
Intel

IC FPGA 179 I/O 256UBGA

  • Number of LABs/CLBs: 392
  • Number of Logic Elements/Cells: 6272
  • Total RAM Bits: 276480
  • Number of I/O: 179
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LFBGA
  • Supplier Device Package: 256-UBGA (14x14)
封裝: 256-LFBGA
庫存14,340
EPM7064BFC49-7
Intel

IC CPLD 64MC 7.5NS 49FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 41
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存3,696
EPM7128AEFC256-5
Intel

IC CPLD 128MC 5NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 100
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存7,392
hot EPM7064STC100-5
Intel

IC CPLD 64MC 5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 68
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: 100-TQFP
庫存10,392
AGIB022R31A2E2VB
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封裝: -
Request a Quote
EWIXP460BAE
Intel

IC MPU IXP460 667MHZ PBGA544

  • Core Processor: Intel® IXP46x
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: Mll (3), SMII (3)
  • SATA: -
  • USB: USB 1.1 (1), USB 2.0 (1)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: 3DES, AES, MD5, RNG, SHA1
  • Package / Case: 544-BBGA
  • Supplier Device Package: 544-PBGA (35x35)
封裝: -
Request a Quote
A5EC065BB23AE4SR0
Intel

IC

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXMA3E1H29C2G
Intel

IC FPGA 600 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封裝: -
Request a Quote
1SX085HN1F43E2LG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 850K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
5SGXMA7H2F35I3CV
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
1SG280HU3F50I3VG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封裝: -
Request a Quote
ET6160LI
Intel

IC PWR STAGE 70A FPGACORE 40LGA

  • Applications: Current Sensing, Power Management
  • Current - Supply: 30mA
  • Voltage - Supply: 4.5V ~ 16V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 39-PowerVFLGA
  • Supplier Device Package: 39-LGA (5x6)
封裝: -
Request a Quote
1SG250HN2F43I2LG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 312500
  • Number of Logic Elements/Cells: 2500000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
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P80C86A-2
Intel

IC MPU 80C86A 8MHZ 40DIP

  • Core Processor: 80C86
  • Number of Cores/Bus Width: 1 Core, 16-Bit
  • Speed: 8MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 40-DIP
  • Supplier Device Package: 40-PDIP
封裝: -
Request a Quote
AGFB006R16A3I3V
Intel

IC FPGA AGILEX-F 1546FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXMA5H1F35C1WN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
AGFA019R31C2E2V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封裝: -
Request a Quote