頁 227 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FF1136	Xilinx Inc.	FF1136 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,816
XC17S20XLPD8I	Xilinx Inc.	IC PROM PROG I-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 200kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存4,112
XCZU11EG-L2FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,768
XCZU4EG-1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,584
XCZU4CG-L2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存5,376
XCV300E-8PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 131072 Number of I/O: 158 Number of Gates: 411955 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存6,996
XCV100E-6CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 94 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存8,028
XC3120A-3PC68C	Xilinx Inc.	IC FPGA 58 I/O 68PLCC Number of LABs/CLBs: 64 Number of Logic Elements/Cells: - Total RAM Bits: 14779 Number of I/O: 58 Number of Gates: 1500 Voltage - Supply: 4.25 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23)	封裝: 68-LCC (J-Lead)	庫存6,960
XQ7VX330T-1RF1157I	Xilinx Inc.	IC FPGA VIRTEX-7 330K 1157BGA Number of LABs/CLBs: 25500 Number of Logic Elements/Cells: 326400 Total RAM Bits: 27648000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存3,264
XC6VSX315T-L1FFG1759C	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 24600 Number of Logic Elements/Cells: 314880 Total RAM Bits: 25952256 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存6,736
XC2VP50-6FFG1152I	Xilinx Inc.	IC FPGA 692 I/O 1152FCBGA Number of LABs/CLBs: 5904 Number of Logic Elements/Cells: 53136 Total RAM Bits: 4276224 Number of I/O: 692 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,112
XCKU13P-1FFVE900I	Xilinx Inc.	XCKU13P-1FFVE900I Number of LABs/CLBs: 42660 Number of Logic Elements/Cells: 746550 Total RAM Bits: 59084800 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存2,752
XCKU5P-2FFVA676E	Xilinx Inc.	XCKU5P-2FFVA676E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 35737600 Number of I/O: 256 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,240
XC4VSX35-11FF668C	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 34560 Total RAM Bits: 3538944 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存6,208
XC6VLX75T-1FFV484C	Xilinx Inc.	IC FPGA 240 I/O 484FCBGA Number of LABs/CLBs: 5820 Number of Logic Elements/Cells: 74496 Total RAM Bits: 5750784 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存6,128
XC6SLX150-3FG484I	Xilinx Inc.	IC FPGA 338 I/O 484FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 338 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存4,016
XC7K70T-1FB676I	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 5125 Number of Logic Elements/Cells: 65600 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,584
XA6SLX75-3CSG484Q	Xilinx Inc.	IC FPGA 320 I/O 484BGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 328 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-FBGA, CSPBGA	庫存7,648
XC7A75T-1FTG256C	Xilinx Inc.	IC FPGA ARTIX7 170 I/O 256FTBGA Number of LABs/CLBs: 5900 Number of Logic Elements/Cells: 75520 Total RAM Bits: 3870720 Number of I/O: 170 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,384
XC3S1400A-5FG484C	Xilinx Inc.	IC FPGA 375 I/O 484FBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 25344 Total RAM Bits: 589824 Number of I/O: 375 Number of Gates: 1400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,072
XC2S30-6VQ100C	Xilinx Inc.	IC FPGA 60 I/O 100QFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 972 Total RAM Bits: 24576 Number of I/O: 60 Number of Gates: 30000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存6,432
XC3S50-5TQG144C	Xilinx Inc.	IC FPGA 97 I/O 144TQFP Number of LABs/CLBs: 192 Number of Logic Elements/Cells: 1728 Total RAM Bits: 73728 Number of I/O: 97 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存3,184
XCKU035-1FBVA676C	Xilinx Inc.	IC FPGA 312 I/O 676FCBGA Number of LABs/CLBs: 25391 Number of Logic Elements/Cells: 444343 Total RAM Bits: 19456000 Number of I/O: 312 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,600
XC95288-20BG352I	Xilinx Inc.	IC CPLD 288MC 20NS 352BGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存3,648
XA2C384-11TQG144Q	Xilinx Inc.	IC CPLD 384MC 9.2NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.2ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 118 Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存7,152
XA9572XL-15VQG44Q	Xilinx Inc.	IC CPLD 72MC 15.5NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存14,520
XCR3128XL-10VQ100C	Xilinx Inc.	IC CPLD 128MC 9.1NS 100VQFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存15,288
XC7K70T-1FB484C	Xilinx Inc.	IC FPGA 185 I/O 484FCBGA Number of LABs/CLBs: 5125 Number of Logic Elements/Cells: 65600 Total RAM Bits: 4976640 Number of I/O: 185 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存5,984

XCMECH-FF1136

Xilinx Inc.

FF1136 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,816

XC17S20XLPD8I

Xilinx Inc.

IC PROM PROG I-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 200kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存4,112

XCZU11EG-L2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,768

XCZU4EG-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,584

XCZU4CG-L2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存5,376

XCV300E-8PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 131072
Number of I/O: 158
Number of Gates: 411955
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存6,996

XCV100E-6CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 94
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存8,028

XC3120A-3PC68C

Xilinx Inc.

IC FPGA 58 I/O 68PLCC

Number of LABs/CLBs: 64
Number of Logic Elements/Cells: -
Total RAM Bits: 14779
Number of I/O: 58
Number of Gates: 1500
Voltage - Supply: 4.25 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24.23x24.23)

封裝: 68-LCC (J-Lead)

庫存6,960

XQ7VX330T-1RF1157I

Xilinx Inc.

IC FPGA VIRTEX-7 330K 1157BGA

Number of LABs/CLBs: 25500
Number of Logic Elements/Cells: 326400
Total RAM Bits: 27648000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存3,264

XC6VSX315T-L1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 24600
Number of Logic Elements/Cells: 314880
Total RAM Bits: 25952256
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存6,736

XC2VP50-6FFG1152I

Xilinx Inc.

IC FPGA 692 I/O 1152FCBGA

Number of LABs/CLBs: 5904
Number of Logic Elements/Cells: 53136
Total RAM Bits: 4276224
Number of I/O: 692
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,112

XCKU13P-1FFVE900I

Xilinx Inc.

XCKU13P-1FFVE900I

Number of LABs/CLBs: 42660
Number of Logic Elements/Cells: 746550
Total RAM Bits: 59084800
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,752

XCKU5P-2FFVA676E

Xilinx Inc.

XCKU5P-2FFVA676E

Number of LABs/CLBs: 27120
Number of Logic Elements/Cells: 474600
Total RAM Bits: 35737600
Number of I/O: 256
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,240

XC4VSX35-11FF668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 34560
Total RAM Bits: 3538944
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存6,208

XC6VLX75T-1FFV484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

Number of LABs/CLBs: 5820
Number of Logic Elements/Cells: 74496
Total RAM Bits: 5750784
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存6,128

XC6SLX150-3FG484I

Xilinx Inc.

IC FPGA 338 I/O 484FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存4,016

XC7K70T-1FB676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Number of LABs/CLBs: 5125
Number of Logic Elements/Cells: 65600
Total RAM Bits: 4976640
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,584

XA6SLX75-3CSG484Q

Xilinx Inc.

IC FPGA 320 I/O 484BGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 328
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

庫存7,648

XC7A75T-1FTG256C

Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

Number of LABs/CLBs: 5900
Number of Logic Elements/Cells: 75520
Total RAM Bits: 3870720
Number of I/O: 170
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,384

XC3S1400A-5FG484C

Xilinx Inc.

IC FPGA 375 I/O 484FBGA

Number of LABs/CLBs: 2816
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 375
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,072

XC2S30-6VQ100C

Xilinx Inc.

IC FPGA 60 I/O 100QFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 972
Total RAM Bits: 24576
Number of I/O: 60
Number of Gates: 30000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存6,432

XC3S50-5TQG144C

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

Number of LABs/CLBs: 192
Number of Logic Elements/Cells: 1728
Total RAM Bits: 73728
Number of I/O: 97
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存3,184

XCKU035-1FBVA676C

Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

Number of LABs/CLBs: 25391
Number of Logic Elements/Cells: 444343
Total RAM Bits: 19456000
Number of I/O: 312
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,600

XC95288-20BG352I

Xilinx Inc.

IC CPLD 288MC 20NS 352BGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存3,648

XA2C384-11TQG144Q

Xilinx Inc.

IC CPLD 384MC 9.2NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 9.2ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 118
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存7,152

XA9572XL-15VQG44Q

Xilinx Inc.

IC CPLD 72MC 15.5NS 44VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 34
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存14,520

XCR3128XL-10VQ100C

Xilinx Inc.

IC CPLD 128MC 9.1NS 100VQFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存15,288

XC7K70T-1FB484C

Xilinx Inc.

IC FPGA 185 I/O 484FCBGA

Number of LABs/CLBs: 5125
Number of Logic Elements/Cells: 65600
Total RAM Bits: 4976640
Number of I/O: 185
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存5,984